Hiroyuki YAMAKAWA

Person

Kariya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Synthetic resin molded article and method for producing the same
- Patent number 10,696,544
- Issue date Jun 30, 2020
- Denso Corporation
- Motomi Ishikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resin molded body
- Patent number 10,446,458
- Issue date Oct 15, 2019
- Denso Corporation
- Hiroyuki Yamakawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Manufacturing method of a resin molded article
- Patent number 10,395,947
- Issue date Aug 27, 2019
- Denso Corporation
- Tomoyuki Harada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device including bonded wire based to electronic part...
- Patent number 6,731,001
- Issue date May 4, 2004
- Denso Corporation
- Kan Kinouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing resin-sealed electronic device
- Patent number 5,946,554
- Issue date Aug 31, 1999
- Denso Corporation
- Masashi Echigo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN METAL JOINT AND PRESSURE SENSOR
- Publication number 20190232617
- Publication date Aug 1, 2019
- DENSO CORPORATION
- Motomi ISHIKAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SYNTHETIC RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING THE SAME
- Publication number 20190161339
- Publication date May 30, 2019
- Denso Corporation
- Motomi ISHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING RESIN MOLDED BODY
- Publication number 20190091907
- Publication date Mar 28, 2019
- Denso Corporation
- Hodaka MORI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN MOLDED BODY
- Publication number 20180315675
- Publication date Nov 1, 2018
- Denso Corporation
- Hiroyuki YAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING SAME
- Publication number 20180154562
- Publication date Jun 7, 2018
- Denso Corporation
- Hiroyuki YAMAKAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN MOLDED ARTICLE, AND MANUFACTURING METHOD FOR SAME
- Publication number 20160336199
- Publication date Nov 17, 2016
- DENSO CORPORATION
- Tomoyuki HARADA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device including bonding wire bonded to electronic pa...
- Publication number 20020020910
- Publication date Feb 21, 2002
- Kan Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki YAMAKAWA

Person

Patents Grantslast 30 patents

Synthetic resin molded article and method for producing the same

Resin molded body

Manufacturing method of a resin molded article

Semiconductor device including bonded wire based to electronic part...

Method of producing resin-sealed electronic device

Patents Applicationslast 30 patents

RESIN METAL JOINT AND PRESSURE SENSOR

SYNTHETIC RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING THE SAME

METHOD FOR PRODUCING RESIN MOLDED BODY

RESIN MOLDED BODY

RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING SAME

RESIN MOLDED ARTICLE, AND MANUFACTURING METHOD FOR SAME

Semiconductor device including bonding wire bonded to electronic pa...