Hiroshi Nomura

Person

Oyama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 7,187,072
- Issue date Mar 6, 2007
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic shield film, electromagnetic shield unit and display
- Patent number 6,884,936
- Issue date Apr 26, 2005
- Hitachi Chemical Co., Ltd.
- Hiroaki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,746,897
- Issue date Jun 8, 2004
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 6,365,432
- Issue date Apr 2, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of semiconductor package and semiconductor package
- Patent number 5,976,912
- Issue date Nov 2, 1999
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil for printed wiring board and production thereof
- Patent number 5,689,879
- Issue date Nov 25, 1997
- Hitachi Chemical Company, Ltd.
- Naoyuki Urasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil for printed wiring board and production thereof
- Patent number 5,403,672
- Issue date Apr 4, 1995
- Hitachi Chemical Co., Ltd.
- Naoyuki Urasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing flexible printed-circuit board covered with cov...
- Patent number 5,234,522
- Issue date Aug 10, 1993
- Hitachi Chemical Company, Inc.
- Masakatsu Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat resistant adhesive composition and bonding method using the same
- Patent number 5,171,826
- Issue date Dec 15, 1992
- Hitachi Chemical Company, Ltd.
- Junichi Imaizumi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat resistant adhesive composition and bonding method using the same
- Patent number 5,089,346
- Issue date Feb 18, 1992
- Hitachi Chemical Company, Ltd.
- Junichi Imaizumi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20040110319
- Publication date Jun 10, 2004
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetic shield film, electromagnetic shield unit and display
- Publication number 20040074655
- Publication date Apr 22, 2004
- Hiroaki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020094606
- Publication date Jul 18, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication process of semiconductor package and semiconductor package
- Publication number 20020039808
- Publication date Apr 4, 2002
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Nomura

Person

Patents Grantslast 30 patents

Fabrication process of semiconductor package and semiconductor package

Electromagnetic shield film, electromagnetic shield unit and display

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package

Metal foil for printed wiring board and production thereof

Metal foil for printed wiring board and production thereof

Method of producing flexible printed-circuit board covered with cov...

Heat resistant adhesive composition and bonding method using the same

Heat resistant adhesive composition and bonding method using the same

Patents Applicationslast 30 patents

Fabrication process of semiconductor package and semiconductor package

Electromagnetic shield film, electromagnetic shield unit and display

Fabrication process of semiconductor package and semiconductor package

Fabrication process of semiconductor package and semiconductor package