Hsien-Liang Meng

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,211,261
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multi-thermal interface materials and methods of fabr...
- Patent number 11,088,109
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package
- Patent number 10,872,831
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Shin Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,269,669
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Shin Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 10,049,894
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero stand-off bonding system and method
- Patent number 9,418,956
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 9,362,236
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming backside illuminated image sensor device str...
- Patent number 9,129,878
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering target with reverse erosion profile surface and sputteri...
- Patent number 9,127,356
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Liang Chueh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Zero stand-off bonding system and method
- Patent number 9,064,880
- Issue date Jun 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complementary metal-oxide-semiconductor device and fabricating meth...
- Patent number 7,402,496
- Issue date Jul 22, 2008
- United Microelectronics Corp.
- Che-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide semiconductor transistor device
- Patent number 7,288,828
- Issue date Oct 30, 2007
- United Microelectronics Corp.
- Huan-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating shallow trench isolation structure
- Patent number 6,225,189
- Issue date May 1, 2001
- United Microelectronics Corp.
- Chun-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing shallow trench isolation
- Patent number 6,204,147
- Issue date Mar 20, 2001
- United Silicon Incorporated
- Chun-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an insulating film
- Patent number 6,187,692
- Issue date Feb 13, 2001
- United Silicon Incorporated
- Shih-Ming Lan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of removing copper oxide within via hole
- Patent number 6,124,204
- Issue date Sep 26, 2000
- United Silicon Incorporated
- Shih-Ming Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a TiN/W barrier layer for a hot Al plug
- Patent number 5,963,830
- Issue date Oct 5, 1999
- Mosel Vitelic Incorporated
- Pei-Jan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of in-situ wafer cooling for a sequential WSI/alpha -Si sput...
- Patent number 5,770,515
- Issue date Jun 23, 1998
- Mosel Vitelic Incorporated
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH MULTI-THERMAL INTERFACE MATERIALS AND METHODS OF FABR...
- Publication number 20200161275
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR PACKAGE
- Publication number 20190252277
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Shin HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods for Forming the Same
- Publication number 20180342404
- Publication date Nov 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20180166351
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Shin HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods for Forming the Same
- Publication number 20160268145
- Publication date Sep 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zero Stand-Off Bonding System and Method
- Publication number 20150303161
- Publication date Oct 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE STR...
- Publication number 20150076638
- Publication date Mar 19, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Bo-Chang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods for Forming the Same
- Publication number 20140252594
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Liang Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zero Stand-Off Bonding System and Method
- Publication number 20140183746
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTERING TARGET WITH REVERSE EROSION PROFILE SURFACE AND SPUTTERI...
- Publication number 20130043120
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Liang CHUEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING DUAL FULLY-SILI...
- Publication number 20110294287
- Publication date Dec 1, 2011
- United Microelectronics Corp.
- CHIN-HSIANG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-oxide-semiconductor transistor device, manufacturing method t...
- Publication number 20080194070
- Publication date Aug 14, 2008
- Hung-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080164529
- Publication date Jul 10, 2008
- United Microelectronics Corp.
- CHIN-HSIANG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICE
- Publication number 20080116525
- Publication date May 22, 2008
- United Microelectronics Corp.
- Che-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICE AND FABRICATING METH...
- Publication number 20080061366
- Publication date Mar 13, 2008
- United Microelectronics Corp.
- Che-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-oxide-semiconductor transistor device, manufacturing method t...
- Publication number 20080017931
- Publication date Jan 24, 2008
- Hung-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR TRANSISTOR DEVICE
- Publication number 20070075378
- Publication date Apr 5, 2007
- Huan-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN OPENING IN A DIELECTRIC LAYER IN INTEGRATED CI...
- Publication number 20010051424
- Publication date Dec 13, 2001
- ANDREW LIN
- H01 - BASIC ELECTRIC ELEMENTS

Hsien-Liang Meng

Person

Patents Grantslast 30 patents

Package structures and methods for forming the same

Packages with multi-thermal interface materials and methods of fabr...

Method of forming a semiconductor package

Semiconductor package and method of forming the same

Package structures and methods for forming the same

Zero stand-off bonding system and method

Package structures and methods for forming the same

Mechanisms for forming backside illuminated image sensor device str...

Sputtering target with reverse erosion profile surface and sputteri...

Zero stand-off bonding system and method

Complementary metal-oxide-semiconductor device and fabricating meth...

Metal oxide semiconductor transistor device

Method of fabricating shallow trench isolation structure

Method of manufacturing shallow trench isolation

Method for forming an insulating film

Method of removing copper oxide within via hole

Method of forming a TiN/W barrier layer for a hot Al plug

Method of in-situ wafer cooling for a sequential WSI/alpha -Si sput...

Patents Applicationslast 30 patents

PACKAGES WITH MULTI-THERMAL INTERFACE MATERIALS AND METHODS OF FABR...

METHOD OF FORMING A SEMICONDUCTOR PACKAGE

Package Structures and Methods for Forming the Same

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Package Structures and Methods for Forming the Same

Zero Stand-Off Bonding System and Method

MECHANISMS FOR FORMING BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE STR...

Package Structures and Methods for Forming the Same

Zero Stand-Off Bonding System and Method

SPUTTERING TARGET WITH REVERSE EROSION PROFILE SURFACE AND SPUTTERI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING DUAL FULLY-SILI...

Metal-oxide-semiconductor transistor device, manufacturing method t...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICE

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICE AND FABRICATING METH...

Metal-oxide-semiconductor transistor device, manufacturing method t...

METAL OXIDE SEMICONDUCTOR TRANSISTOR DEVICE

METHOD OF FORMING AN OPENING IN A DIELECTRIC LAYER IN INTEGRATED CI...