Hiroyuki Shigeta

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, imaging device, and method of manufacturing s...
- Patent number 12,132,061
- Issue date Oct 29, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Tsuyoshi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, imaging apparatus, and method for manufacturi...
- Patent number 11,942,495
- Issue date Mar 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Daisuke Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package for improving freedom of arrangement of...
- Patent number 10,714,402
- Issue date Jul 14, 2020
- Sony Corporation
- Hiroyuki Shigeta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lead frame, semiconductor package having the same and method for ma...
- Patent number 6,319,749
- Issue date Nov 20, 2001
- Sony Corporation
- Hiroyuki Shigeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor package having a lead frame
- Patent number 6,107,678
- Issue date Aug 22, 2000
- Sony Corporation
- Hiroyuki Shigeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,054,773
- Issue date Apr 25, 2000
- Sony Corporation
- Kenji Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and integrated circuit package using the lead frame
- Patent number 5,812,381
- Issue date Sep 22, 1998
- Sony Corporation
- Hiroyuki Shigeta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230298955
- Publication date Sep 21, 2023
- SONY GROUP CORPORATION
- Shigekazu ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230125605
- Publication date Apr 27, 2023
- Sony Semiconductor Solutions Corporation
- YUTO TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURI...
- Publication number 20220262841
- Publication date Aug 18, 2022
- Sony Semiconductor Solutions Corporation
- HIROYUKI SHIGETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND METHOD OF MANUFACTURING S...
- Publication number 20220139979
- Publication date May 5, 2022
- Sony Semiconductor Solutions Corporation
- TSUYOSHI WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, IMAGING APPARATUS, AND METHOD FOR MANUFACTURI...
- Publication number 20210233949
- Publication date Jul 29, 2021
- Sony Semiconductor Solutions Corporation
- DAISUKE CHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE
- Publication number 20190139843
- Publication date May 9, 2019
- SONY CORPORATION
- HIROYUKI SHIGETA
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki Shigeta

Person

Patents Grantslast 30 patents

Semiconductor device, imaging device, and method of manufacturing s...

Semiconductor device, imaging apparatus, and method for manufacturi...

Semiconductor chip package for improving freedom of arrangement of...

Lead frame, semiconductor package having the same and method for ma...

Lead frame and semiconductor package having a lead frame

Semiconductor device and method of manufacturing the same

Lead frame and integrated circuit package using the lead frame

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND METHOD OF MANUFACTURING S...

SEMICONDUCTOR DEVICE, IMAGING APPARATUS, AND METHOD FOR MANUFACTURI...

SEMICONDUCTOR CHIP PACKAGE