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Hongchao Yang

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  • Shanghai, CN
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
    • Publication number 20240279838
    • Publication date Aug 22, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Hui Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
    • Publication number 20240183051
    • Publication date Jun 6, 2024
    • ACM Research (Shanghai) Inc.
    • Zhaowei JIA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
    • Publication number 20240044038
    • Publication date Feb 8, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Hui Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    CUP-SHAPED CHUCK OF SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING...
    • Publication number 20240035189
    • Publication date Feb 1, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Hui Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20240026561
    • Publication date Jan 25, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Zhaowei Jia
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20240018681
    • Publication date Jan 18, 2024
    • ACM RESEARCH (SHANGHAI), INC.
    • Yinuo Jin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20220081796
    • Publication date Mar 17, 2022
    • ACM Research (Shanghai) Inc.
    • Yinuo Jin
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
    • Publication number 20210301416
    • Publication date Sep 30, 2021
    • ACM Research (Shanghai) Inc.
    • Zhaowei JIA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COATER WITH AUTOMATIC CLEANING FUNCTION AND COATER AUTOMATIC CLEANI...
    • Publication number 20210072645
    • Publication date Mar 11, 2021
    • ACM Research (Shanghai) Inc.
    • Hui Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATING CHUCK
    • Publication number 20210066106
    • Publication date Mar 4, 2021
    • ACM Research (Shanghai) Inc.
    • Hui Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20200354851
    • Publication date Nov 12, 2020
    • ACM Research (Shanghai) Inc.
    • Zhaowei Jia
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE HEAT TREATMENT APPARATUS
    • Publication number 20200294825
    • Publication date Sep 17, 2020
    • ACM Research (Shanghai) Inc.
    • Hui Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPARATUS FOR HOLDING A SUBSTRATE
    • Publication number 20180320285
    • Publication date Nov 8, 2018
    • ACM Research (Shanghai) Inc.
    • Hui Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    MARKING OF BUSINESS DISTRICT INFORMATION OF A MERCHANT
    • Publication number 20170372331
    • Publication date Dec 28, 2017
    • China Unionpay Co., Ltd
    • Hongchao Yang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    COATER WITH AUTOMATIC CLEANING FUNCTION AND COATER AUTOMATIC CLEANI...
    • Publication number 20170248848
    • Publication date Aug 31, 2017
    • ACM Research (Shanghai) Inc.
    • Hui Wang
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    DATA MINING METHOD
    • Publication number 20160314174
    • Publication date Oct 27, 2016
    • China Unionpay Co., Ltd
    • Jun Wang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    APPARATUS AND METHOD FOR PLATING AND/OR POLISHING WAFER
    • Publication number 20160115613
    • Publication date Apr 28, 2016
    • ACM Research (Shanghai) Inc.
    • Jian Wang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR