Hironori SHIMADA

Person

Toyama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 11,935,762
- Issue date Mar 19, 2024
- Kokusai Electric Corporation
- Daigi Kamimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,555,246
- Issue date Jan 17, 2023
- Kokusai Electric Corporation
- Hironori Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,450,536
- Issue date Sep 20, 2022
- Kokusai Electric Corporation
- Daigi Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boat for wafer processing apparatus
- Patent number D939459
- Issue date Dec 28, 2021
- Kokusai Electric Corporation
- Hironori Shimada
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,015,248
- Issue date May 25, 2021
- Kokusai Electric Corporation
- Hironori Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240224238
- Publication date Jul 4, 2024
- Kokusai Electric Corporation
- Daigi KAMIMURA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, NOZZLE ASSEMBLY, SUBSTRATE PROCESSI...
- Publication number 20230332290
- Publication date Oct 19, 2023
- Kokusai Electric Corporation
- Hironori SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE RETAINER, SUBSTRATE PROCESSING APPARATUS AND METHOD OF MA...
- Publication number 20230116953
- Publication date Apr 20, 2023
- Kokusai Electric Corporation
- Atsushi HIRANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, AND...
- Publication number 20230112057
- Publication date Apr 13, 2023
- Kokusai Electric Corporation
- Hironori SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20220392783
- Publication date Dec 8, 2022
- Kokusai Electric Corporation
- Daigi KAMIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COOLING METHOD, A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AN...
- Publication number 20220310420
- Publication date Sep 29, 2022
- Kokusai Electric Corporation
- Hironori SHIMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Insulation Structure, Substrate Processing Apparatus, Method o...
- Publication number 20220108900
- Publication date Apr 7, 2022
- Kokusai Electric Corporation
- Hironori SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20210305067
- Publication date Sep 30, 2021
- Kokusai Electric Corporation
- Daigi KAMIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate Processing Apparatus and Method of Manufacturing Semicond...
- Publication number 20210246554
- Publication date Aug 12, 2021
- Kokusai Electric Corporation
- Hironori SHIMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus and Reaction Tube
- Publication number 20210207265
- Publication date Jul 8, 2021
- Kokusai Electric Corporation
- Hironori SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE HOLDER
- Publication number 20210043485
- Publication date Feb 11, 2021
- Kokusai Electric Corporation
- Shuhei Saido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus and Method of Manufacturing Semicond...
- Publication number 20190360098
- Publication date Nov 28, 2019
- Kokusai Electric Corporation
- Hironori SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Hironori SHIMADA

Person

Patents Grantslast 30 patents

Substrate processing apparatus, method of manufacturing semiconduct...

Substrate processing apparatus and method of manufacturing semicond...

Substrate processing apparatus and method of manufacturing semicond...

Boat for wafer processing apparatus

Substrate processing apparatus and method of manufacturing semicond...

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING APPARATUS, NOZZLE ASSEMBLY, SUBSTRATE PROCESSI...

SUBSTRATE RETAINER, SUBSTRATE PROCESSING APPARATUS AND METHOD OF MA...

SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, AND...

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

COOLING METHOD, A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AN...

Heat Insulation Structure, Substrate Processing Apparatus, Method o...

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

Substrate Processing Apparatus and Method of Manufacturing Semicond...

Substrate Processing Apparatus and Reaction Tube

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE HOLDER

Substrate Processing Apparatus and Method of Manufacturing Semicond...