Howard E. Evans

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer interconnect sutructure for ball grid arrays
- Patent number 5,844,168
- Issue date Dec 1, 1998
- Minnesota Mining and Manufacturing Company
- Randolph Dennis Schueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond tape ball grid array package
- Patent number 5,663,530
- Issue date Sep 2, 1997
- Minnesota Mining and Manufacturing Company
- Randolph D. Schueller
- H01 - BASIC ELECTRIC ELEMENTS