Hiroyuki Takasaka

Follow

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board and method of making the same
- Patent number 8,178,191
- Issue date May 15, 2012
- Hitachi Cable, Ltd.
- Shigeo Nishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for sticking an insulating film to a lead frame
- Patent number RE37323
- Issue date Aug 14, 2001
- Hitachi Cable Ltd.
- Toshio Kawamura
- 156 - Adhesive bonding and miscellaneous chemical manufacture
Information Patent Grant
Insulating film with improved punching characteristics and lead fra...
- Patent number 5,837,368
- Issue date Nov 17, 1998
- Hitachi Cable, Ltd.
- Toshikatsu Hiroe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sticking an insulating film to a lead frame
- Patent number 5,635,009
- Issue date Jun 3, 1997
- Hitachi Cable Ltd.
- Toshio Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating film with improved punching characteristics and lead fra...
- Patent number 5,593,774
- Issue date Jan 14, 1997
- Hitachi Cable, Ltd.
- Toshikatsu Hiroe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD AND METHOD OF MAKING THE SAME
- Publication number 20090151990
- Publication date Jun 18, 2009
- HITACHI CABLE, LTD.
- Shigeo NISHINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR