Number | Name | Date | Kind |
---|---|---|---|
3649881 | Chang et al. | Mar 1972 | |
4092697 | Spaight | May 1978 | |
4254431 | Babuka et al. | Mar 1981 | |
4479140 | Horvath | Oct 1984 | |
4607277 | Hassan et al. | Aug 1986 | |
5049972 | Uda et al. | Sep 1991 | |
5170930 | Dolbear et al. | Dec 1992 | |
5276289 | Satoh et al. | Jan 1994 | |
5311402 | Kobayashi et al. | May 1994 | |
5325265 | Turlik et al. | Jun 1994 | |
5329160 | Miura et al. | Jul 1994 | |
5445308 | Nelson et al. | Aug 1995 | |
5468655 | Greer | Nov 1995 | |
5536362 | Love et al. | Jul 1996 | |
5623394 | Sherif et al. | Apr 1997 | |
5668058 | Tanioka et al. | Sep 1997 | |
5672548 | Culnane et al. | Sep 1997 | |
5684677 | Uchida et al. | Nov 1997 | |
5768108 | Miura et al. | Jun 1998 | |
5789810 | Gross et al. | Aug 1998 | |
5821161 | Covell, II et al. | Oct 1998 | |
5866943 | Mertol | Feb 1999 | |
5880524 | Xie | Mar 1999 | |
5886408 | Ohki et al. | Mar 1999 | |
5905636 | Baska et al. | May 1999 | |
5919329 | Banks et al. | Jul 1999 | |
5931222 | Toy et al. | Aug 1999 | |
5945736 | Rife et al. | Aug 1999 |
Entry |
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IBM Technical Disclosure Bulletin, “Thermal Enhancement of Modules”, vol. 19, No. 8, Jan. 1977. |
IBM Technical Disclosure Bulletin, “Liquid-Filled Bellows Heat Sink”, vol. 21, No. 10, Mar. 1979. |
IBM Technical Disclosure Bulletin, “Semiconductor Chip With Liquid Metal Heat Transfer”, vol. 22, No. 4, Sep. 1979. |
IBM Technical Disclosure Bulletin, “Chip Cooling Employing a Conformable Alloy”, vol. 24, No. 11a, Apr. 1982. |
IBM Technical Disclosure Bulletin, “Thermal Sponge”, vol. 29, No. 11, Apr. 1987. |