Hiroshi Saitoh

Person

Iwata-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,344,489
- Issue date Jan 1, 2013
- Yamaha Corporation
- Hiroshi Saitoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method for magnetic sensor and lead frame therefor
- Patent number 8,138,757
- Issue date Mar 20, 2012
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor element and wafer level chip size package therefor
- Patent number 7,830,011
- Issue date Nov 9, 2010
- Yamaha Corporation
- Kentaro Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, sensor including lead frame and method of forming senso...
- Patent number 7,829,982
- Issue date Nov 9, 2010
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing physical quantity sensor
- Patent number 7,754,130
- Issue date Jul 13, 2010
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensor and manufacturing method therefor
- Patent number 7,727,793
- Issue date Jun 1, 2010
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device production method and semiconductor device
- Patent number 7,728,445
- Issue date Jun 1, 2010
- Yamaha Corporation
- Taketoshi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,646,092
- Issue date Jan 12, 2010
- Yamaha Corporation
- Hiroshi Saitoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor and manufacturing method therefor
- Patent number 7,595,548
- Issue date Sep 29, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 7,560,811
- Issue date Jul 14, 2009
- Yamaha Corporation
- Shingo Sakakibara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and package, and method of manufacturer therefor
- Patent number 7,554,182
- Issue date Jun 30, 2009
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a magnetic sensor
- Patent number 7,541,665
- Issue date Jun 2, 2009
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method for magnetic sensor and lead frame therefor
- Patent number 7,494,838
- Issue date Feb 24, 2009
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having a lead frame smaller than a semiconduct...
- Patent number 7,192,808
- Issue date Mar 20, 2007
- Yamaha Corporation
- Hiroshi Saitoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for magnetic sensor and lead frame therefor
- Patent number 7,187,063
- Issue date Mar 6, 2007
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and package, and method of manufacture therefor
- Patent number 7,170,149
- Issue date Jan 30, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intake system-draining structure for engine
- Patent number 5,924,399
- Issue date Jul 20, 1999
- Suzuki Motor Corporation
- Yasuhiro Koike
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100072564
- Publication date Mar 25, 2010
- Yamaha Corporation
- Hiroshi Saitoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Lead frame and package of semiconductor device
- Publication number 20090243060
- Publication date Oct 1, 2009
- Yamaha Corporation
- Hiroshi Saitoh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND...
- Publication number 20090230487
- Publication date Sep 17, 2009
- Yamaha Corporation
- Hiroshi Saitoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090096041
- Publication date Apr 16, 2009
- Yamaha Corporation
- Shingo Sakakibara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device, pre-mold package, and manufacturing method th...
- Publication number 20090072334
- Publication date Mar 19, 2009
- Yamaha Corporation
- Hiroshi Saitoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Microphone package
- Publication number 20080056524
- Publication date Mar 6, 2008
- Yamaha Corporation
- Shingo Sakakibara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device
- Publication number 20070210392
- Publication date Sep 13, 2007
- Yamaha Corporation
- Shingo Sakakibara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING PHYSICAL QUANTITY SENSOR
- Publication number 20070184584
- Publication date Aug 9, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20070176272
- Publication date Aug 2, 2007
- Yamaha Corporation
- Hiroshi Saitoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070158826
- Publication date Jul 12, 2007
- Yamaha Corporation
- Shingo Sakakibara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing method for magnetic sensor and lead frame therefor
- Publication number 20070099349
- Publication date May 3, 2007
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Application
Physical quantity sensor and manufacturing method therefor
- Publication number 20070028685
- Publication date Feb 8, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and package, and method of manufacturer therefor
- Publication number 20070001275
- Publication date Jan 4, 2007
- Yamaha Corporation
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device production method and semiconductor device
- Publication number 20060244149
- Publication date Nov 2, 2006
- Yamaha Corporation
- Taketoshi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for magnetic sensor and lead frame therefor
- Publication number 20060220193
- Publication date Oct 5, 2006
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing method for physical quantity sensor using lead frame...
- Publication number 20060211176
- Publication date Sep 21, 2006
- Shiga International
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
Lead frame, sensor including lead frame and method of forming senso...
- Publication number 20060186529
- Publication date Aug 24, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
Lead frame, sensor including lead frame, resin composition to be us...
- Publication number 20060185452
- Publication date Aug 24, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- G01 - MEASURING TESTING
Information Patent Application
Physical quantity sensor and manufacturing method therefor
- Publication number 20060087006
- Publication date Apr 27, 2006
- Yamaha Corporation
- Kenichi Shirasaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20060012025
- Publication date Jan 19, 2006
- Yamaha Corporation
- Hiroshi Saitoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for magnetic sensor and lead frame therefor
- Publication number 20060006863
- Publication date Jan 12, 2006
- Yamaha Corporation
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor element and wafer level chip size package therefor
- Publication number 20050199995
- Publication date Sep 15, 2005
- Kentaro Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20040164399
- Publication date Aug 26, 2004
- Hiroshi Saitoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for magnetic sensor and lead frame therefor
- Publication number 20040103530
- Publication date Jun 3, 2004
- Hiroshi Adachi
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and package, and method of manufacture therefor
- Publication number 20020149099
- Publication date Oct 17, 2002
- Kenichi Shirasaka
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Saitoh

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Manufacturing method for magnetic sensor and lead frame therefor

Semiconductor element and wafer level chip size package therefor

Lead frame, sensor including lead frame and method of forming senso...

Method for manufacturing physical quantity sensor

Physical quantity sensor and manufacturing method therefor

Semiconductor device production method and semiconductor device

Semiconductor device and manufacturing method thereof

Physical quantity sensor and manufacturing method therefor

Semiconductor device

Semiconductor device and package, and method of manufacturer therefor

Lead frame for a magnetic sensor

Manufacturing method for magnetic sensor and lead frame therefor

Semiconductor device having a lead frame smaller than a semiconduct...

Manufacturing method for magnetic sensor and lead frame therefor

Semiconductor device and package, and method of manufacture therefor

Intake system-draining structure for engine

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Lead frame and package of semiconductor device

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND...

SEMICONDUCTOR DEVICE

Semiconductor device, pre-mold package, and manufacturing method th...

Microphone package

Semiconductor device

METHOD FOR MANUFACTURING PHYSICAL QUANTITY SENSOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Manufacturing method for magnetic sensor and lead frame therefor

Physical quantity sensor and manufacturing method therefor

Semiconductor device and package, and method of manufacturer therefor

Semiconductor device production method and semiconductor device

Manufacturing method for magnetic sensor and lead frame therefor

Manufacturing method for physical quantity sensor using lead frame...

Lead frame, sensor including lead frame and method of forming senso...

Lead frame, sensor including lead frame, resin composition to be us...

Physical quantity sensor and manufacturing method therefor

Semiconductor device and manufacturing method therefor

Manufacturing method for magnetic sensor and lead frame therefor

Semiconductor element and wafer level chip size package therefor

Semiconductor device and manufacturing method therefor

Manufacturing method for magnetic sensor and lead frame therefor

Semiconductor device and package, and method of manufacture therefor