Hsien-Chie Cheng

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of gate structure
- Patent number 11,139,172
- Issue date Oct 5, 2021
- Mosel Vitelic Inc
- Shih-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of split gate structure and split gate structure
- Patent number 11,094,792
- Issue date Aug 17, 2021
- Mosel Vitelic Inc
- Shih-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic device
- Patent number 10,932,361
- Issue date Feb 23, 2021
- Industrial Technology Research Institute
- Cheng-Ta Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for 360-degree video playback
- Patent number 10,462,449
- Issue date Oct 29, 2019
- Novatek Microelectronics Corp.
- Min Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked capacitor structure and manufacturing method thereof
- Patent number 8,134,823
- Issue date Mar 13, 2012
- Industrial Technology Research Institute
- Wen-Hwa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure of memory capacitor
- Patent number 7,999,350
- Issue date Aug 16, 2011
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump
- Patent number 7,378,746
- Issue date May 27, 2008
- Industrial Technology Research Institute
- Ji-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional multichip stack electronic package structure
- Patent number 7,211,886
- Issue date May 1, 2007
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SPLIT GATE MOSFET AND MANUFACTURING METHOD THEREOF
- Publication number 20240405121
- Publication date Dec 5, 2024
- Mosel Vitelic Inc.
- Chia-Ming Kou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SPLIT GATE STRUCTURE AND SPLIT GATE STRUCTURE
- Publication number 20200328281
- Publication date Oct 15, 2020
- Mosel Vitelic Inc.
- Shih-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF GATE STRUCTURE AND GATE STRUCTURE
- Publication number 20200328084
- Publication date Oct 15, 2020
- Mosel Vitelic Inc.
- Shih-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20190373721
- Publication date Dec 5, 2019
- Industrial Technology Research Institute
- Cheng-Ta Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR 360-DEGREE VIDEO PLAYBACK
- Publication number 20180241984
- Publication date Aug 23, 2018
- NOVATEK MICROELECTRONICS CORP.
- Min Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20090257169
- Publication date Oct 15, 2009
- Industrial Technology Research Institute
- Wen-Hwa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE STRUCTURE OF MEMORY CAPACITOR AND MANUFACTURING METHOD TH...
- Publication number 20090224362
- Publication date Sep 10, 2009
- Industrial Technology Research Institute
- Su-Tsai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20090184393
- Publication date Jul 23, 2009
- Industrial Technology Research Institute
- Wen-Hwa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BUMP
- Publication number 20070210457
- Publication date Sep 13, 2007
- Ji-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional multichip stack electronic package structure
- Publication number 20060273439
- Publication date Dec 7, 2006
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional multichip stack electronic package structure
- Publication number 20050224947
- Publication date Oct 13, 2005
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Hsien-Chie Cheng

Person

Patents Grantslast 30 patents

Manufacturing method of gate structure

Manufacturing method of split gate structure and split gate structure

Circuit board and electronic device

Method and system for 360-degree video playback

Stacked capacitor structure and manufacturing method thereof

Electrode structure of memory capacitor

Composite bump

Three-dimensional multichip stack electronic package structure

Patents Applicationslast 30 patents

SPLIT GATE MOSFET AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SPLIT GATE STRUCTURE AND SPLIT GATE STRUCTURE

MANUFACTURING METHOD OF GATE STRUCTURE AND GATE STRUCTURE

CIRCUIT BOARD AND ELECTRONIC DEVICE

METHOD AND SYSTEM FOR 360-DEGREE VIDEO PLAYBACK

STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRODE STRUCTURE OF MEMORY CAPACITOR AND MANUFACTURING METHOD TH...

MEMORY CAPACITOR AND MANUFACTURING METHOD THEREOF

COMPOSITE BUMP

Three-dimensional multichip stack electronic package structure

Three-dimensional multichip stack electronic package structure