Hiroyuki NAGATOMO

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Insulating substrate and semiconductor device using same
- Patent number 10,559,509
- Issue date Feb 11, 2020
- Hitachi Metals, Ltd.
- Hiroshi Hozoji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit substrate for semiconductor package with multiple circuit s...
- Patent number 9,773,738
- Issue date Sep 26, 2017
- Hitachi Metals, Ltd.
- Yutaka Uematsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING SUBSTRATE WAFER, MULTILAYER CERAMIC SUBSTRATE, MOUNTING SU...
- Publication number 20190318988
- Publication date Oct 17, 2019
- Hitachi Metals, Ltd.
- Hiroyuki NAGATOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20190221489
- Publication date Jul 18, 2019
- Hitachi Metals, Ltd.
- Hiroshi HOZOJI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MOUNTING SUBSTRATE WAFER, MULTILAYER CERAMIC SUBSTRATE, MOUNTING SU...
- Publication number 20160211205
- Publication date Jul 21, 2016
- Hitachi Metals, Ltd.
- Hiroyuki NAGATOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND CIRCUIT SUBSTRATE FOR THE SEMICONDUCTOR P...
- Publication number 20160099197
- Publication date Apr 7, 2016
- HITACHI METALS, LTD
- Yutaka UEMATSU
- H01 - BASIC ELECTRIC ELEMENTS