Holman Chen

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Ground-enhanced semiconductor package and lead frame for the same
- Patent number 7,230,323
- Issue date Jun 12, 2007
- Siliconware Precision Industries Co., Ltd.
- Yi-Shiung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding method and semiconductor package using the same
- Patent number 7,126,229
- Issue date Oct 24, 2006
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame-based semiconductor package and fabrication method thereof
- Patent number 7,008,826
- Issue date Mar 7, 2006
- Siliconware Precision Industries, Co., Ltd.
- Holman Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame-based semiconductor package and fabrication method thereof
- Patent number 6,806,565
- Issue date Oct 19, 2004
- Siliconware Precision Industries Co., Ltd.
- Holman Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire-bonding method and semiconductor package using the same
- Publication number 20070007669
- Publication date Jan 11, 2007
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method and semiconductor package using the same
- Publication number 20050173791
- Publication date Aug 11, 2005
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame-based semiconductor package and fabrication method thereof
- Publication number 20050029639
- Publication date Feb 10, 2005
- Holman Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ground-enhanced semiconductor package and lead frame for the same
- Publication number 20040238921
- Publication date Dec 2, 2004
- Silicon Precision Industries Co., Ltd
- Yi-Shiung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe-based non-leaded semiconductor package and method of fabr...
- Publication number 20040217450
- Publication date Nov 4, 2004
- Siliconware Precision Industries Co., Ltd.
- Chun-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame-based semiconductor package and fabrication method thereof
- Publication number 20040004275
- Publication date Jan 8, 2004
- Siliconware Precision Industries Co., Ltd.
- Holman Chen
- H01 - BASIC ELECTRIC ELEMENTS

Holman Chen

Person

Patents Grantslast 30 patents

Ground-enhanced semiconductor package and lead frame for the same

Wire-bonding method and semiconductor package using the same

Lead-frame-based semiconductor package and fabrication method thereof

Lead-frame-based semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

Wire-bonding method and semiconductor package using the same

Wire-bonding method and semiconductor package using the same

Lead-frame-based semiconductor package and fabrication method thereof

Ground-enhanced semiconductor package and lead frame for the same

Leadframe-based non-leaded semiconductor package and method of fabr...

Lead-frame-based semiconductor package and fabrication method thereof