Hitoshi Hoshino

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method
- Patent number 10,211,076
- Issue date Feb 19, 2019
- Disco Corporation
- Toshio Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate manufacturing method, semiconductor element man...
- Patent number 9,455,229
- Issue date Sep 27, 2016
- Namiki Seimitsu Houseki Kabushiki Kaisha
- Hideo Aida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing light-emitting element, and light-emitting...
- Patent number 9,065,032
- Issue date Jun 23, 2015
- NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Splitting method for optical device wafer
- Patent number 8,946,056
- Issue date Feb 3, 2015
- Disco Corporation
- Hiroumi Ueno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sapphire wafer dividing method
- Patent number 8,673,695
- Issue date Mar 18, 2014
- Disco Corporation
- Takashi Okamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sapphire wafer dividing method
- Patent number 8,518,730
- Issue date Aug 27, 2013
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for wafer
- Patent number 8,497,189
- Issue date Jul 30, 2013
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device and manufacturing method thereof
- Patent number 8,318,518
- Issue date Nov 27, 2012
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing optical device wafer
- Patent number 8,048,780
- Issue date Nov 1, 2011
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing machine
- Patent number 8,049,134
- Issue date Nov 1, 2011
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing optical device wafer
- Patent number 7,977,215
- Issue date Jul 12, 2011
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Working method for an optical device wafer
- Patent number 7,745,311
- Issue date Jun 29, 2010
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device wafer dividing method
- Patent number 7,662,700
- Issue date Feb 16, 2010
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for laser processing of wafer
- Patent number 7,396,780
- Issue date Jul 8, 2008
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 7,134,942
- Issue date Nov 14, 2006
- Disco Corporation
- Yusuke Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LSI package and internal connecting method used therefor
- Patent number 6,653,168
- Issue date Nov 25, 2003
- NEC Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI package with internal wire patterns to connect and mount bare c...
- Patent number 6,538,310
- Issue date Mar 25, 2003
- NEC Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hand-held mobile phone terminal
- Patent number 6,061,579
- Issue date May 9, 2000
- Advanced Space Communications Research Laboratory
- Hiroyuki Arai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,242,838
- Issue date Sep 7, 1993
- NEC Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170301571
- Publication date Oct 19, 2017
- Disco Corporation
- Toshio Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CRYSTAL SUBSTRATE, MANUFACTURING METHOD FOR SINGLE CRYSTAL S...
- Publication number 20160265140
- Publication date Sep 15, 2016
- NAMIKI SEIMITSU HOUSEKI KABUSHIKI KAISHA
- Hideo AIDA
- C30 - CRYSTAL GROWTH
Information Patent Application
COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...
- Publication number 20150076662
- Publication date Mar 19, 2015
- NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT, AND LIGHT-EMITTING...
- Publication number 20140217458
- Publication date Aug 7, 2014
- DISCO CORPORATION
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD FOR WAFER
- Publication number 20130189806
- Publication date Jul 25, 2013
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE CRYSTAL SUBSTRATE, MANUFACTURING METHOD FOR SINGLE CRYSTAL S...
- Publication number 20130161797
- Publication date Jun 27, 2013
- Disco Corporation
- Hideo Aida
- C30 - CRYSTAL GROWTH
Information Patent Application
INTERNALLY REFORMED SUBSTRATE FOR EPITAXIAL GROWTH, INTERNALLY REFO...
- Publication number 20130161794
- Publication date Jun 27, 2013
- Disco Corporation
- Hideo Aida
- C30 - CRYSTAL GROWTH
Information Patent Application
SINGLE CRYSTAL SUBSTRATE WITH MULTILAYER FILM, MANUFACTURING METHOD...
- Publication number 20130082358
- Publication date Apr 4, 2013
- Disco Corporation
- Hideo Aida
- C30 - CRYSTAL GROWTH
Information Patent Application
CRYSTALLINE FILM, DEVICE, AND MANUFACTURING METHODS FOR CRYSTALLINE...
- Publication number 20130062734
- Publication date Mar 14, 2013
- Disco Corporation
- Hideo Aida
- C30 - CRYSTAL GROWTH
Information Patent Application
SPLITTING METHOD FOR OPTICAL DEVICE WAFER
- Publication number 20120289026
- Publication date Nov 15, 2012
- Disco Corporation
- Hiroumi Ueno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAPPHIRE WAFER DIVIDING METHOD
- Publication number 20120156816
- Publication date Jun 21, 2012
- Disco Corporation
- Takashi Okamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAPPHIRE WAFER DIVIDING METHOD
- Publication number 20120083059
- Publication date Apr 5, 2012
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSIDE REFORMING SUBSTRATE FOR EPITAXIAL GROWTH; CRYSTAL FILM FORMI...
- Publication number 20120018732
- Publication date Jan 26, 2012
- Disco Corporation
- Hideo Aida
- C30 - CRYSTAL GROWTH
Information Patent Application
LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110133235
- Publication date Jun 9, 2011
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKING METHOD FOR AN OPTICAL DEVICE WAFER
- Publication number 20100047999
- Publication date Feb 25, 2010
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING OPTICAL DEVICE WAFER
- Publication number 20100041210
- Publication date Feb 18, 2010
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING OPTICAL DEVICE WAFER
- Publication number 20100035408
- Publication date Feb 11, 2010
- Disco Corporation
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL DEVICE WAFER DIVIDING METHOD
- Publication number 20090311848
- Publication date Dec 17, 2009
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING MACHINE
- Publication number 20080290078
- Publication date Nov 27, 2008
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Workpiece dividing method utilizing laser beam
- Publication number 20080128953
- Publication date Jun 5, 2008
- Yusuke Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of processing sapphire substrate
- Publication number 20080003708
- Publication date Jan 3, 2008
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer laser processing method and laser beam processing machine
- Publication number 20060255022
- Publication date Nov 16, 2006
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of laser processing a gallium nitride substrate
- Publication number 20060099774
- Publication date May 11, 2006
- DISCO CORPORATION
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for laser processing of wafer
- Publication number 20060094260
- Publication date May 4, 2006
- DISCO CORPORATION
- Hitoshi Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser processing method
- Publication number 20060035411
- Publication date Feb 16, 2006
- DISCO CORPORATION
- Ryugo Oba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer processing method
- Publication number 20050155954
- Publication date Jul 21, 2005
- DISCO CORPORATION
- Ryugo Oba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer processing method
- Publication number 20050059325
- Publication date Mar 17, 2005
- Yusuke Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Workpiece dividing method utilizing laser beam
- Publication number 20040232124
- Publication date Nov 25, 2004
- Yusuke Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LSI package and internal connecting method used therefor
- Publication number 20030122234
- Publication date Jul 3, 2003
- NEC Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LSI package and internal connecting method used therefor
- Publication number 20010050426
- Publication date Dec 13, 2001
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS

Hitoshi Hoshino

Person

Patents Grantslast 30 patents

Wafer processing method

Composite substrate manufacturing method, semiconductor element man...

Method for manufacturing light-emitting element, and light-emitting...

Splitting method for optical device wafer

Sapphire wafer dividing method

Sapphire wafer dividing method

Processing method for wafer

Light emitting device and manufacturing method thereof

Method of processing optical device wafer

Laser processing machine

Method of processing optical device wafer

Working method for an optical device wafer

Optical device wafer dividing method

Method for laser processing of wafer

Wafer processing method

LSI package and internal connecting method used therefor

LSI package with internal wire patterns to connect and mount bare c...

Hand-held mobile phone terminal

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

WAFER PROCESSING METHOD

SINGLE CRYSTAL SUBSTRATE, MANUFACTURING METHOD FOR SINGLE CRYSTAL S...

COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...

METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT, AND LIGHT-EMITTING...

PROCESSING METHOD FOR WAFER

SINGLE CRYSTAL SUBSTRATE, MANUFACTURING METHOD FOR SINGLE CRYSTAL S...

INTERNALLY REFORMED SUBSTRATE FOR EPITAXIAL GROWTH, INTERNALLY REFO...

SINGLE CRYSTAL SUBSTRATE WITH MULTILAYER FILM, MANUFACTURING METHOD...

CRYSTALLINE FILM, DEVICE, AND MANUFACTURING METHODS FOR CRYSTALLINE...

SPLITTING METHOD FOR OPTICAL DEVICE WAFER

SAPPHIRE WAFER DIVIDING METHOD

SAPPHIRE WAFER DIVIDING METHOD

INSIDE REFORMING SUBSTRATE FOR EPITAXIAL GROWTH; CRYSTAL FILM FORMI...

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

WORKING METHOD FOR AN OPTICAL DEVICE WAFER

METHOD OF PROCESSING OPTICAL DEVICE WAFER

METHOD OF PROCESSING OPTICAL DEVICE WAFER

OPTICAL DEVICE WAFER DIVIDING METHOD

LASER PROCESSING MACHINE

Workpiece dividing method utilizing laser beam

Method of processing sapphire substrate

Wafer laser processing method and laser beam processing machine

Method of laser processing a gallium nitride substrate

Method for laser processing of wafer

Laser processing method

Semiconductor wafer processing method

Wafer processing method

Workpiece dividing method utilizing laser beam

LSI package and internal connecting method used therefor

LSI package and internal connecting method used therefor