Ho-Yu LAI

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New Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating metal-insulator-metal capacitor
- Patent number 11,784,214
- Issue date Oct 10, 2023
- United Microelectronics Corp.
- Bo-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor and method for fabricating the same
- Patent number 11,469,294
- Issue date Oct 11, 2022
- United Microelectronics Corp.
- Bo-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PATTERN AND METHOD OF ROUNDING THE SAME
- Publication number 20240266286
- Publication date Aug 8, 2024
- UNITED MICROELECTRONICS CORP.
- Bo-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220416013
- Publication date Dec 29, 2022
- United Microelectronics Corp.
- Bo-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20210288138
- Publication date Sep 16, 2021
- United Microelectronics Corp.
- Bo-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS