Hiroyasu Iimori

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,921,428
- Issue date Mar 5, 2024
- Kioxia Corporation
- Yoshihiro Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and manufacturing method of s...
- Patent number 11,508,574
- Issue date Nov 22, 2022
- Kioxia Corporation
- Hiroyasu Iimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treatment apparatus and substrate treatment method
- Patent number 10,453,729
- Issue date Oct 22, 2019
- TOSHIBA MEMORY CORPORATION
- Tatsuhiko Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dust collecting apparatus, substrate processing system, and method...
- Patent number 10,290,490
- Issue date May 14, 2019
- TOSHIBA MEMORY CORPORATION
- Tomohiko Sugita
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Substrate treatment apparatus and substrate treatment method
- Patent number 10,199,209
- Issue date Feb 5, 2019
- TOSHIBA MEMORY CORPORATION
- Tomohiko Sugita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor manu...
- Patent number 9,514,952
- Issue date Dec 6, 2016
- Kabushiki Kaisha Toshiba
- Hiroyasu Iimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 9,213,242
- Issue date Dec 15, 2015
- Kabushiki Kaisha Toshiba
- Yoshihiro Uozumi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of treating a semiconductor substrate
- Patent number 7,985,683
- Issue date Jul 26, 2011
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of treating surface of semiconductor substrate
- Patent number 7,838,425
- Issue date Nov 23, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Etching apparatus, a method of controlling an etching solution, and...
- Patent number 7,776,756
- Issue date Aug 17, 2010
- Kabushiki Kaisha Toshiba
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of treating a semiconductor substrate
- Patent number 7,749,909
- Issue date Jul 6, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device using etching solution
- Patent number 7,727,871
- Issue date Jun 1, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching apparatus, a method of controlling an etching solution, and...
- Patent number 7,267,742
- Issue date Sep 11, 2007
- Kabushiki Kaisha Toshiba
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and apparatus for semiconductor wafers
- Patent number 7,097,784
- Issue date Aug 29, 2006
- Kabushiki Kaisha Toshiba
- Yoshihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER TRANSFER CARRIER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240087931
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Satoshi NAKAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230072887
- Publication date Mar 9, 2023
- KIOXIA Corporation
- Fuyuma ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20220181171
- Publication date Jun 9, 2022
- KIOXIA Corporation
- Yoshihiro UOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF S...
- Publication number 20210066076
- Publication date Mar 4, 2021
- Kioxia Corporation
- Hiroyasu IIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20190214277
- Publication date Jul 11, 2019
- Toshiba Memory Corporation
- Yoshihiro Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
- Publication number 20190080947
- Publication date Mar 14, 2019
- Toshiba Memory Corporation
- Tatsuhiko Koide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT APPARATUS AND MANUFACTURING METHOD OF SEMICONDU...
- Publication number 20180233383
- Publication date Aug 16, 2018
- Toshiba Memory Corporation
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...
- Publication number 20160071738
- Publication date Mar 10, 2016
- KABUSHIKI KAISHA TOSHIBA
- Hiroyasu Iimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20130273744
- Publication date Oct 17, 2013
- Kabushiki Kaisha Toshiba
- Hiroaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20130008868
- Publication date Jan 10, 2013
- Yoshihiro UOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE CLEANING METHOD USING BUBBLE/CHEMICAL MIXED...
- Publication number 20110088731
- Publication date Apr 21, 2011
- Kabushiki Kaisha Toshiba
- Hiroshi TOMITA
- B08 - CLEANING
Information Patent Application
Method of treating a semiconductor substrate
- Publication number 20100240219
- Publication date Sep 23, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING APPARATUS, A METHOD OF CONTROLLING AN ETCHING SOLUTION, AND...
- Publication number 20100210110
- Publication date Aug 19, 2010
- Kabushiki Kaisha Toshiba
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TREATING A SEMICONDUCTOR SUBSTRATE
- Publication number 20100075504
- Publication date Mar 25, 2010
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
- Publication number 20100044343
- Publication date Feb 25, 2010
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER, SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
- Publication number 20090317980
- Publication date Dec 24, 2009
- Kabushiki Kaisha Toshiba
- Hiroyasu Iimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE
- Publication number 20090311874
- Publication date Dec 17, 2009
- Hiroshi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20090250431
- Publication date Oct 8, 2009
- Minako INUKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE CLEANING METHOD USING BUBBLE/CHEMICAL MIXED...
- Publication number 20080308132
- Publication date Dec 18, 2008
- Hiroshi Tomita
- B08 - CLEANING
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20080064212
- Publication date Mar 13, 2008
- Yoshihiro Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Manufacturing method of semiconductor device and etching solution
- Publication number 20070224792
- Publication date Sep 27, 2007
- Hiroshi Tomita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Etching method and apparatus for semiconductor wafers
- Publication number 20060255014
- Publication date Nov 16, 2006
- Kabushiki Kaisha Toshiba
- Yoshihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate processing apparatus and semiconductor devi...
- Publication number 20060081335
- Publication date Apr 20, 2006
- Hiroyasu Iimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching apparatus, a method of controlling an etching solution, and...
- Publication number 20050230045
- Publication date Oct 20, 2005
- Hisashi Okuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filter, substrate treatment apparatus and substrate treatment method
- Publication number 20050211378
- Publication date Sep 29, 2005
- Hiroyasu Iimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching method and apparatus for semiconductor wafers
- Publication number 20040157452
- Publication date Aug 12, 2004
- Yoshihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyasu Iimori

Person

Patents Grantslast 30 patents

Substrate processing method and substrate processing apparatus

Semiconductor manufacturing apparatus and manufacturing method of s...

Substrate treatment apparatus and substrate treatment method

Dust collecting apparatus, substrate processing system, and method...

Substrate treatment apparatus and substrate treatment method

Method of manufacturing semiconductor device and semiconductor manu...

Substrate processing method and substrate processing apparatus

Method of treating a semiconductor substrate

Method of treating surface of semiconductor substrate

Etching apparatus, a method of controlling an etching solution, and...

Method of treating a semiconductor substrate

Manufacturing method of semiconductor device using etching solution

Etching apparatus, a method of controlling an etching solution, and...

Etching method and apparatus for semiconductor wafers

Patents Applicationslast 30 patents

WAFER TRANSFER CARRIER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF S...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

SUBSTRATE TREATMENT APPARATUS AND MANUFACTURING METHOD OF SEMICONDU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR SUBSTRATE CLEANING METHOD USING BUBBLE/CHEMICAL MIXED...

Method of treating a semiconductor substrate

ETCHING APPARATUS, A METHOD OF CONTROLLING AN ETCHING SOLUTION, AND...

METHOD OF TREATING A SEMICONDUCTOR SUBSTRATE

SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

FILTER, SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD

METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR SUBSTRATE CLEANING METHOD USING BUBBLE/CHEMICAL MIXED...

Method of manufacturing semiconductor device

Manufacturing method of semiconductor device and etching solution

Etching method and apparatus for semiconductor wafers

Semiconductor substrate processing apparatus and semiconductor devi...

Etching apparatus, a method of controlling an etching solution, and...

Filter, substrate treatment apparatus and substrate treatment method

Etching method and apparatus for semiconductor wafers