Hongbo ZHANG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module using lead frame for power and control termina...
- Patent number 10,373,899
- Issue date Aug 6, 2019
- Mitsubishi Electric Corporation
- Hongbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,324,685
- Issue date Apr 26, 2016
- Mitsubishi Electric Corporation
- Hongbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,230,891
- Issue date Jan 5, 2016
- Mitsubishi Electric Corporation
- Hongbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20240258254
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Yuki TERADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240030085
- Publication date Jan 25, 2024
- Mitsubishi Electric Corporation
- Hongbo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE USING LEAD FRAME FOR POWER AND CONTROL TERMINA...
- Publication number 20190198431
- Publication date Jun 27, 2019
- Mitsubishi Electric Corporation
- Hongbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160064353
- Publication date Mar 3, 2016
- Mitsubishi Electric Corporation
- Hongbo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150084173
- Publication date Mar 26, 2015
- Mitsubishi Electric Corporation
- Hongbo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS