Hoonjoo Na

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including via structure
- Patent number 12,347,768
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,334,477
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,317,572
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Wonkeun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the semiconduct...
- Patent number 12,300,671
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a lower chip including a peripheral...
- Patent number 12,166,000
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hoonjoo Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor devices and method of manufacturing...
- Patent number 12,167,596
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Seungha Oh
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,142,588
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,021,080
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Dongsoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,887,841
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,887,966
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including bonding la...
- Patent number 11,824,035
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages stacked by wafer bonding process and methods...
- Patent number 11,810,900
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 11,749,586
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,749,587
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,742,351
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Dongsoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding apparatus and wafer to wafer bonding method
- Patent number 11,728,197
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jaehyun Phee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,721,628
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number RE49538
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hoonjoo Na
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,616,036
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,594,443
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor devices and method of manufacturing...
- Patent number 11,552,096
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Seungha Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,380,607
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,362,067
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including bonding layer and adsorption layer
- Patent number 11,348,892
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,296,045
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnection structure including...
- Patent number 11,152,317
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,121,131
- Issue date Sep 14, 2021
- Samsung Electronics Co., Ltd.
- Dongsoo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20250062262
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hoonjoo NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038141
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022823
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240234377
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240136334
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240038732
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE
- Publication number 20230361004
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Sonkwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230361121
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Dongsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352410
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230238343
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230215930
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- WONKEUN CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE
- Publication number 20230170296
- Publication date Jun 1, 2023
- Samsung Electronics Co., Ltd.
- Anthony Dongick LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING...
- Publication number 20230164994
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Seungha OH
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220336330
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE
- Publication number 20220310485
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Sonkwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20220310541
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Hoonjoo NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER
- Publication number 20220293549
- Publication date Sep 15, 2022
- SAMSUNG ELECATRONICS CO., LTD.
- Jaehyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220208706
- Publication date Jun 30, 2022
- Samsung Electronics Co.,Ltd.
- Joohee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220093567
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20220068852
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY
- Publication number 20220037273
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD
- Publication number 20220020624
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Jaehyun PHEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220013502
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20220013503
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING...
- Publication number 20210391350
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Seungha OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210375722
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210358910
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- DONGSOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066224
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Joohee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210066250
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057263
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Hoechul Kim
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device including via structure

Semiconductor packages

Semiconductor device

Semiconductor packages and methods of manufacturing the semiconduct...

Semiconductor device including a lower chip including a peripheral...

Three-dimensional semiconductor devices and method of manufacturing...

Semiconductor device and method of manufacturing the same

Method of fabricating a semiconductor device

Semiconductor device including through via structure

Semiconductor device and method of manufacturing the same

Semiconductor packages

Semiconductor packages

Method of manufacturing a semiconductor device including bonding la...

Semiconductor packages stacked by wafer bonding process and methods...

Semiconductor device including through via structure

Semiconductor device

Semiconductor device and method of manufacturing the same

Wafer to wafer bonding apparatus and wafer to wafer bonding method

Semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor package for improving bonding reliability

Semiconductor device and method of manufacturing the same

Substrate bonding apparatus and method of manufacturing semiconduct...

Three-dimensional semiconductor devices and method of manufacturing...

Semiconductor device

Methods of manufacturing semiconductor devices

Semiconductor devices including bonding layer and adsorption layer

Semiconductor device and method of manufacturing the same

Semiconductor device including interconnection structure including...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE

THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY

WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...