How Yuan Hwang

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Sitlawan, MY

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Patents Grantslast 30 patents

Information Patent Grant
Through via package
- Patent number 9,318,459
- Issue date Apr 19, 2016
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via package
- Patent number 8,922,013
- Issue date Dec 30, 2014
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a contact recess and related methods
- Patent number 8,836,117
- Issue date Sep 16, 2014
- STMicroelectronics Asia Pacific PTE Ltd.
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package manufacturing method using wafer-to-wafer bonding
- Patent number 8,822,267
- Issue date Sep 2, 2014
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH VIA PACKAGE
- Publication number 20150069607
- Publication date Mar 12, 2015
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE MANUFACTURING METHOD USING WAFER-TO-WAFER BONDING
- Publication number 20140113410
- Publication date Apr 24, 2014
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A CONTACT RECESS AND RELATED METHODS
- Publication number 20140103521
- Publication date Apr 17, 2014
- STMicroelectronics Pte Ltd
- Yonggang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A DOUBLE-SIDED FANOUT SEMICONDUCTOR PACKAGE WITH...
- Publication number 20140057394
- Publication date Feb 27, 2014
- STMicroelectronics Pte Ltd
- Anandan Ramasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIA PACKAGE
- Publication number 20130113098
- Publication date May 9, 2013
- STMicroelectronics Pte Ltd
- How Yuan Hwang
- H01 - BASIC ELECTRIC ELEMENTS