Howard E. CHEN

Person

Anaheim, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with ball grid array and grounding pins for signal...
- Patent number 12,033,954
- Issue date Jul 9, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices related to dual-sided module with land-grid array (LGA) foo...
- Patent number 11,894,323
- Issue date Feb 6, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices for fabrication of shielded modules
- Patent number 11,682,585
- Issue date Jun 20, 2023
- Skyworks Solutions, Inc.
- Yi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods related to metallization of ceramic substrates for shieldin...
- Patent number 11,277,901
- Issue date Mar 15, 2022
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a film during fabrication for a dual-si...
- Patent number 11,244,835
- Issue date Feb 8, 2022
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module having a ball grid array with grounding shielding p...
- Patent number 11,233,014
- Issue date Jan 25, 2022
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to dual-sided module with land-grid array (LGA) foo...
- Patent number 11,139,257
- Issue date Oct 5, 2021
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided radio-frequency package with overmold structure
- Patent number 11,127,690
- Issue date Sep 21, 2021
- Skyworks Solutions, Inc.
- Howard E. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus related to conformal coating implemented with surface mou...
- Patent number 10,980,106
- Issue date Apr 13, 2021
- Skyworks Solutions, Inc.
- Anthony James Lobianco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and modules related to shielded lead frame packages
- Patent number 10,854,559
- Issue date Dec 1, 2020
- Skyworks Solutions, Inc.
- Howard E. Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 10,729,001
- Issue date Jul 28, 2020
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal shielding for a diversity receive module
- Patent number 10,615,841
- Issue date Apr 7, 2020
- Skyworks Solutions, Inc.
- Yi Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dual-sided radio-frequency package with overmold structure
- Patent number 10,607,944
- Issue date Mar 31, 2020
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of determining racetrack layout for radio frequency isolati...
- Patent number 10,586,010
- Issue date Mar 10, 2020
- Skyworks Solutions, Inc.
- Howard E. Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package having a metal paint layer
- Patent number 10,580,741
- Issue date Mar 3, 2020
- Skyworks Solutions, Inc.
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency isolation structure
- Patent number 10,579,766
- Issue date Mar 3, 2020
- Skyworks Solutions, Inc.
- Howard E. Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods related to implementing surface mount devices with ground p...
- Patent number 10,561,012
- Issue date Feb 11, 2020
- Skyworks Solutions, Inc.
- Howard E. Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods related to conformal coating implemented with...
- Patent number 10,524,350
- Issue date Dec 31, 2019
- Skyworks Solutions, Inc.
- Anthony James Lobianco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-sided module with land-grid array (LGA) footprint
- Patent number 10,497,656
- Issue date Dec 3, 2019
- Skyworks Solutions, Inc.
- Howard E. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming shielded radio-frequency modules having reduced...
- Patent number 10,446,503
- Issue date Oct 15, 2019
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-mold openings for dual-sided packaged modules with ball gri...
- Patent number 10,361,145
- Issue date Jul 23, 2019
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and modules related to shielded lead frame packages
- Patent number 10,340,225
- Issue date Jul 2, 2019
- Skyworks Solutions, Inc.
- Howard E. Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Radio frequency isolation structure with racetrack
- Patent number 10,242,143
- Issue date Mar 26, 2019
- Skyworks Solutions, Inc.
- Howard E. Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shielded diversity receive module
- Patent number 10,200,077
- Issue date Feb 5, 2019
- Skyworks Solutions, Inc.
- Yi Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Devices and methods related to fabrication of shielded modules
- Patent number 10,192,785
- Issue date Jan 29, 2019
- Skyworks Solutions, Inc.
- Yi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having a metal paint layer
- Patent number 10,163,814
- Issue date Dec 25, 2018
- Skyworks Solutions, Inc.
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Racetrack layout for radio frequency isolation structure
- Patent number 10,061,885
- Issue date Aug 28, 2018
- Skyworks Solutions, Inc.
- Howard E. Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shielded lead frame packages
- Patent number 10,043,763
- Issue date Aug 7, 2018
- Skyworks Solutions, Inc.
- Howard E. Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
DEVICES, SYSTEMS AND METHODS RELATED TO DUAL-SIDED MODULES
- Publication number 20240405009
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Sundeep Nand NANGALIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
- Publication number 20240250045
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS FOR REDUCING WARPAGE DURING FABRICATIO...
- Publication number 20240242974
- Publication date Jul 18, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED MODULE FABRICATION METHODS AND DEVICES
- Publication number 20230420301
- Publication date Dec 28, 2023
- Skyworks Solutions, Inc.
- Yi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED MOLDED PACKAGE WITH EXPOSED BACKSIDE DIE FOR THERMAL DIS...
- Publication number 20230326824
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED PACKAGED RADIO-FREQUENCY MODULE HAVING BALL GRID ARRAY E...
- Publication number 20230326841
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL PACKAGES WITH NON-LINEAR INTERCONNECT MEMBERS
- Publication number 20230260880
- Publication date Aug 17, 2023
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY REINFORCED ELECTRICAL PACKAGES
- Publication number 20230215795
- Publication date Jul 6, 2023
- Skyworks Solutions, Inc.
- Jeffrey Sailer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL PACKAGES WITH ELONGATED INTERCONNECT MEMBERS
- Publication number 20230215796
- Publication date Jul 6, 2023
- Skyworks Solutions, Inc.
- Jeffrey Sailer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND V...
- Publication number 20230139251
- Publication date May 4, 2023
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND U...
- Publication number 20230135057
- Publication date May 4, 2023
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package and Method for Manufacturing an Electronic Package
- Publication number 20230115846
- Publication date Apr 13, 2023
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20220338342
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE HAVING DUAL SIDE MOLD WITH METAL POSTS
- Publication number 20220319968
- Publication date Oct 6, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF CONDUCTIVE VIA OR TRENCH FOR INTRA MODULE EMI SHIELDING
- Publication number 20220310530
- Publication date Sep 29, 2022
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20220254730
- Publication date Aug 11, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
- Publication number 20220148984
- Publication date May 12, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE W...
- Publication number 20220115331
- Publication date Apr 14, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20210045231
- Publication date Feb 11, 2021
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE
- Publication number 20200321287
- Publication date Oct 8, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH BALL GRID ARRAY HAVING INCREASED DIE AREA
- Publication number 20200321272
- Publication date Oct 8, 2020
- SKYWORKS SOLUTIONS, INC.
- Bipul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...
- Publication number 20200227364
- Publication date Jul 16, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOU...
- Publication number 20200229298
- Publication date Jul 16, 2020
- SKYWORKS SOLUTIONS, INC.
- Anthony James LOBIANCO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS RELATED TO THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MO...
- Publication number 20200161222
- Publication date May 21, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND MODULES RELATED TO SHIELDED LEAD FRAME PACKAGES
- Publication number 20200161254
- Publication date May 21, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES RELATED TO SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED...
- Publication number 20200161255
- Publication date May 21, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES FOR FABRICATION OF SHIELDED MODULES
- Publication number 20190214300
- Publication date Jul 11, 2019
- SKYWORKS SOLUTIONS, INC.
- Yi LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER
- Publication number 20190198451
- Publication date Jun 27, 2019
- SKYWORKS SOLUTIONS, INC.
- Matthew Sean Read
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL SHIELDING FOR A DIVERSITY RECEIVE MODULE
- Publication number 20190181906
- Publication date Jun 13, 2019
- SKYWORKS SOLUTIONS, INC.
- Yi LIU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Howard E. CHEN

Person

Patents Grantslast 30 patents

Devices and methods related to metallization of ceramic substrates...

Packaged module with ball grid array and grounding pins for signal...

Devices and methods related to dual-sided radio-frequency package w...

Devices related to dual-sided module with land-grid array (LGA) foo...

Devices for fabrication of shielded modules

Methods related to metallization of ceramic substrates for shieldin...

Control of under-fill using a film during fabrication for a dual-si...

Packaged module having a ball grid array with grounding shielding p...

Methods related to dual-sided module with land-grid array (LGA) foo...

Dual-sided radio-frequency package with overmold structure

Apparatus related to conformal coating implemented with surface mou...

Methods and modules related to shielded lead frame packages

Devices and methods related to metallization of ceramic substrates...

Conformal shielding for a diversity receive module

Dual-sided radio-frequency package with overmold structure

Methods of determining racetrack layout for radio frequency isolati...

Semiconductor package having a metal paint layer

Radio frequency isolation structure

Methods related to implementing surface mount devices with ground p...

Apparatus and methods related to conformal coating implemented with...

Dual-sided module with land-grid array (LGA) footprint

Methods for forming shielded radio-frequency modules having reduced...

Through-mold openings for dual-sided packaged modules with ball gri...

Methods and modules related to shielded lead frame packages

Radio frequency isolation structure with racetrack

Shielded diversity receive module

Devices and methods related to fabrication of shielded modules

Semiconductor package having a metal paint layer

Racetrack layout for radio frequency isolation structure

Shielded lead frame packages

Patents Applicationslast 30 patents

DEVICES, SYSTEMS AND METHODS RELATED TO DUAL-SIDED MODULES

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...

DEVICES, SYSTEMS AND METHODS FOR REDUCING WARPAGE DURING FABRICATIO...

SHIELDED MODULE FABRICATION METHODS AND DEVICES

DUAL-SIDED MOLDED PACKAGE WITH EXPOSED BACKSIDE DIE FOR THERMAL DIS...

DUAL-SIDED PACKAGED RADIO-FREQUENCY MODULE HAVING BALL GRID ARRAY E...

ELECTRICAL PACKAGES WITH NON-LINEAR INTERCONNECT MEMBERS

MECHANICALLY REINFORCED ELECTRICAL PACKAGES

ELECTRICAL PACKAGES WITH ELONGATED INTERCONNECT MEMBERS

DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND V...

DUAL SIDED MOLDED PACKAGE WITH VARYING INTERCONNECT PAD SIZES AND U...

Electronic Package and Method for Manufacturing an Electronic Package

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

MODULE HAVING DUAL SIDE MOLD WITH METAL POSTS

APPLICATION OF CONDUCTIVE VIA OR TRENCH FOR INTRA MODULE EMI SHIELDING

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

DEVICES RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...

DEVICES AND METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE W...

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE

MODULE WITH BALL GRID ARRAY HAVING INCREASED DIE AREA

METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOO...

APPARATUS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOU...

METHODS RELATED TO THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MO...

METHODS AND MODULES RELATED TO SHIELDED LEAD FRAME PACKAGES

DEVICES RELATED TO SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED...

DEVICES FOR FABRICATION OF SHIELDED MODULES

SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER

CONFORMAL SHIELDING FOR A DIVERSITY RECEIVE MODULE