Hsiang-Chung Liu

Person

Jwu Beei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 12,002,709
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 11,901,295
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,860,550
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including low-resistance interconnect and i...
- Patent number 11,769,695
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of operating the same
- Patent number 11,729,969
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor epitaxy bordering isolation structure
- Patent number 11,658,032
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensing device and temperature sensing method
- Patent number 11,448,556
- Issue date Sep 20, 2022
- Global Unichip Corporation
- Ting-Hao Wang
- G01 - MEASURING TESTING
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,422,475
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 11,302,570
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 11,296,027
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 11,152,306
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera capable of automatically compensating focal length
- Patent number 11,143,839
- Issue date Oct 12, 2021
- Chicony Electronics Co., Ltd.
- Shang-Yuan Yuan
- G02 - OPTICS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,107,725
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line structure and method
- Patent number 11,101,216
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor epitaxy bordering isolation structure
- Patent number 10,957,540
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing with flexible space formed using self-aligned spacer...
- Patent number 10,957,580
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating a low-resistance interconnect
- Patent number 10,930,551
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid copper structure for advance interconnect usage
- Patent number 10,818,597
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 10,784,151
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing with flexible space formed using self-aligned spacer...
- Patent number 10,734,275
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film for semiconductor fabrication
- Patent number 10,658,296
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 10,534,273
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interconnection structure of semiconductor device
- Patent number 10,535,560
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing with flexible space formed using self-aligned spacer...
- Patent number 10,529,617
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor epitaxy bordering isolation structure
- Patent number 10,522,353
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split rail structures located in adjacent metal layers
- Patent number 10,522,469
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line structure and method
- Patent number 10,490,500
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid copper structure for advance interconnect usage
- Patent number 10,290,580
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with damascene structure
- Patent number 10,276,396
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split rail structures located in adjacent metal layers
- Patent number 10,269,715
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128120
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND METHODS FOR OPERATING THE SAME
- Publication number 20230389303
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- G11 - INFORMATION STORAGE
Information Patent Application
Low-Resistance Interconnect
- Publication number 20230369114
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230309296
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230262968
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- G11 - INFORMATION STORAGE
Information Patent Application
NOVEL METAL FUSE STRUCTURE BY VIA LANDING
- Publication number 20230064518
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PATTERN METAL FUSE DEVICE, LAYOUT, AND METHOD
- Publication number 20220415911
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE, LAYOUT, AND METHOD
- Publication number 20220352185
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei LIU
- G11 - INFORMATION STORAGE
Information Patent Application
Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...
- Publication number 20220350262
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Film for Semiconductor Fabrication
- Publication number 20220223528
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210391211
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSING DEVICE AND TEMPERATURE SENSING METHOD
- Publication number 20210381904
- Publication date Dec 9, 2021
- GLOBAL UNICHIP CORPORATION
- Ting-Hao Wang
- G01 - MEASURING TESTING
Information Patent Application
Metal Line Structure and Method
- Publication number 20210375760
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Epitaxy Bordering Isolation Structure
- Publication number 20210210350
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Resistance Interconnect
- Publication number 20210175119
- Publication date Jun 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210005510
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating a Low-Resistance Interconnect
- Publication number 20200411374
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...
- Publication number 20200365449
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200243377
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...
- Publication number 20200144104
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Epitaxy Bordering Isolation Structure
- Publication number 20200126793
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20200124985
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200083093
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Film for Semiconductor Fabrication
- Publication number 20200083168
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Line Structure and Method
- Publication number 20200051914
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lun Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE CAPTURE SYSTEM AND CAPTURE PROCESS ADJUSTING METHOD THEREOF
- Publication number 20190273859
- Publication date Sep 5, 2019
- CHICONY ELECTRONICS CO., LTD.
- Shang-Yuan YUAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HYBRID COPPER STRUCTURE FOR ADVANCE INTERCONNECT USAGE
- Publication number 20190244897
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT RAIL STRUCTURES LOCATED IN ADJACENT METAL LAYERS
- Publication number 20190244902
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA CAPABLE OF AUTOMATICALLY COMPENSATING FOCAL LENGTH
- Publication number 20190196134
- Publication date Jun 27, 2019
- CHICONY ELECTRONICS CO., LTD.
- Shang-Yuan Yuan
- G02 - OPTICS

Hsiang-Chung Liu

Person

Patents Grantslast 30 patents

Interconnect structure and manufacturing method for the same

Dielectric film for semiconductor fabrication

Multi-metal fill with self-aligned patterning and dielectric with v...

Semiconductor structure including low-resistance interconnect and i...

Semiconductor device and method of operating the same

Semiconductor epitaxy bordering isolation structure

Temperature sensing device and temperature sensing method

Multi-metal fill with self-aligned patterning and dielectric with v...

Interconnect structure and method for forming the same

Dielectric film for semiconductor fabrication

Dielectric film for semiconductor fabrication

Camera capable of automatically compensating focal length

Interconnect structure and manufacturing method for the same

Metal line structure and method

Semiconductor epitaxy bordering isolation structure

Metal routing with flexible space formed using self-aligned spacer...

Methods for fabricating a low-resistance interconnect

Hybrid copper structure for advance interconnect usage

Interconnect structure and manufacturing method for the same

Metal routing with flexible space formed using self-aligned spacer...

Dielectric film for semiconductor fabrication

Multi-metal fill with self-aligned patterning and dielectric with v...

Interconnection structure of semiconductor device

Metal routing with flexible space formed using self-aligned spacer...

Semiconductor epitaxy bordering isolation structure

Split rail structures located in adjacent metal layers

Metal line structure and method

Hybrid copper structure for advance interconnect usage

Method for forming semiconductor device with damascene structure

Split rail structures located in adjacent metal layers

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

MEMORY DEVICES AND METHODS FOR OPERATING THE SAME

Low-Resistance Interconnect

SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME

NOVEL METAL FUSE STRUCTURE BY VIA LANDING

MULTIPLE PATTERN METAL FUSE DEVICE, LAYOUT, AND METHOD

MEMORY DEVICE, LAYOUT, AND METHOD

Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...

Dielectric Film for Semiconductor Fabrication

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

TEMPERATURE SENSING DEVICE AND TEMPERATURE SENSING METHOD

Metal Line Structure and Method

Semiconductor Epitaxy Bordering Isolation Structure

Low-Resistance Interconnect

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Methods for Fabricating a Low-Resistance Interconnect

Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...

Semiconductor Epitaxy Bordering Isolation Structure

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Dielectric Film for Semiconductor Fabrication

Metal Line Structure and Method

IMAGE CAPTURE SYSTEM AND CAPTURE PROCESS ADJUSTING METHOD THEREOF

HYBRID COPPER STRUCTURE FOR ADVANCE INTERCONNECT USAGE

SPLIT RAIL STRUCTURES LOCATED IN ADJACENT METAL LAYERS

CAMERA CAPABLE OF AUTOMATICALLY COMPENSATING FOCAL LENGTH