Horatio Quinones

Person

Peekskill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal enhancement approach using solder compositions in the liqui...
- Patent number 6,656,770
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhancement approach using solder compositions in the liqui...
- Patent number 6,281,573
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero force heat sink
- Patent number 6,212,070
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive low melt test for off-composition solder
- Patent number 6,016,947
- Issue date Jan 25, 2000
- International Business Machines Corporation
- Timothy W. Donahue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero force heat sink
- Patent number 5,805,430
- Issue date Sep 8, 1998
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for causing an open circuit in a conductive line
- Patent number 4,962,294
- Issue date Oct 9, 1990
- International Business Machines Corporation
- Keith F. Beckham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming improved solder connections for semiconductor d...
- Patent number 4,611,746
- Issue date Sep 16, 1986
- International Business Machines Corporation
- Ernest N. Levine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnection structure for joining semiconductor devices...
- Patent number 4,604,644
- Issue date Aug 5, 1986
- International Business Machines Corporation
- Keith F. Beckham
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal enhancement approach using solder compositions in the liqui...
- Publication number 20010026957
- Publication date Oct 4, 2001
- International Business Machines Corporation
- Eugene R. Atwood
- H01 - BASIC ELECTRIC ELEMENTS

Horatio Quinones

Person

Patents Grantslast 30 patents

Thermal enhancement approach using solder compositions in the liqui...

Thermal enhancement approach using solder compositions in the liqui...

Zero force heat sink

Non-destructive low melt test for off-composition solder

Zero force heat sink

Method and apparatus for causing an open circuit in a conductive line

Process for forming improved solder connections for semiconductor d...

Solder interconnection structure for joining semiconductor devices...

Patents Applicationslast 30 patents

Thermal enhancement approach using solder compositions in the liqui...