Hsin-Yun Chang

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Through-circuit Vias in interconnect structures
- Patent number 12,293,959
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and substrate structure thereof
- Patent number 12,278,173
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-circuit vias in interconnect structures
- Patent number 12,243,805
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for mobilizing stem cells
- Patent number 12,188,049
- Issue date Jan 7, 2025
- Tzu Chi University
- Hsin-Hou Chang
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Preparation method of trilaciclib and precursors of trilaciclib
- Patent number 12,006,324
- Issue date Jun 11, 2024
- CHUNGHWA CHEMICAL SYNTHESIS & BIOTECH CO. LTD
- Satyanarayana Kamani
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Ceiling fan blade assembly structure
- Patent number 12,000,407
- Issue date Jun 4, 2024
- Hoteck Inc.
- Lung-Fa Hsieh
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Translating pivot hinge
- Patent number 11,983,046
- Issue date May 14, 2024
- Dell Products L.P.
- Anthony J. Sanchez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indexable center drill structure
- Patent number 11,925,990
- Issue date Mar 12, 2024
- Hsin-Tien Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image processing device, image processing method and 3D image gener...
- Patent number 11,689,710
- Issue date Jun 27, 2023
- Coretronic Corporation
- Hsin-Yueh Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Through-circuit vias in interconnect structures
- Patent number 11,616,002
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Torque-adjustable pneumatic tool
- Patent number 11,597,060
- Issue date Mar 7, 2023
- Airboss Air Tools Co., Ltd.
- Hsin He Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Assembled chamfer mill
- Patent number 11,583,941
- Issue date Feb 21, 2023
- Hsin-Tien Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure with resilient positioning flaps
- Patent number 11,407,553
- Issue date Aug 9, 2022
- Alpha Networks Inc.
- Pin-Ying Wu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate having through via and method of fabricating the same
- Patent number 11,406,022
- Issue date Aug 2, 2022
- Industrial Technology Research Institute
- Chih-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for motion test and control host of movable machinery
- Patent number 11,378,493
- Issue date Jul 5, 2022
- Industrial Technology Research Institute
- Ming-Chun Ho
- G01 - MEASURING TESTING
Information Patent Grant
Cutting method for forming chamfered corners
- Patent number 11,338,392
- Issue date May 24, 2022
- Industrial Technology Research Institute
- Hsin-Yu Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating semiconductor device including dummy via anch...
- Patent number 11,302,654
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination system and projection apparatus
- Patent number 11,249,379
- Issue date Feb 15, 2022
- Coretronic Corporation
- Hsin-Yueh Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Projector and projection method thereof
- Patent number 11,170,733
- Issue date Nov 9, 2021
- Coretronic Corporation
- Hsin-Yueh Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Illumination system, wavelength conversion module, projection appar...
- Patent number 11,163,227
- Issue date Nov 2, 2021
- Coretronic Corporation
- Chun-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hidden type split hinge
- Patent number 11,009,061
- Issue date May 18, 2021
- Jarllytec Co., Ltd.
- Jui-Hung Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
- Patent number 10,910,267
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for supporting a semiconductor wafer and method of vibrat...
- Patent number 10,871,720
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Astha Sharma
- B24 - GRINDING POLISHING
Information Patent Grant
Display device and display system with power-saving mechanism
- Patent number 10,795,426
- Issue date Oct 6, 2020
- Novatek Microelectronics Corp.
- Hsin-Yi Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including dummy via anchored to dummy metal layer
- Patent number 10,777,510
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pneumatic signal generating device for a pneumatic tool
- Patent number 10,766,126
- Issue date Sep 8, 2020
- AIRBOSS AIR TOOL CO., LTD.
- Hsin-He Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Torque-adjustable pneumatic tool
- Patent number 10,766,129
- Issue date Sep 8, 2020
- AIRBOSS AIR TOOL CO., LTD.
- Hsin He Chang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Alignment marks in substrate having through-substrate via (TSV)
- Patent number 10,692,764
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vesicles comprising lectins expressed on the surface and methods of...
- Patent number 10,584,154
- Issue date Mar 10, 2020
- Tzu Chi University
- Hsin-Hou Chang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250201695
- Publication date Jun 19, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming
- Publication number 20250118609
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD TO REDUCE POWER CONSUMPTION DURING ACCESS
- Publication number 20250103284
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Ming-Hung HSIEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Bluetooth communication system, Bluetooth access point apparatus an...
- Publication number 20250081255
- Publication date Mar 6, 2025
- REALTEK SEMICONDUCTOR CORPORATION
- CHIA-CHUN HUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR OPTIMIZING DATA TO BE USED TO TRAIN OBJECT RECOGNITION M...
- Publication number 20240282083
- Publication date Aug 22, 2024
- Linker Vision Co., Ltd.
- Paul Yuan-Bao SHIEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dual Bluetooth architecture of single IC and control method thereof
- Publication number 20240275423
- Publication date Aug 15, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- YOU-RUNG CHOU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PREPARATION METHOD OF TRILACICLIB AND PRECURSORS OF TRILACICLIB
- Publication number 20240217984
- Publication date Jul 4, 2024
- CHUNGHWA CHEMICAL SYNTHESIS & BIOTECH CO. LTD.
- Satyanarayana KAMANI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240213180
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR RECYCLING ALL TYPES OF LITHIUM BATTERIES
- Publication number 20240128531
- Publication date Apr 18, 2024
- Cleanaway Company Limited
- CHIH-HUANG LAI
- C01 - INORGANIC CHEMISTRY
Information Patent Application
INTEGRATED CEILING FAN AND CEILING FAN CONNECTING DEVICE
- Publication number 20230417257
- Publication date Dec 28, 2023
- Hoteck Inc.
- KAI-JEN TSAI
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
GRAPHENE-METAL HYBRID INTERCONNECT
- Publication number 20230402384
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Circuit Vias In Interconnect Structures
- Publication number 20230386973
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20230343692
- Publication date Oct 26, 2023
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20230253342
- Publication date Aug 10, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsiu-Fang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDEXABLE CENTER DRILL STRUCTURE
- Publication number 20230219146
- Publication date Jul 13, 2023
- HSIN-TIEN CHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRAP-BASED VARIABLE MODULAR CUSHIONING MATERIAL FOR USE BY TYING
- Publication number 20230166898
- Publication date Jun 1, 2023
- Alpha Networks Inc.
- TZU-CHIH LIN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
TRANSLATING PIVOT HINGE
- Publication number 20230068228
- Publication date Mar 2, 2023
- Dell Products L.P.
- Anthony J. Sanchez
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Application
THERMAL IMAGE AUXILIARY PROCESSING DEVICE, POSITIONING DEVICE AND M...
- Publication number 20230057196
- Publication date Feb 23, 2023
- Industrial Technology Research Institute
- Sheng-Yu CHUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230013102
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chih WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Circuit Vias In Interconnect Structures
- Publication number 20220367323
- Publication date Nov 17, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD AND 3D IMAGE GENER...
- Publication number 20220321869
- Publication date Oct 6, 2022
- CORETRONIC CORPORATION
- Hsin-Yueh Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELASTIC COMPOSITE STRUCTURE HAVING LOW-DENSITY FOAM MATERIAL AND RE...
- Publication number 20220281670
- Publication date Sep 8, 2022
- Alpha Networks Inc.
- HSIN-YI CHANG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PROJECTION DEVICE
- Publication number 20220244628
- Publication date Aug 4, 2022
- CORETRONIC CORPORATION
- Shi-Hao Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220216165
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOTION TEST AND CONTROL HOST OF MOVABLE MACHINERY
- Publication number 20220205875
- Publication date Jun 30, 2022
- Industrial Technology Research Institute
- Ming-Chun Ho
- G01 - MEASURING TESTING
Information Patent Application
ASSEMBLED CHAMFER MILL
- Publication number 20220168823
- Publication date Jun 2, 2022
- HSIN-TIEN CHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE WITH RESILIENT POSITIONING FLAPS
- Publication number 20220161961
- Publication date May 26, 2022
- Alpha Networks Inc.
- PIN-YING WU
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE HAVING THROUGH VIA AND METHOD OF FABRICATING THE SAME
- Publication number 20220141961
- Publication date May 5, 2022
- Industrial Technology Research Institute
- Chih-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING AND/OR TREATING A STRESS-INDUCED DISEASE
- Publication number 20210393585
- Publication date Dec 23, 2021
- TZU CHI UNIVERSITY
- Hsin-Hou CHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Through-Circuit Vias in Interconnect Structures
- Publication number 20210375723
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS

Hsin-Yun Chang

Person

Patents Grantslast 30 patents

Through-circuit Vias in interconnect structures

Electronic package and substrate structure thereof

Through-circuit vias in interconnect structures

Methods for mobilizing stem cells

Preparation method of trilaciclib and precursors of trilaciclib

Ceiling fan blade assembly structure

Translating pivot hinge

Interconnect structure and forming method thereof

Indexable center drill structure

Image processing device, image processing method and 3D image gener...

Through-circuit vias in interconnect structures

Torque-adjustable pneumatic tool

Assembled chamfer mill

Packaging structure with resilient positioning flaps

Substrate having through via and method of fabricating the same

Method for motion test and control host of movable machinery

Cutting method for forming chamfered corners

Method of fabricating semiconductor device including dummy via anch...

Illumination system and projection apparatus

Projector and projection method thereof

Illumination system, wavelength conversion module, projection appar...

Hidden type split hinge

Alignment marks in substrate having through-substrate via (TSV)

Apparatus for supporting a semiconductor wafer and method of vibrat...

Display device and display system with power-saving mechanism

Semiconductor device including dummy via anchored to dummy metal layer

Pneumatic signal generating device for a pneumatic tool

Torque-adjustable pneumatic tool

Alignment marks in substrate having through-substrate via (TSV)

Vesicles comprising lectins expressed on the surface and methods of...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

Semiconductor Packages and Methods of Forming

ELECTRONIC DEVICE AND METHOD TO REDUCE POWER CONSUMPTION DURING ACCESS

Bluetooth communication system, Bluetooth access point apparatus an...

METHOD FOR OPTIMIZING DATA TO BE USED TO TRAIN OBJECT RECOGNITION M...

Dual Bluetooth architecture of single IC and control method thereof

PREPARATION METHOD OF TRILACICLIB AND PRECURSORS OF TRILACICLIB

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

METHOD FOR RECYCLING ALL TYPES OF LITHIUM BATTERIES

INTEGRATED CEILING FAN AND CEILING FAN CONNECTING DEVICE

GRAPHENE-METAL HYBRID INTERCONNECT

Through-Circuit Vias In Interconnect Structures

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

INDEXABLE CENTER DRILL STRUCTURE

STRAP-BASED VARIABLE MODULAR CUSHIONING MATERIAL FOR USE BY TYING

TRANSLATING PIVOT HINGE

THERMAL IMAGE AUXILIARY PROCESSING DEVICE, POSITIONING DEVICE AND M...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Through-Circuit Vias In Interconnect Structures

IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD AND 3D IMAGE GENER...

ELASTIC COMPOSITE STRUCTURE HAVING LOW-DENSITY FOAM MATERIAL AND RE...

PROJECTION DEVICE

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

METHOD FOR MOTION TEST AND CONTROL HOST OF MOVABLE MACHINERY

ASSEMBLED CHAMFER MILL

PACKAGING STRUCTURE WITH RESILIENT POSITIONING FLAPS

SUBSTRATE HAVING THROUGH VIA AND METHOD OF FABRICATING THE SAME

METHOD FOR PREVENTING AND/OR TREATING A STRESS-INDUCED DISEASE

Through-Circuit Vias in Interconnect Structures