Hsing-Chih LIN

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,225,834
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsing-Lien Lin
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor and method of manufacturing the same
- Patent number 12,218,165
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with a symmetrical capacitor insulator structure
- Patent number 12,199,029
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,178,147
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hai-Dang Trinh
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,161,057
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsing-Lien Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Ferroelectric memory device and method of manufacturing the same
- Patent number 12,137,572
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Yang Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-electrode barrier layer for RRAM
- Patent number 12,114,582
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
Information Patent Grant
Ferroelectric random access memory device with seed layer
- Patent number 12,069,867
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bi-Shen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching layer scheme to enhance RRAM performance
- Patent number 12,069,971
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor device and method
- Patent number 12,057,446
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside capacitor techniques
- Patent number 12,034,037
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside or frontside through substrate via (TSV) landing on metal
- Patent number 12,033,919
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zheng-Xun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous bottom electrode structure for MIM capacitors
- Patent number 12,021,113
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor structure with microstructures on backside surfac...
- Patent number 11,996,429
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Nan Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,991,937
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hai-Dang Trinh
Information Patent Grant
Rram structure
- Patent number 11,963,468
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,428
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and methods of fabricating thereof
- Patent number 11,942,368
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer electrode to improve performance of ferroelectric memor...
- Patent number 11,916,127
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Yang Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive memory cell with switching layer comprising one or more d...
- Patent number 11,895,933
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fa-Shen Jiang
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 11,887,929
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-via with reentrant profile
- Patent number 11,862,535
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal device with improved performance
- Patent number 11,854,959
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FeRAM with laminated ferroelectric film and method forming same
- Patent number 11,844,226
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bi-Shen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing thermal dispersion layer in programmable m...
- Patent number 11,800,823
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fa-Shen Jiang
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor device and method
- Patent number 11,791,332
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shield structure for backside through substrate v...
- Patent number 11,764,129
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS
- Publication number 20250048658
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME
- Publication number 20250022912
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...
- Publication number 20250014987
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS
- Publication number 20250015124
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ferroelectric Memory Device and Method of Manufacturing the Same
- Publication number 20240381664
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Yang Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...
- Publication number 20240379711
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20240379528
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-ELECTRODE BARRIER LAYER FOR RRAM
- Publication number 20240373763
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
Information Patent Application
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
- Publication number 20240355784
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240355815
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE OR FRONTSIDE THROUGH SUBSTRATE VIA (TSV) LANDING ON METAL
- Publication number 20240355710
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Xun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CAPACITOR TECHNIQUES
- Publication number 20240347582
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC RANDOM ACCESS MEMORY DEVICE WITH SEED LAYER
- Publication number 20240334709
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bi-Shen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS BOTTOM ELECTRODE STRUCTURE FOR MIM CAPACITORS
- Publication number 20240304659
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR STRUCTURE
- Publication number 20240274632
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Nan TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF
- Publication number 20240266219
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240222261
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-FENG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RRAM STRUCTURE
- Publication number 20240224822
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hai-Dang Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240222262
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-FENG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC
- Publication number 20240186238
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVE MEMORY CELL WITH SWITCHING LAYER COMPRISING ONE OR MORE D...
- Publication number 20240138272
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fa-Shen Jiang
Information Patent Application
EXTENDED VIA CONNECT FOR PIXEL ARRAY
- Publication number 20240096784
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE
- Publication number 20240087988
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Ling Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FeRAM with Laminated Ferroelectric Film and Method Forming Same
- Publication number 20240064998
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bi-Shen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20240021514
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ELECTRODE TO IMPROVE PERFORMANCE OF FERROELECTRIC MEMOR...
- Publication number 20240021700
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Yang Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISPERSION LAYER IN PROGRAMMABLE METALLIZATION CELL
- Publication number 20240023464
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fa-Shen Jiang
- G11 - INFORMATION STORAGE
Information Patent Application
MIM CAPACITOR AND METHOD OF FORMING THE SAME
- Publication number 20230420493
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CAPACITORS WITH SHARED ELECTRODES
- Publication number 20230411277
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Hsien Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stacked Semiconductor Device and Method
- Publication number 20230387106
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS

Hsing-Chih LIN

Person

Patents Grantslast 30 patents

Shield structure for backside through substrate vias (TSVs)

Method for forming semiconductor structure

Backside contact to improve thermal dissipation away from semicondu...

Semiconductor image sensor and method of manufacturing the same

Oversized via as through-substrate-via (TSV) stop layer

MIM capacitor with a symmetrical capacitor insulator structure

Semiconductor device and method for manufacturing the same

Method for forming semiconductor structure

Ferroelectric memory device and method of manufacturing the same

Top-electrode barrier layer for RRAM

Ferroelectric random access memory device with seed layer

Switching layer scheme to enhance RRAM performance

Stacked semiconductor device and method

Backside capacitor techniques

Backside or frontside through substrate via (TSV) landing on metal

Amorphous bottom electrode structure for MIM capacitors

CMOS image sensor structure with microstructures on backside surfac...

Semiconductor device and method for manufacturing the same

Rram structure

Semiconductor structure and manufacturing method thereof

Through silicon vias and methods of fabricating thereof

Multi-layer electrode to improve performance of ferroelectric memor...

Resistive memory cell with switching layer comprising one or more d...

Techniques to inhibit delamination from flowable gap-fill dielectric

Through-substrate-via with reentrant profile

Metal-insulator-metal device with improved performance

FeRAM with laminated ferroelectric film and method forming same

Method for manufacturing thermal dispersion layer in programmable m...

Stacked semiconductor device and method

Method of forming shield structure for backside through substrate v...

Patents Applicationslast 30 patents

CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS

HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME

INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...

METAL-INSULATOR-METAL CAPACITORS

Ferroelectric Memory Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...

METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE

TOP-ELECTRODE BARRIER LAYER FOR RRAM

HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS

STACKED SEMICONDUCTOR DEVICE AND METHOD

BACKSIDE OR FRONTSIDE THROUGH SUBSTRATE VIA (TSV) LANDING ON METAL

BACKSIDE CAPACITOR TECHNIQUES

FERROELECTRIC RANDOM ACCESS MEMORY DEVICE WITH SEED LAYER

AMORPHOUS BOTTOM ELECTRODE STRUCTURE FOR MIM CAPACITORS

CMOS IMAGE SENSOR STRUCTURE

THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

RRAM STRUCTURE

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC

RESISTIVE MEMORY CELL WITH SWITCHING LAYER COMPRISING ONE OR MORE D...

EXTENDED VIA CONNECT FOR PIXEL ARRAY

THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE

FeRAM with Laminated Ferroelectric Film and Method Forming Same

A METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE

MULTI-LAYER ELECTRODE TO IMPROVE PERFORMANCE OF FERROELECTRIC MEMOR...

THERMAL DISPERSION LAYER IN PROGRAMMABLE METALLIZATION CELL

MIM CAPACITOR AND METHOD OF FORMING THE SAME

EMBEDDED CAPACITORS WITH SHARED ELECTRODES

Stacked Semiconductor Device and Method