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Hiroshi Morikazu

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PROCESSING METHOD AND PROCESSING APPARATUS FOR WORKPIECE
    • Publication number 20240342832
    • Publication date Oct 17, 2024
    • Disco Corporation
    • Tsubasa HIROSE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240227083
    • Publication date Jul 11, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20240139864
    • Publication date May 2, 2024
    • Disco Corporation
    • Hiroshi MORIKAZU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240139863
    • Publication date May 2, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240131629
    • Publication date Apr 25, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20240128086
    • Publication date Apr 18, 2024
    • Disco Corporation
    • Hiroshi MORIKAZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20240123546
    • Publication date Apr 18, 2024
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIFT-OFF METHOD
    • Publication number 20240038591
    • Publication date Feb 1, 2024
    • Disco Corporation
    • Masato TERAJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20230415263
    • Publication date Dec 28, 2023
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20230415262
    • Publication date Dec 28, 2023
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20230398630
    • Publication date Dec 14, 2023
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD
    • Publication number 20230321761
    • Publication date Oct 12, 2023
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20230219169
    • Publication date Jul 13, 2023
    • Disco Corporation
    • Hiroshi MORIKAZU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHUCK TABLE AND LASER PROCESSING APPARATUS
    • Publication number 20220157638
    • Publication date May 19, 2022
    • Disco Corporation
    • Yukiyasu MASUDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20210299790
    • Publication date Sep 30, 2021
    • Disco Corporation
    • Hiroshi MORIKAZU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INSPECTION APPARATUS AND INSPECTION METHOD
    • Publication number 20210291295
    • Publication date Sep 23, 2021
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPARING METHOD AND LASER PROCESSING APPARATUS
    • Publication number 20210028071
    • Publication date Jan 28, 2021
    • Disco Corporation
    • Fumiya KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20200406394
    • Publication date Dec 31, 2020
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD
    • Publication number 20200135563
    • Publication date Apr 30, 2020
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD
    • Publication number 20200126810
    • Publication date Apr 23, 2020
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING METHOD
    • Publication number 20200126856
    • Publication date Apr 23, 2020
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE WITH LASER BEAM
    • Publication number 20190217419
    • Publication date Jul 18, 2019
    • Disco Corporation
    • Naotoshi KIRIHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF III-V COMPOUND CRYSTAL AND MANUFACTURING ME...
    • Publication number 20190088816
    • Publication date Mar 21, 2019
    • Disco Corporation
    • Yusuke Mori
    • C30 - CRYSTAL GROWTH
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190057892
    • Publication date Feb 21, 2019
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20190013636
    • Publication date Jan 10, 2019
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
    • Publication number 20190009373
    • Publication date Jan 10, 2019
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20180366362
    • Publication date Dec 20, 2018
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20180257171
    • Publication date Sep 13, 2018
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
    • Publication number 20180257174
    • Publication date Sep 13, 2018
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING METHOD FOR WAFER
    • Publication number 20180240708
    • Publication date Aug 23, 2018
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS