Hiroyuki Fujishima

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Hsinchu County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip-middle type fan-out panel-level package and packaging method t...
- Patent number 12,094,809
- Issue date Sep 17, 2024
- Powertech Technology Inc.
- Hiroyuki Fujishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,553,036
- Issue date Jan 24, 2017
- Powertech Technology Inc.
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-MIDDLE TYPE FAN-OUT PANEL-LEVEL PACKAGE AND PACKAGING METHOD T...
- Publication number 20230207434
- Publication date Jun 29, 2023
- Powertech Technology Inc.
- Hiroyuki FUJISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200343184
- Publication date Oct 29, 2020
- Powertech Technology Inc.
- Hiroyuki Fujishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20190013283
- Publication date Jan 10, 2019
- Powertech Technology Inc.
- HIROYUKI FUJISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170084513
- Publication date Mar 23, 2017
- Powertech Technology Inc.
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170011983
- Publication date Jan 12, 2017
- Powertech Technology Inc.
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS