HO-JEONG MOON

Person

Daejeon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
X-ray system, semiconductor package, and tray having X-ray absorpti...
- Patent number 11,217,495
- Issue date Jan 4, 2022
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- G01 - MEASURING TESTING
Information Patent Grant
Passive nitrogen injecting device for nuclear reactor coolant pump
- Patent number 10,249,394
- Issue date Apr 2, 2019
- KOREA HYDRO & NUCLEAR POWER CO., LTD.
- Ho Rim Moon
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
X-ray system, semiconductor package, and tray having X-ray absorpti...
- Patent number 9,728,293
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Adhesion test method using elastic plate
- Patent number 8,448,506
- Issue date May 28, 2013
- Samsung Electronics Co., Ltd.
- Yeo-Hoon Yoon
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board having a heating means and a hermetically sealed mult...
- Patent number 7,692,291
- Issue date Apr 6, 2010
- Samsung Electronics Co., Ltd.
- Ho-Jeong Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having thermal interface material (TIM)
- Patent number 7,081,375
- Issue date Jul 25, 2006
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array attaching means having improved reliability and met...
- Patent number 6,963,033
- Issue date Nov 8, 2005
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having thermal interface material (TIM)
- Patent number 6,756,668
- Issue date Jun 29, 2004
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow solder structure having improved reliability and method of m...
- Patent number 6,638,638
- Issue date Oct 28, 2003
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REACTOR COOLING SYSTEM FOR DISASTER ACCIDENT, AND REACTOR COOLING M...
- Publication number 20230307150
- Publication date Sep 28, 2023
- KOREA HYDRO & NUCLEAR POWER CO., LTD.
- Ho Rim MOON
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
SYSTEM FOR UTILIZING UNUSED HEAT-EXCHANGE WATER OF PASSIVE AUXILIAR...
- Publication number 20230290529
- Publication date Sep 14, 2023
- KOREA HYDRO & NUCLEAR POWER CO., LTD.
- Ho Rim MOON
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
PASSIVE CONDENSATION TANK COOLING SYSTEM OF PASSIVE AUXILIARY FEEDW...
- Publication number 20230268089
- Publication date Aug 24, 2023
- KOREA HYDRO & NUCLEAR POWER CO., LTD.
- Ho Rim MOON
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...
- Publication number 20200402864
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- SANG-YOUNG KIM
- G01 - MEASURING TESTING
Information Patent Application
X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...
- Publication number 20170301591
- Publication date Oct 19, 2017
- Samsung Electronics Co., Ltd.
- SANG-YOUNG KIM
- G01 - MEASURING TESTING
Information Patent Application
PASSIVE NITROGEN INJECTING DEVICE FOR NUCLEAR REACTOR COOLANT PUMP
- Publication number 20170062082
- Publication date Mar 2, 2017
- KOREA HYDRO & NUCLEAR POWER CO., LTD
- Ho Rim MOON
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
OUTLET NOZZLE OF NUCLEAR REACTOR
- Publication number 20160042818
- Publication date Feb 11, 2016
- KOREA HYDRO & NUCLEAR POWER CO., LTD.
- Ho Rim MOON
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...
- Publication number 20150103974
- Publication date Apr 16, 2015
- SANG-YOUNG KIM
- G01 - MEASURING TESTING
Information Patent Application
ADHESION TEST METHOD USING ELASTIC PLATE
- Publication number 20100206062
- Publication date Aug 19, 2010
- Samsung Electronics Co., Ltd.
- Yeo-Hoon YOON
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF CONDUCTING PRECONDITIONED RELIABILITY TEST OF SEMICONDUCT...
- Publication number 20100177165
- Publication date Jul 15, 2010
- Samsung Electronics Co., Ltd.
- Hye-Kyong Oh
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor packages and electronic products employing the same
- Publication number 20090146300
- Publication date Jun 11, 2009
- Se-Young Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a solder ball on a board and the board
- Publication number 20060035453
- Publication date Feb 16, 2006
- Seung-Woo Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package having thermal interface material (TIM)
- Publication number 20040197948
- Publication date Oct 7, 2004
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package with soft element and method of manufacturing th...
- Publication number 20040163843
- Publication date Aug 26, 2004
- Dong-Kil Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having thermal interface material (TIM)
- Publication number 20030080411
- Publication date May 1, 2003
- Samsung Electronics Co., Ltd.
- Joong-Hyun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array attaching means having improved reliability and met...
- Publication number 20030051909
- Publication date Mar 20, 2003
- Sang-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW SOLDER STRUCTURE HAVING IMPROVED RELIABILITY AND METHOD OF M...
- Publication number 20030052156
- Publication date Mar 20, 2003
- Sang-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board having a heating means and a hermetically sealed mult...
- Publication number 20020158330
- Publication date Oct 31, 2002
- Ho-Jeong Moon
- H01 - BASIC ELECTRIC ELEMENTS

HO-JEONG MOON

Person

Patents Grantslast 30 patents

X-ray system, semiconductor package, and tray having X-ray absorpti...

Passive nitrogen injecting device for nuclear reactor coolant pump

X-ray system, semiconductor package, and tray having X-ray absorpti...

Adhesion test method using elastic plate

Circuit board having a heating means and a hermetically sealed mult...

Semiconductor package having thermal interface material (TIM)

Ball grid array attaching means having improved reliability and met...

Semiconductor package having thermal interface material (TIM)

Hollow solder structure having improved reliability and method of m...

Patents Applicationslast 30 patents

REACTOR COOLING SYSTEM FOR DISASTER ACCIDENT, AND REACTOR COOLING M...

SYSTEM FOR UTILIZING UNUSED HEAT-EXCHANGE WATER OF PASSIVE AUXILIAR...

PASSIVE CONDENSATION TANK COOLING SYSTEM OF PASSIVE AUXILIARY FEEDW...

X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...

X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...

PASSIVE NITROGEN INJECTING DEVICE FOR NUCLEAR REACTOR COOLANT PUMP

OUTLET NOZZLE OF NUCLEAR REACTOR

X-RAY SYSTEM, SEMICONDUCTOR PACKAGE, AND TRAY HAVING X-RAY ABSORPTI...

ADHESION TEST METHOD USING ELASTIC PLATE

METHOD OF CONDUCTING PRECONDITIONED RELIABILITY TEST OF SEMICONDUCT...

Semiconductor packages and electronic products employing the same

Method of forming a solder ball on a board and the board

Semiconductor package having thermal interface material (TIM)

Multi-chip package with soft element and method of manufacturing th...

Semiconductor package having thermal interface material (TIM)

Ball grid array attaching means having improved reliability and met...

HOLLOW SOLDER STRUCTURE HAVING IMPROVED RELIABILITY AND METHOD OF M...

Circuit board having a heating means and a hermetically sealed mult...