Hongyu LI

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Irvine, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Ball arrangement for integrated circuit package devices
- Patent number 9,431,361
- Issue date Aug 30, 2016
- Broadcom Corporation
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball arrangement for integrated circuit package devices
- Patent number 8,975,746
- Issue date Mar 10, 2015
- Broadcom Corporation
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Loading Pads for Impedance Management in Printed Circuit Board
- Publication number 20230319985
- Publication date Oct 5, 2023
- Google LLC
- Leesa Marie Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL ARRANGEMENT FOR INTEGRATED CIRCUIT PACKAGE DEVICES
- Publication number 20150145132
- Publication date May 28, 2015
- BROADCOM CORPORATION
- Arun RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL ARRANGEMENT FOR INTEGRATED CIRCUIT PACKAGE DEVICES
- Publication number 20150061128
- Publication date Mar 5, 2015
- BROADCOM CORPORATION
- Arun RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS