Hong Bok We

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) package employing added metal for embedded...
- Patent number 12,100,645
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circular bond finger pad
- Patent number 12,021,063
- Issue date Jun 25, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects in a core layer configured for s...
- Patent number 11,955,409
- Issue date Apr 9, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid package apparatus and method of fabricating
- Patent number 11,948,877
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal connection routing and method the same
- Patent number 11,832,391
- Issue date Nov 28, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with a substrate comprising pad-on-pad interconnects
- Patent number 11,823,983
- Issue date Nov 21, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal mitigation die using back side etch
- Patent number 11,817,365
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-sided antenna module employing antennas on multiple sides of...
- Patent number 11,804,645
- Issue date Oct 31, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising passive component between substrates for improve...
- Patent number 11,791,276
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a package substrate with...
- Patent number 11,791,320
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer connection
- Patent number 11,784,151
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising protruding pad interconnects
- Patent number 11,776,888
- Issue date Oct 3, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structures adapted to electronic device heights in integrat...
- Patent number 11,749,579
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising periphery interconnects
- Patent number 11,749,611
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable dielectric constant materials in same layer of a package
- Patent number 11,715,688
- Issue date Aug 1, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having a substrate comprising surface interconnects aligned...
- Patent number 11,682,607
- Issue date Jun 20, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module
- Patent number 11,658,391
- Issue date May 23, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with local high-density routing region embedded within an...
- Patent number 11,605,595
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die interconnect
- Patent number 11,594,491
- Issue date Feb 28, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a die and die side redistribution layers (RDL)
- Patent number 11,581,262
- Issue date Feb 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising inter-substrate gradient interconnect structure
- Patent number 11,581,251
- Issue date Feb 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and interconnect device configured f...
- Patent number 11,562,962
- Issue date Jan 24, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising a high-density interconnect portion embedded i...
- Patent number 11,552,015
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects embedded in a solder resist layer
- Patent number 11,551,939
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising an integrated device coupled to a substrate thro...
- Patent number 11,545,439
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double sided embedded trace substrate
- Patent number 11,545,435
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects embedded in a solder resist layer
- Patent number 11,545,425
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising multi-level vertically stacked redistribution po...
- Patent number 11,502,049
- Issue date Nov 15, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing split, double-sided meta...
- Patent number 11,456,291
- Issue date Sep 27, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate with interconnect routing over solde...
- Patent number 11,444,019
- Issue date Sep 13, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...
- Publication number 20240371737
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
- Publication number 20240373560
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE
- Publication number 20240371775
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A PACKAGE SUBSTRATE THAT INCLUDES AN ENCAPSULATE...
- Publication number 20240363513
- Publication date Oct 31, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A PACKAGE SUBSTRATE THAT INCLUDES AN ENCAPSULATE...
- Publication number 20240363514
- Publication date Oct 31, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...
- Publication number 20240355712
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING METAL POSTS THERMALLY COU...
- Publication number 20240332146
- Publication date Oct 3, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION...
- Publication number 20240321709
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS
- Publication number 20240321763
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE
- Publication number 20240321752
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT PAD WITH TEST LINE
- Publication number 20240304503
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH SOLDER RESIST POSTS
- Publication number 20240274516
- Publication date Aug 15, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES
- Publication number 20240276739
- Publication date Aug 15, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL POCKET FANOUT PACKAGE
- Publication number 20240194545
- Publication date Jun 13, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A FLEXIBLE SUBSTRATE
- Publication number 20240105687
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
- Publication number 20240105568
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A FIRST SUBSTRATE, A SECOND SUBSTRATE AND AN ELE...
- Publication number 20240063195
- Publication date Feb 22, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION P...
- Publication number 20240047335
- Publication date Feb 8, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
- Publication number 20240038753
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING WIRE BOND CHANNEL OVER P...
- Publication number 20240006369
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES EMPLOYING PAD METALLIZATION LAYER FOR INCREASED...
- Publication number 20230307336
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED ESCAPE INTERCONNECTS A...
- Publication number 20230282585
- Publication date Sep 7, 2023
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS AND A SOLDER...
- Publication number 20230230908
- Publication date Jul 20, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INT...
- Publication number 20230163113
- Publication date May 25, 2023
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH...
- Publication number 20230163112
- Publication date May 25, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESS STRUCTURE FOR PADLESS STACK VIA
- Publication number 20230154829
- Publication date May 18, 2023
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ADDED METAL FOR EMBEDDED...
- Publication number 20230086094
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SIDED ANTENNA MODULE EMPLOYING ANTENNAS ON MULTIPLE SIDES OF...
- Publication number 20230083146
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES
- Publication number 20230036650
- Publication date Feb 2, 2023
- QUALCOMM Incorporated
- Yuan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2...
- Publication number 20230035627
- Publication date Feb 2, 2023
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS

Hong Bok We

Person

Patents Grantslast 30 patents

Integrated circuit (IC) package employing added metal for embedded...

Circular bond finger pad

Substrate comprising interconnects in a core layer configured for s...

Hybrid package apparatus and method of fabricating

Terminal connection routing and method the same

Package with a substrate comprising pad-on-pad interconnects

Thermal mitigation die using back side etch

Multi-sided antenna module employing antennas on multiple sides of...

Package comprising passive component between substrates for improve...

Integrated circuit (IC) packages employing a package substrate with...

Redistribution layer connection

Package with a substrate comprising protruding pad interconnects

Thermal structures adapted to electronic device heights in integrat...

Package with a substrate comprising periphery interconnects

Variable dielectric constant materials in same layer of a package

Package having a substrate comprising surface interconnects aligned...

Antenna module

Packages with local high-density routing region embedded within an...

Multi-die interconnect

Package comprising a die and die side redistribution layers (RDL)

Package comprising inter-substrate gradient interconnect structure

Package comprising a substrate and interconnect device configured f...

Substrate comprising a high-density interconnect portion embedded i...

Substrate comprising interconnects embedded in a solder resist layer

Package comprising an integrated device coupled to a substrate thro...

Double sided embedded trace substrate

Substrate comprising interconnects embedded in a solder resist layer

Package comprising multi-level vertically stacked redistribution po...

Integrated circuit (IC) packages employing split, double-sided meta...

Package comprising a substrate with interconnect routing over solde...

Patents Applicationslast 30 patents

PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...

ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE

PACKAGE COMPRISING A PACKAGE SUBSTRATE THAT INCLUDES AN ENCAPSULATE...

PACKAGE COMPRISING A PACKAGE SUBSTRATE THAT INCLUDES AN ENCAPSULATE...

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING METAL POSTS THERMALLY COU...

PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION...

PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS

PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE

SPLIT PAD WITH TEST LINE

INTERPOSER WITH SOLDER RESIST POSTS

DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES

METAL POCKET FANOUT PACKAGE

PACKAGE COMPRISING A FLEXIBLE SUBSTRATE

PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS

PACKAGE COMPRISING A FIRST SUBSTRATE, A SECOND SUBSTRATE AND AN ELE...

PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION P...

DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING WIRE BOND CHANNEL OVER P...

PACKAGE SUBSTRATES EMPLOYING PAD METALLIZATION LAYER FOR INCREASED...

PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED ESCAPE INTERCONNECTS A...

PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS AND A SOLDER...

PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INT...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH...

RECESS STRUCTURE FOR PADLESS STACK VIA

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ADDED METAL FOR EMBEDDED...

MULTI-SIDED ANTENNA MODULE EMPLOYING ANTENNAS ON MULTIPLE SIDES OF...

SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES

SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2...