Hougong Wang

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses and methods for atomic layer deposition
- Patent number 8,747,556
- Issue date Jun 10, 2014
- Applied Materials, Inc.
- Hyman W. H. Lam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatuses and methods for atomic layer deposition
- Patent number 8,293,015
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Hyman W. H. Lam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin film deposition
- Patent number 7,884,032
- Issue date Feb 8, 2011
- Applied Materials, Inc.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor wafer preheating
- Patent number 7,006,888
- Issue date Feb 28, 2006
- Applied Materials, Inc.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of application of electrical biasing to enhance metal deposi...
- Patent number 6,913,680
- Issue date Jul 5, 2005
- Applied Materials, Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for processing substrates in a system having h...
- Patent number 6,672,864
- Issue date Jan 6, 2004
- Applied Materials, Inc.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and associated apparatus to mechanically enhance the deposit...
- Patent number 6,610,189
- Issue date Aug 26, 2003
- Applied Materials, Inc.
- Hougong Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for reducing the first wafer effect
- Patent number 6,303,994
- Issue date Oct 16, 2001
- Applied Materials, Inc.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow chamber and process
- Patent number 6,299,689
- Issue date Oct 9, 2001
- Applied Materials, Inc.
- Hougong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for reducing the first wafer effect
- Patent number 6,139,698
- Issue date Oct 31, 2000
- Applied Materials, Inc.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Central coil design for ionized metal plasma deposition
- Patent number 6,077,402
- Issue date Jun 20, 2000
- Applied Materials, Inc.
- Liubo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow chamber and process
- Patent number 6,077,404
- Issue date Jun 20, 2000
- Applied Material, Inc.
- Hougong Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermally sprayable powder materials having an alloyed metal phase...
- Patent number 5,976,695
- Issue date Nov 2, 1999
- Westaim Technologies, Inc.
- Karel Hajmrle
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Ceramic coated metallic insulator particularly useful in a plasma s...
- Patent number 5,879,523
- Issue date Mar 9, 1999
- Applied Materials, Inc.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES AND METHODS FOR ATOMIC LAYER DEPOSITION
- Publication number 20140087091
- Publication date Mar 27, 2014
- Applied Materials, Inc.
- Hyman W.H. Lam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rotating Bed to Reduce the Risk of Developing Pressure Ulcers
- Publication number 20120036637
- Publication date Feb 16, 2012
- Hougong Wang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PHYSICAL VAPOR DEPOSITION CHAMBER HAVING AN ADJUSTABLE TARGET
- Publication number 20080116067
- Publication date May 22, 2008
- Ilya Lavitsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Thin film deposition
- Publication number 20070099438
- Publication date May 3, 2007
- APPLIED MATERIALS, INC.
- Mengqi Ye
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Physical vapor deposition chamber having an adjustable target
- Publication number 20060096851
- Publication date May 11, 2006
- Ilya Lavitsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Physical vapor deposition chamber having a rotatable substrate pede...
- Publication number 20060096857
- Publication date May 11, 2006
- Ilya Lavitsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for processing substrates in a system having h...
- Publication number 20040166697
- Publication date Aug 26, 2004
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer preheating
- Publication number 20030133773
- Publication date Jul 17, 2003
- APPLIED MATERIALS, INC.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for improving throughput in a cluster tool for...
- Publication number 20030131458
- Publication date Jul 17, 2003
- APPLIED MATERIALS, INC.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for processing substrates in a system having h...
- Publication number 20030044742
- Publication date Mar 6, 2003
- APPLIED MATERIALS, INC.
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing particle density in a cool down chamber
- Publication number 20030013312
- Publication date Jan 16, 2003
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and associated apparatus to mechanically enhance the deposit...
- Publication number 20020084189
- Publication date Jul 4, 2002
- APPLIED MATERIALS, INC.
- Hougong Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Hougong Wang

Person

Patents Grantslast 30 patents

Apparatuses and methods for atomic layer deposition

Apparatuses and methods for atomic layer deposition

Thin film deposition

Semiconductor wafer preheating

Method of application of electrical biasing to enhance metal deposi...

Method and apparatus for processing substrates in a system having h...

Method and associated apparatus to mechanically enhance the deposit...

Method and apparatus for reducing the first wafer effect

Reflow chamber and process

Method and apparatus for reducing the first wafer effect

Central coil design for ionized metal plasma deposition

Reflow chamber and process

Thermally sprayable powder materials having an alloyed metal phase...

Ceramic coated metallic insulator particularly useful in a plasma s...

Patents Applicationslast 30 patents

APPARATUSES AND METHODS FOR ATOMIC LAYER DEPOSITION

Rotating Bed to Reduce the Risk of Developing Pressure Ulcers

PHYSICAL VAPOR DEPOSITION CHAMBER HAVING AN ADJUSTABLE TARGET

Thin film deposition

Physical vapor deposition chamber having an adjustable target

Physical vapor deposition chamber having a rotatable substrate pede...

Method and apparatus for processing substrates in a system having h...

Semiconductor wafer preheating

Apparatus and method for improving throughput in a cluster tool for...

Method and apparatus for processing substrates in a system having h...

Method of reducing particle density in a cool down chamber

Method and associated apparatus to mechanically enhance the deposit...