Hiroto Ohtake

Person

Kurokawa-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma etching method
- Patent number 9,570,312
- Issue date Feb 14, 2017
- Tokyo Electron Limited
- Ryohei Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively removing a region formed of silicon oxide and...
- Patent number 9,502,537
- Issue date Nov 22, 2016
- Tokyo Electron Limited
- Akinori Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 9,412,607
- Issue date Aug 9, 2016
- Tokyo Electron Limited
- Tomiko Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer film etching method and plasma processing apparatus
- Patent number 9,373,520
- Issue date Jun 21, 2016
- Tokyo Electron Limited
- Shota Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method
- Patent number 9,305,795
- Issue date Apr 5, 2016
- Tokyo Electron Limited
- Tomiko Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 9,105,585
- Issue date Aug 11, 2015
- Tokyo Electron Limited
- Hironori Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 9,087,798
- Issue date Jul 21, 2015
- Tokyo Electron Limited
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,034,698
- Issue date May 19, 2015
- Tokyo Electron Limited
- Toshihisa Ozu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry metal etching method
- Patent number 8,808,562
- Issue date Aug 19, 2014
- Tokyo Electron Limited
- Yusuke Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of reducing interelectrode leak curren...
- Patent number 8,803,285
- Issue date Aug 12, 2014
- Renesas Electronics Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly selective spacer etch process with reduced sidewall spacer s...
- Patent number 8,664,125
- Issue date Mar 4, 2014
- Tokyo Electron Limited
- Angelique Denise Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method for manufacturing the same
- Patent number 8,592,303
- Issue date Nov 26, 2013
- Renesas Electronics Corporation
- Munehiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,278,763
- Issue date Oct 2, 2012
- NEC Corporation
- Munehiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,043,957
- Issue date Oct 25, 2011
- NEC Corporation
- Munehiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring structure, semiconductor device, pattern transfer...
- Patent number 7,999,392
- Issue date Aug 16, 2011
- Renesas Electronics Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method for manufacturing the same
- Patent number 7,701,060
- Issue date Apr 20, 2010
- NEC Corporation
- Munehiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and having trench interconnection
- Patent number 7,622,808
- Issue date Nov 24, 2009
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 7,482,694
- Issue date Jan 27, 2009
- NEC Coporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device capable of etching a...
- Patent number 6,972,453
- Issue date Dec 6, 2005
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plasma treatment and apparatus for plasma treatment
- Patent number 6,054,063
- Issue date Apr 25, 2000
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER FILM ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20150140822
- Publication date May 21, 2015
- TOKYO ELECTRON LIMITED
- Shota YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING METHOD
- Publication number 20150099366
- Publication date Apr 9, 2015
- TOKYO ELECTRON LIMITED
- Ryohei Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVELY REMOVING A REGION FORMED OF SILICON OXIDE AND...
- Publication number 20150064922
- Publication date Mar 5, 2015
- TOKYO ELECTRON LIMITED
- Akinori KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20150064926
- Publication date Mar 5, 2015
- TOKYO ELECTRON LIMITED
- Tomiko Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20150056773
- Publication date Feb 26, 2015
- TOKYO ELECTRON LIMITED
- Toshihisa Ozu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20150044877
- Publication date Feb 12, 2015
- TOKYO ELECTRON LIMITED
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING METHOD
- Publication number 20140332372
- Publication date Nov 13, 2014
- TOKYO ELECTRON LIMITED
- Tomiko Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20140308817
- Publication date Oct 16, 2014
- Hironori Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY SELECTIVE SPACER ETCH PROCESS WITH REDUCED SIDEWALL SPACER S...
- Publication number 20130164940
- Publication date Jun 27, 2013
- TOKYO ELECTRON LIMITED
- Angélique Denise RALEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY METAL ETCHING METHOD
- Publication number 20130065398
- Publication date Mar 14, 2013
- TOKYO ELECTRON LIMITED
- Yusuke OHSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120013023
- Publication date Jan 19, 2012
- NEC Corporation
- Munehiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A DUAL DAMASCENE MULTILAYER INTERCONNECTION AND...
- Publication number 20110316161
- Publication date Dec 29, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroto OHTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100151675
- Publication date Jun 17, 2010
- NEC Corporation
- Munehiro TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20090267198
- Publication date Oct 29, 2009
- NEC Corporation
- Munehiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING MULTILAYER INTERCONNECTION AND MULTILAYER INTER...
- Publication number 20090014887
- Publication date Jan 15, 2009
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Wiring Structure, Semiconductor Device, Pattern Transfer...
- Publication number 20080136043
- Publication date Jun 12, 2008
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF REDUCING INTERELECTRODE LEAK CURREN...
- Publication number 20070262417
- Publication date Nov 15, 2007
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure and method for manufacturing the same
- Publication number 20070013069
- Publication date Jan 18, 2007
- Munehiro Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having trench interconnection and manufacturin...
- Publication number 20060131754
- Publication date Jun 22, 2006
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20050253272
- Publication date Nov 17, 2005
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device capable of etching a...
- Publication number 20020155639
- Publication date Oct 24, 2002
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS

Hiroto Ohtake

Person

Patents Grantslast 30 patents

Plasma etching method

Method of selectively removing a region formed of silicon oxide and...

Plasma etching method

Multilayer film etching method and plasma processing apparatus

Plasma processing method

Etching method

Etching method

Semiconductor device manufacturing method

Dry metal etching method

Semiconductor device capable of reducing interelectrode leak curren...

Highly selective spacer etch process with reduced sidewall spacer s...

Wiring structure and method for manufacturing the same

Semiconductor device

Semiconductor device, method for manufacturing semiconductor device...

Multilayer wiring structure, semiconductor device, pattern transfer...

Wiring structure and method for manufacturing the same

Semiconductor device and having trench interconnection

Semiconductor device and its manufacturing method

Method of manufacturing a semiconductor device capable of etching a...

Method for plasma treatment and apparatus for plasma treatment

Patents Applicationslast 30 patents

MULTILAYER FILM ETCHING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA ETCHING METHOD

METHOD OF SELECTIVELY REMOVING A REGION FORMED OF SILICON OXIDE AND...

PLASMA PROCESSING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

ETCHING METHOD

PLASMA ETCHING METHOD

ETCHING METHOD

HIGHLY SELECTIVE SPACER ETCH PROCESS WITH REDUCED SIDEWALL SPACER S...

DRY METAL ETCHING METHOD

SEMICONDUCTOR DEVICE

METHOD OF PRODUCING A DUAL DAMASCENE MULTILAYER INTERCONNECTION AND...

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

METHOD OF PRODUCING MULTILAYER INTERCONNECTION AND MULTILAYER INTER...

Multilayer Wiring Structure, Semiconductor Device, Pattern Transfer...

SEMICONDUCTOR DEVICE CAPABLE OF REDUCING INTERELECTRODE LEAK CURREN...

Wiring structure and method for manufacturing the same

Semiconductor device having trench interconnection and manufacturin...

Semiconductor device and its manufacturing method

Method of manufacturing a semiconductor device capable of etching a...