Hiroshi Segawa

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,066,439
- Issue date Jun 23, 2015
- Ibiden Co., Ltd.
- Hiroshi Segawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing interposer
- Patent number 8,997,344
- Issue date Apr 7, 2015
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,188,378
- Issue date May 29, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,178,790
- Issue date May 15, 2012
- Ibiden Co., Ltd.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,173,907
- Issue date May 8, 2012
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multilayered printed circuit board and manufacturing method thereof
- Patent number 8,148,643
- Issue date Apr 3, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and method for manufacturing interposer
- Patent number 8,058,563
- Issue date Nov 15, 2011
- Ibiden Co., Ltd.
- Hajime Sakamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing a multilayered printed circuit board
- Patent number 7,832,098
- Issue date Nov 16, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and its manufacturing method, and r...
- Patent number RE40947
- Issue date Oct 27, 2009
- Ibiden Co., Ltd.
- Motoo Asai
- 428 - Stock material or miscellaneous articles
Information Patent Grant
Method of manufacturing multilayered circuit board
- Patent number 7,415,761
- Issue date Aug 26, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a multilayered printed circuit board having...
- Patent number 6,591,495
- Issue date Jul 15, 2003
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and its manufacturing method, and r...
- Patent number 6,376,049
- Issue date Apr 23, 2002
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and its production process, resin c...
- Patent number 6,376,052
- Issue date Apr 23, 2002
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130014982
- Publication date Jan 17, 2013
- IBIDEN CO., LTD.
- Hiroshi SEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20110265323
- Publication date Nov 3, 2011
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20110265324
- Publication date Nov 3, 2011
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090231827
- Publication date Sep 17, 2009
- IBIDEN CO., LTD.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090173522
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090175023
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER
- Publication number 20090173530
- Publication date Jul 9, 2009
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ASSOCIATED MANUFACTURING METHOD
- Publication number 20090120677
- Publication date May 14, 2009
- IBIDEN CO., LTD.
- Toshihiro NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080189943
- Publication date Aug 14, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080173473
- Publication date Jul 24, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20040025333
- Publication date Feb 12, 2004
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20010042637
- Publication date Nov 22, 2001
- Naohiro Hirose
- H01 - BASIC ELECTRIC ELEMENTS

Hiroshi Segawa

Person

Patents Grantslast 30 patents

Wiring board and method for manufacturing the same

Method for manufacturing interposer

Interposer and method for manufacturing interposer

Interposer and method for manufacturing interposer

Interposer and method for manufacturing interposer

Multilayered printed circuit board and manufacturing method thereof

Interposer and method for manufacturing interposer

Method of manufacturing a multilayered printed circuit board

Multilayer printed wiring board and its manufacturing method, and r...

Method of manufacturing multilayered circuit board

Manufacturing method of a multilayered printed circuit board having...

Multilayer printed wiring board and its manufacturing method, and r...

Multilayer printed wiring board and its production process, resin c...

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

WIRING SUBSTRATE AND ASSOCIATED MANUFACTURING METHOD

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Multilayered printed circuit board and manufacturing method therefor

Multilayered printed circuit board and manufacturing method therefor