Hiroshi KAWAZOE

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Ibaraki-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 7,704,799
- Issue date Apr 27, 2010
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 7,205,645
- Issue date Apr 17, 2007
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Separator for Electrochemical Element and Fabrication Method for Same
- Publication number 20150111085
- Publication date Apr 23, 2015
- KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
- Akihiro Orita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTUR...
- Publication number 20070161228
- Publication date Jul 12, 2007
- HITACHI CHEMICAL CO., Ltd.
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, semiconductor device, and method of manufacturing wir...
- Publication number 20030141596
- Publication date Jul 31, 2003
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR