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Hiromitsu Maruyama

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Adhesive sheet
    • Patent number 9,631,123
    • Issue date Apr 25, 2017
    • Furukawa Electric Co., Ltd.
    • Masami Aoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Adhesive sheet
    • Patent number 9,523,023
    • Issue date Dec 20, 2016
    • Furukawa Electric Co., Ltd.
    • Masami Aoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing tape
    • Patent number 9,324,593
    • Issue date Apr 26, 2016
    • Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer processing tape
    • Patent number 9,324,592
    • Issue date Apr 26, 2016
    • Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Semiconductor wafer processing tape
    • Patent number D628170
    • Issue date Nov 30, 2010
    • The Furukawa Electric Company
    • Hiromitsu Maruyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor wafer processing tape
    • Patent number D621803
    • Issue date Aug 17, 2010
    • The Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

  • Information Patent Application

    ADHESIVE COMPOSITION, FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USIN...
    • Publication number 20240084172
    • Publication date Mar 14, 2024
    • FURUKAWA ELECTRIC CO., LTD.
    • Minoru MORITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
    • Publication number 20220367234
    • Publication date Nov 17, 2022
    • FURUKAWA ELECTRIC CO., LTD.
    • Yota OTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
    • Publication number 20220310547
    • Publication date Sep 29, 2022
    • FURUKAWA ELECTRIC CO., LTD.
    • Minoru MORITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ADHESIVE SHEET
    • Publication number 20150017373
    • Publication date Jan 15, 2015
    • FURUKAWA ELECTRIC CO., LTD.
    • Masami AOYAMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    ADHESIVE SHEET
    • Publication number 20150017374
    • Publication date Jan 15, 2015
    • FURUKAWA ELECTRIC CO., LTD.
    • Masami AOYAMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    ADHESIVE SHEET
    • Publication number 20150017375
    • Publication date Jan 15, 2015
    • FURUKAWA ELECTRIC CO., LTD.
    • Masami AOYAMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    WAFER PROCESSING TAPE
    • Publication number 20120100325
    • Publication date Apr 26, 2012
    • Hiromitsu MARUYAMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    WAFER PROCESSING TAPE
    • Publication number 20100227165
    • Publication date Sep 9, 2010
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...