Hsien-Ken LIAO

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electrostatic discharge protection device
- Patent number 12,342,629
- Issue date Jun 24, 2025
- Vanguard International Semiconductor Corporation
- Yeh-Ning Jou
Information Patent Grant
All-oxide transistor structure, method for fabricating the same and...
- Patent number 12,342,681
- Issue date Jun 24, 2025
- Industrial Technology Research Institute
- Haw-Tyng Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electrostatic discharge protection circuit
- Patent number 11,811,222
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Yeh-Ning Jou
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Sound producing package structure and manufacturing method thereof
- Patent number 11,805,342
- Issue date Oct 31, 2023
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sound producing package structure and manufacturing method thereof
- Patent number 11,758,312
- Issue date Sep 12, 2023
- XMEMS TAIWAN CO., LTD.
- Hsien-Ken Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Protection circuits
- Patent number 11,569,657
- Issue date Jan 31, 2023
- Vanguard International Semiconductor Corporation
- Shao-Chang Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrostatic discharge protection devices
- Patent number 11,545,481
- Issue date Jan 3, 2023
- Vanguard International Semiconductor Corporation
- Yeh-Ning Jou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing sound producing chip...
- Patent number 11,252,511
- Issue date Feb 15, 2022
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit and electrostatic discharge protection circuit t...
- Patent number 11,088,541
- Issue date Aug 10, 2021
- Vanguard International Semiconductor Corporation
- Shao-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS microphone package
- Patent number 10,362,377
- Issue date Jul 23, 2019
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS microphone package
- Patent number 10,362,406
- Issue date Jul 23, 2019
- LINGSEN PRECISION INDSUTRIES, LTD.
- Yao-Ting Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone package
- Patent number 10,299,046
- Issue date May 21, 2019
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone packaging method
- Patent number 9,309,108
- Issue date Apr 12, 2016
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked MEMS microphone packaging method
- Patent number 9,260,298
- Issue date Feb 16, 2016
- Lingsen Precision Industries, Ltd.
- Hsien-Ken Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DEVICE
- Publication number 20250212448
- Publication date Jun 26, 2025
- Vanguard International Semiconductor Corporation
- Ting-Yu CHANG
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
- Publication number 20250141220
- Publication date May 1, 2025
- Vanguard International Semiconductor Corporation
- Chih-Hsuan LIN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE AND TRANSISTOR STRU...
- Publication number 20250098244
- Publication date Mar 20, 2025
- Vanguard International Semiconductor Corporation
- Ting-Yu CHANG
Information Patent Application
ALL-OXIDE TRANSISTOR STRUCTURE, METHOD FOR FABRICATING THE SAME AND...
- Publication number 20250098414
- Publication date Mar 20, 2025
- Industrial Technology Research Institute
- Haw-Tyng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DEVICE
- Publication number 20240213241
- Publication date Jun 27, 2024
- Vanguard International Semiconductor Corporation
- Yeh-Ning JOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230387103
- Publication date Nov 30, 2023
- Vanguard International Semiconductor Corporation
- Hsien-Feng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
- Publication number 20230335546
- Publication date Oct 19, 2023
- Vanguard International Semiconductor Corporation
- Shao-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
- Publication number 20230198250
- Publication date Jun 22, 2023
- Vanguard International Semiconductor Corporation
- Yeh-Ning JOU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220386004
- Publication date Dec 1, 2022
- XMEMS TAIWAN CO., LTD.
- Hsien-Ken Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210314688
- Publication date Oct 7, 2021
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING SOUND PRODUCING CHIP...
- Publication number 20210297787
- Publication date Sep 23, 2021
- xMEMS Labs, Inc.
- Chiung C. Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DEVICES
- Publication number 20200321328
- Publication date Oct 8, 2020
- Vanguard International Semiconductor Corporation
- Yeh-Ning JOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT T...
- Publication number 20200083704
- Publication date Mar 12, 2020
- Vanguard International Semiconductor Corporation
- Shao-Chang HUANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20180063615
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE
- Publication number 20180063616
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20180063645
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yao-Ting YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20180063646
- Publication date Mar 1, 2018
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TENT PEG HAMMER ASSEMBLY
- Publication number 20170225312
- Publication date Aug 10, 2017
- Hsien-Hai LIAO
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
FLIP-CHIP MEMS MICROPHONE
- Publication number 20160157024
- Publication date Jun 2, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS MICROPHONE PACKAGING METHOD
- Publication number 20160052779
- Publication date Feb 25, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED MEMS MICROPHONE PACKAGING METHOD
- Publication number 20160052780
- Publication date Feb 25, 2016
- LINGSEN PRECISION INDUSTRIES, LTD.
- Hsien-Ken LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming a bottle-shaped trench
- Publication number 20040175877
- Publication date Sep 9, 2004
- Shian-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS

Hsien-Ken LIAO

Person

Patents Grantslast 30 patents

Electrostatic discharge protection device

All-oxide transistor structure, method for fabricating the same and...

Electrostatic discharge protection circuit

Sound producing package structure and manufacturing method thereof

Sound producing package structure and manufacturing method thereof

Protection circuits

Electrostatic discharge protection devices

Package structure and methods of manufacturing sound producing chip...

Integrated circuit and electrostatic discharge protection circuit t...

MEMS microphone package

MEMS microphone package

MEMS microphone package

MEMS microphone packaging method

Stacked MEMS microphone packaging method

Patents Applicationslast 30 patents

ELECTROSTATIC DISCHARGE PROTECTION DEVICE

ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT

ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE AND TRANSISTOR STRU...

ALL-OXIDE TRANSISTOR STRUCTURE, METHOD FOR FABRICATING THE SAME AND...

ELECTROSTATIC DISCHARGE PROTECTION DEVICE

SEMICONDUCTOR STRUCTURE

ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT

ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT

SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING SOUND PRODUCING CHIP...

ELECTROSTATIC DISCHARGE PROTECTION DEVICES

INTEGRATED CIRCUIT AND ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT T...

MEMS MICROPHONE PACKAGE

MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE

MEMS MICROPHONE PACKAGE

MEMS MICROPHONE PACKAGE

TENT PEG HAMMER ASSEMBLY

FLIP-CHIP MEMS MICROPHONE

MEMS MICROPHONE PACKAGING METHOD

STACKED MEMS MICROPHONE PACKAGING METHOD

Method of forming a bottle-shaped trench