Hitoshi Suzuki

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fine pattern mold
- Patent number 8,387,255
- Issue date Mar 5, 2013
- Hitachi Industrial Equipment Systems Co., Ltd.
- Masahiko Ogino
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fine pattern mold
- Patent number 8,083,515
- Issue date Dec 27, 2011
- Hitachi Industrial Equipment Systems, Co., Ltd.
- Masahiko Ogino
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Metal structure and method of its production
- Patent number 7,922,887
- Issue date Apr 12, 2011
- Hitachi, Ltd.
- Toshio Haba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thin-film multilayer wiring board with wiring and via holes in a th...
- Patent number 6,326,561
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Ryuji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film multilayer wiring board and production thereof
- Patent number 6,190,493
- Issue date Feb 20, 2001
- Hitachi, Ltd.
- Ryuji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production process thereof, as well as wir...
- Patent number 4,976,393
- Issue date Dec 11, 1990
- Hitachi, Ltd.
- Makoto Nakajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of metallizing sintered ceramics
- Patent number 4,409,079
- Issue date Oct 11, 1983
- Hitachi, Ltd.
- Kunio Miyazaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for pressure bonding metal members by utilizing eutectic rea...
- Patent number 4,331,286
- Issue date May 25, 1982
- Hitachi, Ltd.
- Kunio Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FINE PATTERN MOLD
- Publication number 20120067507
- Publication date Mar 22, 2012
- Masahiko Ogino
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC CIRCUIT COMPONENT AND METHOD FOR MANUFACTURING SAME
- Publication number 20110114368
- Publication date May 19, 2011
- Hiroshi Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100181100
- Publication date Jul 22, 2010
- HITACHI CABLE, LTD.
- Hiroshi NAKANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRODUCTION METHOD FOR WIRING AND VIAS
- Publication number 20090057156
- Publication date Mar 5, 2009
- HITACHI CABLE, LTD.
- Toshio Haba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Fine Pattern Mold and Method for Producing the Same
- Publication number 20080299247
- Publication date Dec 4, 2008
- Masahiko Ogino
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Wiring Board and Production Method Thereof
- Publication number 20080251387
- Publication date Oct 16, 2008
- Toshio Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF CONDUCTIVE PATTERN
- Publication number 20070287289
- Publication date Dec 13, 2007
- Toshio Haba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal structure and method of its production
- Publication number 20060180472
- Publication date Aug 17, 2006
- Toshio Haba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Wiring board and production method thereof
- Publication number 20060163725
- Publication date Jul 27, 2006
- Toshio Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hitoshi Suzuki

Person

Patents Grantslast 30 patents

Fine pattern mold

Fine pattern mold

Metal structure and method of its production

Thin-film multilayer wiring board with wiring and via holes in a th...

Thin-film multilayer wiring board and production thereof

Semiconductor device and production process thereof, as well as wir...

Method of metallizing sintered ceramics

Method for pressure bonding metal members by utilizing eutectic rea...

Patents Applicationslast 30 patents

FINE PATTERN MOLD

ELECTRONIC CIRCUIT COMPONENT AND METHOD FOR MANUFACTURING SAME

COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRODUCTION METHOD FOR WIRING AND VIAS

Fine Pattern Mold and Method for Producing the Same

Wiring Board and Production Method Thereof

PRODUCTION METHOD OF CONDUCTIVE PATTERN

Metal structure and method of its production

Wiring board and production method thereof