Homer Glascock

Person

Millis, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor power pack
- Patent number 6,060,795
- Issue date May 9, 2000
- Intersil Corporation
- James K. Azotea
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of packaging a semiconductor device
- Patent number 5,577,656
- Issue date Nov 26, 1996
- Harris Corporation
- Victor A. K. Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for parallel subelement semiconductor devices
- Patent number 5,473,193
- Issue date Dec 5, 1995
- Harris Corporation
- Victor A. K. Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for a high power semiconductor device
- Patent number 5,446,316
- Issue date Aug 29, 1995
- Harris Corporation
- Victor A. K. Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct thermocompression bonding for thin electronic power chips
- Patent number 5,304,847
- Issue date Apr 19, 1994
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package and packaged semiconductor chip having closely spa...
- Patent number 5,209,390
- Issue date May 11, 1993
- General Electric Company
- Victor A. K. Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor electrical contacts using metal fo...
- Patent number 5,206,186
- Issue date Apr 27, 1993
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct thermocompression bonding for thin electronic power chips
- Patent number 5,184,206
- Issue date Feb 2, 1993
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package and packaged semiconductor chip having closely spa...
- Patent number 5,166,773
- Issue date Nov 24, 1992
- General Electric Company
- Victor A. K. Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a hermetic package having a lead extending throug...
- Patent number 5,135,890
- Issue date Aug 4, 1992
- General Electric Company
- Victor A. K. Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a silicon package for a power semiconductor device
- Patent number 5,133,795
- Issue date Jul 28, 1992
- General Electric Company
- Homer H. Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a semiconductor chip in a low inductance package
- Patent number 5,105,536
- Issue date Apr 21, 1992
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package having a lead extending through an aperture in the...
- Patent number 5,103,290
- Issue date Apr 7, 1992
- General Electric Company
- Victor A. K. Temple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded symmetric-metallic-laminate/substrate structures
- Patent number 5,100,740
- Issue date Mar 31, 1992
- General Electric Company
- Constantine A. Neugebauer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding a silicon package for a power semiconductor device
- Patent number 5,034,044
- Issue date Jul 23, 1991
- General Electric Company
- Homer H. Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current hermetic package having a lead extending through the p...
- Patent number 5,028,987
- Issue date Jul 2, 1991
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making direct bonded wafers having a void free interface
- Patent number 4,939,101
- Issue date Jul 3, 1990
- General Electric Company
- Robert D. Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cure monitoring apparatus having high temperature ultrasonic transd...
- Patent number 4,921,415
- Issue date May 1, 1990
- General Electric Company
- Lewis J. Thomas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multi-chip interconnection package
- Patent number 4,901,136
- Issue date Feb 13, 1990
- General Electric Company
- Constantine A. Neugebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible glass fiber mat bonding method
- Patent number 4,828,597
- Issue date May 9, 1989
- General Electric Company
- Homer H. Glascock
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Temperature compensated piezoelectric transducer assembly
- Patent number 4,825,117
- Issue date Apr 25, 1989
- General Electric Company
- Lewis J. Thomas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multilayer circuit board fabricated from silicon
- Patent number 4,803,450
- Issue date Feb 7, 1989
- General Electric Company
- James F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon packages for power semiconductor devices
- Patent number 4,745,455
- Issue date May 17, 1988
- General Electric Company
- Homer H. Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thyristor packaging system
- Patent number 4,574,299
- Issue date Mar 4, 1986
- General Electric Company
- Homer H. Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss, multilevel silicon circuit board
- Patent number 4,541,035
- Issue date Sep 10, 1985
- General Electric Company
- Richard O. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thermo-compression diffusion bonding together metal surfaces
- Patent number 4,444,352
- Issue date Apr 24, 1984
- General Electric Company
- Homer H. Glascock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooled semiconductor power module including structured strain buffe...
- Patent number 4,392,153
- Issue date Jul 5, 1983
- General Electric Company
- Homer H. Glascock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bond testing of semiconductor devices
- Patent number 4,366,713
- Issue date Jan 4, 1983
- General Electric Company
- Robert S. Gilmore
- G01 - MEASURING TESTING
Information Patent Grant
Fluid cooled solar powered photovoltaic cell
- Patent number 4,361,717
- Issue date Nov 30, 1982
- General Electric Company
- Robert S. Gilmore
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Reflective coating for external core electrodeless fluorescent lamp
- Patent number 4,117,378
- Issue date Sep 26, 1978
- General Electric Company
- Homer H. Glascock
- H01 - BASIC ELECTRIC ELEMENTS

Homer Glascock

Person

Patents Grantslast 30 patents

Semiconductor power pack

Method of packaging a semiconductor device

Package for parallel subelement semiconductor devices

Hermetic package for a high power semiconductor device

Direct thermocompression bonding for thin electronic power chips

Hermetic package and packaged semiconductor chip having closely spa...

Method for forming semiconductor electrical contacts using metal fo...

Direct thermocompression bonding for thin electronic power chips

Hermetic package and packaged semiconductor chip having closely spa...

Method of forming a hermetic package having a lead extending throug...

Method of making a silicon package for a power semiconductor device

Method of packaging a semiconductor chip in a low inductance package

Hermetic package having a lead extending through an aperture in the...

Direct bonded symmetric-metallic-laminate/substrate structures

Method of bonding a silicon package for a power semiconductor device

High current hermetic package having a lead extending through the p...

Method of making direct bonded wafers having a void free interface

Cure monitoring apparatus having high temperature ultrasonic transd...

Multi-chip interconnection package

Flexible glass fiber mat bonding method

Temperature compensated piezoelectric transducer assembly

Multilayer circuit board fabricated from silicon

Silicon packages for power semiconductor devices

Thyristor packaging system

Low loss, multilevel silicon circuit board

Method of thermo-compression diffusion bonding together metal surfaces

Cooled semiconductor power module including structured strain buffe...

Ultrasonic bond testing of semiconductor devices

Fluid cooled solar powered photovoltaic cell

Reflective coating for external core electrodeless fluorescent lamp