Hsiang-Ming Lu

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Biochip packaging structure
- Patent number 12,174,170
- Issue date Dec 24, 2024
- Kore Semiconductor Co., Ltd.
- Hsiang-Hua Lu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,581,260
- Issue date Feb 14, 2023
- Kore Semiconductor Co., Ltd.
- Chi-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method of making same
- Patent number 11,462,481
- Issue date Oct 4, 2022
- Kore Semiconductor Co., Ltd.
- Ying-Chieh Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical communication system
- Patent number 11,402,593
- Issue date Aug 2, 2022
- Prime World International Holdings Ltd.
- Hsiang-Jen Lu
- G02 - OPTICS
Information Patent Grant
Chip packaging structure
- Patent number 11,056,411
- Issue date Jul 6, 2021
- Socle Technology Corp.
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical transceiver
- Patent number 10,634,858
- Issue date Apr 28, 2020
- Prime World International Holdings Ltd.
- Che-Shou Yeh
- G02 - OPTICS
Information Patent Grant
Electrical device and buffer member thereof
- Patent number 10,082,841
- Issue date Sep 25, 2018
- Wistron Corp.
- Yun-Ping Lee
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Buffer member, buffer frame and electrical device
- Patent number 9,891,673
- Issue date Feb 13, 2018
- Wistron Corp.
- Yun-Ping Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Footstand mechanism for adjusting a tilt angle of an electronic dev...
- Patent number 8,807,497
- Issue date Aug 19, 2014
- Wistron Corporation
- Hsiang-Ming Lu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
NETWORK SWITCH SYSTEM
- Publication number 20240063914
- Publication date Feb 22, 2024
- Prime World International Holdings Ltd.
- Hsiang-Jen LU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAN-OUT PACKAGING STRUCTURE
- Publication number 20220344277
- Publication date Oct 27, 2022
- Kore Semiconductor Co., Ltd.
- YING-CHIEH PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220122917
- Publication date Apr 21, 2022
- SOCLE TECHNOLOGY CORP.
- CHI-TING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING PACKAGING STRUCTURE
- Publication number 20220122951
- Publication date Apr 21, 2022
- SOCLE TECHNOLOGY CORP.
- CHING-YU NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOCHIP STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20220032292
- Publication date Feb 3, 2022
- SOCLE TECHNOLOGY CORP.
- HSIANG-HUA LU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
OPTICAL COMMUNICATION SYSTEM
- Publication number 20220019040
- Publication date Jan 20, 2022
- Prime World International Holdings Ltd.
- Hsiang-Jen LU
- G02 - OPTICS
Information Patent Application
NETWORK SWITCH SYSTEM
- Publication number 20220021457
- Publication date Jan 20, 2022
- Prime World International Holdings Ltd.
- Hsiang-Jen LU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FINGERPRINT IDENTIFICATION CHIP PACKAGE AND METHOD FOR MAKING SAME
- Publication number 20210313244
- Publication date Oct 7, 2021
- SOCLE TECHNOLOGY CORP.
- HSIANG-HUA LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BIOCHIP PACKAGING STRUCTURE
- Publication number 20210154666
- Publication date May 27, 2021
- HON HAI PRECISION INDUSTRY CO., LTD.
- HSIANG-HUA LU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PACKAGE STRUCTURE WITH INTEGRATED ANTENNA, PACKAGE STRUCTURE ARRAY,...
- Publication number 20210151395
- Publication date May 20, 2021
- SOCLE TECHNOLOGY CORP.
- CHING-YU NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20210134732
- Publication date May 6, 2021
- SOCLE TECHNOLOGY CORP.
- YING-CHIEH PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR IMAGE SENSOR, LENS MODULE, AND ELECTRONIC D...
- Publication number 20200343285
- Publication date Oct 29, 2020
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHING-YU NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200279786
- Publication date Sep 3, 2020
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHING-YU NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER
- Publication number 20180252871
- Publication date Sep 6, 2018
- Prime World International Holdings Ltd.
- Che-Shou YEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRICAL DEVICE AND BUFFER MEMBER THEREOF
- Publication number 20180032111
- Publication date Feb 1, 2018
- WISTRON CORP.
- Yun-Ping LEE
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
BUFFER MEMBER, BUFFER FRAME AND ELECTRICAL DEVICE
- Publication number 20150117696
- Publication date Apr 30, 2015
- WISTRON CORP.
- Yun-Ping LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FOOTSTAND MECHANISM FOR ADJUSTING A TILT ANGLE OF AN ELECTRONIC DEV...
- Publication number 20130009526
- Publication date Jan 10, 2013
- Hsiang-Ming Lu
- G06 - COMPUTING CALCULATING COUNTING

Hsiang-Ming Lu

Person

Patents Grantslast 30 patents

Biochip packaging structure

Package structure and manufacturing method thereof

Fan-out packaging structure and method of making same

Optical communication system

Chip packaging structure

Optical transceiver

Electrical device and buffer member thereof

Buffer member, buffer frame and electrical device

Footstand mechanism for adjusting a tilt angle of an electronic dev...

Patents Applicationslast 30 patents

NETWORK SWITCH SYSTEM

FAN-OUT PACKAGING STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING PACKAGING STRUCTURE

BIOCHIP STRUCTURE AND METHOD FOR MAKING SAME

OPTICAL COMMUNICATION SYSTEM

NETWORK SWITCH SYSTEM

FINGERPRINT IDENTIFICATION CHIP PACKAGE AND METHOD FOR MAKING SAME

BIOCHIP PACKAGING STRUCTURE

PACKAGE STRUCTURE WITH INTEGRATED ANTENNA, PACKAGE STRUCTURE ARRAY,...

FAN-OUT PACKAGING STRUCTURE AND METHOD OF MAKING SAME

PACKAGING STRUCTURE FOR IMAGE SENSOR, LENS MODULE, AND ELECTRONIC D...

CHIP PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL TRANSCEIVER

ELECTRICAL DEVICE AND BUFFER MEMBER THEREOF

BUFFER MEMBER, BUFFER FRAME AND ELECTRICAL DEVICE

FOOTSTAND MECHANISM FOR ADJUSTING A TILT ANGLE OF AN ELECTRONIC DEV...