Ho-Ming Tong

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coated means for connecting a chip and a card
- Patent number 6,403,892
- Issue date Jun 11, 2002
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated solder terminal
- Patent number 5,629,564
- Issue date May 13, 1997
- International Business Machines Corporation
- Henry A. Nye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying flex tape protective coating onto a flex product
- Patent number 5,546,655
- Issue date Aug 20, 1996
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated solder terminal
- Patent number 5,503,286
- Issue date Apr 2, 1996
- International Business Machines Corporation
- Henry A. Nye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex tape protective coating
- Patent number 5,360,946
- Issue date Nov 1, 1994
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate multiple location conductor attachment technology
- Patent number 5,322,204
- Issue date Jun 21, 1994
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a reworkable module
- Patent number 5,274,913
- Issue date Jan 4, 1994
- International Business Machines Corporation
- Kurt R. Grebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for an electronic device
- Patent number 5,245,136
- Issue date Sep 14, 1993
- International Business Machines Corporation
- Dudley A. Chance
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate multiple location conductor attachment technology
- Patent number 5,233,221
- Issue date Aug 3, 1993
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding dielectric mounted conductors to semiconductor c...
- Patent number 5,229,328
- Issue date Jul 20, 1993
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for an electronic device and method of manufacturi...
- Patent number 5,194,196
- Issue date Mar 16, 1993
- International Business Machines Corporation
- Dudley A. Chance
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of resiliently mounting an integrated circuit chip to enable...
- Patent number 5,169,805
- Issue date Dec 8, 1992
- International Business Machines Corporation
- Lawrence S. Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for an electronic device and method of manufacturi...
- Patent number 5,169,310
- Issue date Dec 8, 1992
- International Business Machines Corp.
- Dudley A. Chance
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate multiple location conductor attachment technology
- Patent number 5,117,275
- Issue date May 26, 1992
- International Business Machines Corporation
- Mark F. Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and heat sink assembly
- Patent number 5,057,909
- Issue date Oct 15, 1991
- International Business Machines Corporation
- Lawrence S. Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for temperature control of electronic devices
- Patent number 4,970,868
- Issue date Nov 20, 1990
- International Business Machines Corporation
- Kurt R. Grebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the production of void-free prepreg sheets
- Patent number 4,690,836
- Issue date Sep 1, 1987
- International Business Machines Corp.
- Thomas C. Clarke
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Ho-Ming Tong

Person

Patents Grantslast 30 patents

Coated means for connecting a chip and a card

Electroplated solder terminal

Method of applying flex tape protective coating onto a flex product

Electroplated solder terminal

Flex tape protective coating

Electronic substrate multiple location conductor attachment technology

Method of fabricating a reworkable module

Hermetic package for an electronic device

Electronic substrate multiple location conductor attachment technology

Method for bonding dielectric mounted conductors to semiconductor c...

Hermetic package for an electronic device and method of manufacturi...

Method of resiliently mounting an integrated circuit chip to enable...

Hermetic package for an electronic device and method of manufacturi...

Electronic substrate multiple location conductor attachment technology

Electronic device and heat sink assembly

Apparatus for temperature control of electronic devices

Process for the production of void-free prepreg sheets