Hiroshi Nishizawa

Person

Kitaiabaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,560,307
- Issue date Jul 14, 2009
- Hitachi Chemical Company, Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,061,081
- Issue date Jun 13, 2006
- Hitachi Chemical Co., Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoresistance adhesive and semiconductor device using the same
- Patent number 6,372,859
- Issue date Apr 16, 2002
- Hitachi Chemical Company, Ltd.
- Touichi Sakata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive resin composition and application of its photosensit...
- Patent number 6,060,215
- Issue date May 9, 2000
- Hitachi, Ltd.
- Jin Amanokura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition
- Patent number 5,847,071
- Issue date Dec 8, 1998
- Hitachi, Chemical Co., Ltd.
- Hideo Hagiwara
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Photosensitive resin composition
- Patent number 5,668,248
- Issue date Sep 16, 1997
- Hitachi Chemical Co., Ltd.
- Hideo Hagiwara
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Purification of liquid crystals and liquid crystal composition
- Patent number 5,540,857
- Issue date Jul 30, 1996
- Hitachi Chemical Co., Ltd.
- Osamu Hirai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive resin composition
- Patent number 5,472,823
- Issue date Dec 5, 1995
- Hitachi Chemical Co., Ltd.
- Hideo Hagiwara
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Purification of liquid crystals and liquid crystal composition
- Patent number 5,422,034
- Issue date Jun 6, 1995
- Hitachi Chemical Company, Ltd.
- Osamu Hirai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integrated circuit device produced with a resin layer produced from...
- Patent number 5,164,816
- Issue date Nov 17, 1992
- Hitachi Chemical Co., Ltd.
- Hiroshi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-resistant resin paste and integrated circuit device produced b...
- Patent number 5,087,658
- Issue date Feb 11, 1992
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyamide-imide resin pastes
- Patent number 5,037,862
- Issue date Aug 6, 1991
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent-soluble polyimide and production thereof
- Patent number 4,954,612
- Issue date Sep 4, 1990
- Hitachi Chemical Co., Ltd.
- Yoshihiro Nomura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polyetheramide-imide polymer composition
- Patent number 4,791,157
- Issue date Dec 13, 1988
- Hitachi Chemical Co.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition
- Patent number 4,614,782
- Issue date Sep 30, 1986
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Insulated wire
- Patent number 4,505,980
- Issue date Mar 19, 1985
- Hitachi Chemical Co., Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing polyamide-imide resin
- Patent number 4,497,944
- Issue date Feb 5, 1985
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin and process for producing the same
- Patent number 4,448,844
- Issue date May 15, 1984
- Hitachi Chemical Co., Ltd.
- Yuichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for preparing polyamide-imide resin
- Patent number 4,447,589
- Issue date May 8, 1984
- Hitachi Chemical Co., Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition comprising reaction product of pol...
- Patent number 4,431,758
- Issue date Feb 14, 1984
- Hitachi Chemical Company, Ltd.
- Yuichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing particulate polymer having imide groups
- Patent number 4,427,822
- Issue date Jan 24, 1984
- Hitachi Chemical Co., Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyesteramides and process for producing the same
- Patent number 4,237,251
- Issue date Dec 2, 1980
- Hitachi Chemical Company, Ltd.
- Toshiaki Ishimaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Powder coating composition
- Patent number 4,119,679
- Issue date Oct 10, 1978
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20060180908
- Publication date Aug 17, 2006
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20030082925
- Publication date May 1, 2003
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Hiroshi Nishizawa

Person

Patents Grantslast 30 patents

Resin composition, heat-resistant resin paste and semiconductor dev...

Resin composition, heat-resistant resin paste and semiconductor dev...

Thermoresistance adhesive and semiconductor device using the same

Photosensitive resin composition and application of its photosensit...

Photosensitive resin composition

Photosensitive resin composition

Purification of liquid crystals and liquid crystal composition

Photosensitive resin composition

Purification of liquid crystals and liquid crystal composition

Integrated circuit device produced with a resin layer produced from...

Heat-resistant resin paste and integrated circuit device produced b...

Polyamide-imide resin pastes

Solvent-soluble polyimide and production thereof

Polyetheramide-imide polymer composition

Heat resistant resin composition

Insulated wire

Process for producing polyamide-imide resin

Heat resistant resin and process for producing the same

Method for preparing polyamide-imide resin

Heat resistant resin composition comprising reaction product of pol...

Process for producing particulate polymer having imide groups

Polyesteramides and process for producing the same

Powder coating composition

Patents Applicationslast 30 patents

Resin composition, heat-resistant resin paste and semiconductor dev...

Resin composition, heat-resistant resin paste and semiconductor dev...