Hongqiang Lu

Person

Lake Oswego, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming copper interconnects with Sn coatings
- Patent number 7,675,177
- Issue date Mar 9, 2010
- LSI Corporation
- Hongqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene interconnect structure with improved electro migrati...
- Patent number 7,312,532
- Issue date Dec 25, 2007
- LSI Corporation
- Peter A. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for creating ultra low resistance damascene co...
- Patent number 7,196,420
- Issue date Mar 27, 2007
- LSI Logic Corporation
- Peter A. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene interconnect structure with improved electro migrati...
- Patent number 7,033,929
- Issue date Apr 25, 2006
- LSI Logic Corporation
- Peter A. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for creating ultra low resistance damascene co...
- Patent number 6,987,059
- Issue date Jan 17, 2006
- LSI Logic Corporation
- Peter A. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout design and process to form nanotube cell for nanotube memory...
- Patent number 6,969,651
- Issue date Nov 29, 2005
- LSI Logic Corporation
- Hongqiang Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Forming copper interconnects with Sn coatings
- Patent number 6,884,720
- Issue date Apr 26, 2005
- LSI Logic Corporation
- Hongqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect integration
- Patent number 6,777,807
- Issue date Aug 17, 2004
- LSI Logic Corporation
- Valeriy Sukharev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-reflective coatings for use at 248 nm and 193 nm
- Patent number 6,686,272
- Issue date Feb 3, 2004
- LSI Logic Corporation
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dual damascene interconnect structure with improved electro migrati...
- Publication number 20050186782
- Publication date Aug 25, 2005
- LSI Logic Corporation
- Peter A. Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect integration
- Publication number 20040238960
- Publication date Dec 2, 2004
- LSI Logic Corporation
- Valeriy Sukharev
- H01 - BASIC ELECTRIC ELEMENTS

Hongqiang Lu

Person

Patents Grantslast 30 patents

Forming copper interconnects with Sn coatings

Dual damascene interconnect structure with improved electro migrati...

Method and structure for creating ultra low resistance damascene co...

Dual damascene interconnect structure with improved electro migrati...

Method and structure for creating ultra low resistance damascene co...

Layout design and process to form nanotube cell for nanotube memory...

Forming copper interconnects with Sn coatings

Interconnect integration

Anti-reflective coatings for use at 248 nm and 193 nm

Patents Applicationslast 30 patents

Dual damascene interconnect structure with improved electro migrati...

Interconnect integration