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last 30 patents
Information
Patent Grant
Multilayered printed circuit board and manufacturing method thereof
Patent number
8,148,643
Issue date
Apr 3, 2012
Ibiden Co., Ltd.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer build-up wiring board including a chip mount region
Patent number
7,847,318
Issue date
Dec 7, 2010
Ibiden Co., Ltd.
Naohiro Hirose
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a multilayered printed circuit board
Patent number
7,832,098
Issue date
Nov 16, 2010
Ibiden Co., Ltd.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer build-up wiring board
Patent number
7,514,779
Issue date
Apr 7, 2009
Ibiden Co., Ltd.
Naohiro Hirose
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing multilayered circuit board
Patent number
7,415,761
Issue date
Aug 26, 2008
Ibiden Co., Ltd.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer build-up wiring board
Patent number
6,613,986
Issue date
Sep 2, 2003
Ibiden Co., Ltd.
Naohiro Hirose
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method of a multilayered printed circuit board having...
Patent number
6,591,495
Issue date
Jul 15, 2003
Ibiden Co., Ltd.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20120125680
Publication date
May 24, 2012
IBIDEN CO., LTD.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER BUILD-UP WIRING BOARD
Publication number
20090173523
Publication date
Jul 9, 2009
IBIDEN CO., LTD.
Naohiro HIROSE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20080189943
Publication date
Aug 14, 2008
IBIDEN CO., LTD.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20080173473
Publication date
Jul 24, 2008
IBIDEN CO., LTD.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayered printed circuit board and manufacturing method therefor
Publication number
20040025333
Publication date
Feb 12, 2004
IBIDEN CO., LTD.
Naohiro Hirose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer build-up wiring board
Publication number
20030102151
Publication date
Jun 5, 2003
Naohiro Hirose
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayered printed circuit board and manufacturing method therefor
Publication number
20010042637
Publication date
Nov 22, 2001
Naohiro Hirose
H01 - BASIC ELECTRIC ELEMENTS