Hoe Jian Chong

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Quad package with conductive clips connected to terminals at upper...
- Patent number 11,217,511
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZ...
- Publication number 20230197585
- Publication date Jun 22, 2023
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230197586
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad Package with Conductive Clips Connected to Terminals at Upper...
- Publication number 20200328140
- Publication date Oct 15, 2020
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS