Howard Test

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Offset gravure printing process for improved mold compound and die...
- Patent number 8,530,279
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Howard Raeburn Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for bond pads of copper-metallized integrated...
- Patent number 7,535,104
- Issue date May 19, 2009
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-metallized integrated circuits having electroless thick copp...
- Patent number 7,413,974
- Issue date Aug 19, 2008
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization scheme including a low modulus structure
- Patent number 7,294,923
- Issue date Nov 13, 2007
- Texas Instruments Incorporated
- Howard Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded semiconductor device having low inductance and noise
- Patent number 7,265,443
- Issue date Sep 4, 2007
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for bond pads of copper-metallized integrated...
- Patent number 7,217,656
- Issue date May 15, 2007
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve continuous hydrogen saturation in sparingly used...
- Patent number 6,869,875
- Issue date Mar 22, 2005
- Texas Instruments Incorporated
- Howard R. Test
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wire bonding process for copper-metallized integrated circuits
- Patent number 6,800,555
- Issue date Oct 5, 2004
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel plating process having controlled hydrogen concentration
- Patent number 6,619,538
- Issue date Sep 16, 2003
- Texas Instruments Incorporated
- Howard R. Test
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to achieve continuous hydrogen saturation in sparingly used...
- Patent number 6,616,967
- Issue date Sep 9, 2003
- Texas Instruments Incorporated
- Howard R. Test
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wire bonded flip-chip assembly of semiconductor devices
- Patent number 6,268,662
- Issue date Jul 31, 2001
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus, and method for connecting a semiconductor chip t...
- Patent number 6,068,180
- Issue date May 30, 2000
- Texas Instruments Incorporated
- Howard R. Test
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making an IC device using a single-headed bonder
- Patent number 5,979,743
- Issue date Nov 9, 1999
- Texas Instruments Incorporated
- Howard R. Test
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary designs and process for fine pitch ball bonding
- Patent number 5,544,804
- Issue date Aug 13, 1996
- Texas Instruments Incorporated
- Howard R. Test
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of packaging a semiconductor device with reduced stress forces
- Patent number 4,874,722
- Issue date Oct 17, 1989
- Texas Instruments Incorporated
- George A. Bednarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an electronic device on an insulative substrate
- Patent number 4,423,435
- Issue date Dec 27, 1983
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME SURFACE WITH SELECTIVE ADHESION PROMOTER APPLIED WITH AN...
- Publication number 20100062570
- Publication date Mar 11, 2010
- Howard Raeburn TEST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-METALLIZED INTEGRATED CIRCUITS HAVING ELECTROLESS THICK COPP...
- Publication number 20080274294
- Publication date Nov 6, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Howard R. Test
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermally Enhanced IC Package and Method
- Publication number 20080157300
- Publication date Jul 3, 2008
- Shih-Fang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel Metallization Scheme and Method of Manufacture Therefor
- Publication number 20080026562
- Publication date Jan 31, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Howard Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Bond Pads of Copper-Metallized Integrated...
- Publication number 20070176301
- Publication date Aug 2, 2007
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for bond pads of copper-metallized integrated...
- Publication number 20060267203
- Publication date Nov 30, 2006
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel metallization scheme and method of manufacture therefor
- Publication number 20060249821
- Publication date Nov 9, 2006
- Texas Instruments, Incorporated
- Howard Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonded semiconductor device having low inductance and noise
- Publication number 20060244154
- Publication date Nov 2, 2006
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire loop grid array package
- Publication number 20050133928
- Publication date Jun 23, 2005
- Gregory E. Howard
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wire bonding process for copper-metallized integrated circuits
- Publication number 20050106851
- Publication date May 19, 2005
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to achieve continuous hydrogen saturation in sparingly used...
- Publication number 20040084511
- Publication date May 6, 2004
- Howard R. Test
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Nickel plating process having controlled hydrogen concentration
- Publication number 20040018675
- Publication date Jan 29, 2004
- Howard R. Test
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method for bond pads of copper-metallized integrated...
- Publication number 20030071319
- Publication date Apr 17, 2003
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding process for copper-metallized integrated circuits
- Publication number 20010035452
- Publication date Nov 1, 2001
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for bond pads of copper-metallized integrated...
- Publication number 20010033020
- Publication date Oct 25, 2001
- Roger J. Stierman
- H01 - BASIC ELECTRIC ELEMENTS

Howard Test

Person

Patents Grantslast 30 patents

Offset gravure printing process for improved mold compound and die...

Structure and method for bond pads of copper-metallized integrated...

Copper-metallized integrated circuits having electroless thick copp...

Metallization scheme including a low modulus structure

Wire bonded semiconductor device having low inductance and noise

Structure and method for bond pads of copper-metallized integrated...

Method to achieve continuous hydrogen saturation in sparingly used...

Wire bonding process for copper-metallized integrated circuits

Nickel plating process having controlled hydrogen concentration

Method to achieve continuous hydrogen saturation in sparingly used...

Wire bonded flip-chip assembly of semiconductor devices

System, apparatus, and method for connecting a semiconductor chip t...

Method for making an IC device using a single-headed bonder

Capillary designs and process for fine pitch ball bonding

Process of packaging a semiconductor device with reduced stress forces

Assembly of an electronic device on an insulative substrate

Patents Applicationslast 30 patents

LEADFRAME SURFACE WITH SELECTIVE ADHESION PROMOTER APPLIED WITH AN...

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING ELECTROLESS THICK COPP...

Thermally Enhanced IC Package and Method

Novel Metallization Scheme and Method of Manufacture Therefor

Structure and Method for Bond Pads of Copper-Metallized Integrated...

Structure and method for bond pads of copper-metallized integrated...

Novel metallization scheme and method of manufacture therefor

Wire bonded semiconductor device having low inductance and noise

Wire loop grid array package

Wire bonding process for copper-metallized integrated circuits

Method to achieve continuous hydrogen saturation in sparingly used...

Nickel plating process having controlled hydrogen concentration

Micromechanical device contact terminals free of particle generation

Structure and method for bond pads of copper-metallized integrated...

Wire bonding process for copper-metallized integrated circuits

Structure and method for bond pads of copper-metallized integrated...