Hsing-Chih LIN

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Resistive memory cell with switching layer comprising one or more d...
- Patent number 12,364,171
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fa-Shen Jiang
Information Patent Grant
FeRAM with laminated ferroelectric film and method forming same
- Patent number 12,356,631
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bi-Shen Lee
Information Patent Grant
Capacitor structure and method of making the same
- Patent number 12,336,201
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jian-Shiou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal device with improved performance
- Patent number 12,322,694
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding technology for stacking integrated circuits
- Patent number 12,315,843
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RRAM device with improved performance
- Patent number 12,295,270
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fa-Shen Jiang
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,283,564
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including image sensor and method of forming t...
- Patent number 12,278,250
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques to inhibit delamination from flowable gap-fill dielectric
- Patent number 12,266,604
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer in top electrode to increase break down vol...
- Patent number 12,261,197
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive memory cell having a low forming voltage
- Patent number 12,239,035
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,225,834
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsing-Lien Lin
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor and method of manufacturing the same
- Patent number 12,218,165
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with a symmetrical capacitor insulator structure
- Patent number 12,199,029
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,178,147
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hai-Dang Trinh
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,161,057
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsing-Lien Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Ferroelectric memory device and method of manufacturing the same
- Patent number 12,137,572
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Yang Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-electrode barrier layer for RRAM
- Patent number 12,114,582
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
Information Patent Grant
Ferroelectric random access memory device with seed layer
- Patent number 12,069,867
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bi-Shen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching layer scheme to enhance RRAM performance
- Patent number 12,069,971
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor device and method
- Patent number 12,057,446
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside capacitor techniques
- Patent number 12,034,037
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside or frontside through substrate via (TSV) landing on metal
- Patent number 12,033,919
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zheng-Xun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous bottom electrode structure for MIM capacitors
- Patent number 12,021,113
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor structure with microstructures on backside surfac...
- Patent number 11,996,429
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Nan Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,991,937
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hai-Dang Trinh

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20250241211
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fa-Shen Jiang
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250219016
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250221067
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
Information Patent Application
INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...
- Publication number 20250201696
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ko Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING
- Publication number 20250203884
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaio-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER IN TOP ELECTRODE TO INCREASE BREAK DOWN VOL...
- Publication number 20250194121
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVE MEMORY CELL HAVING A LOW FORMING VOLTAGE
- Publication number 20250176447
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hai-Dang Trinh
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250143000
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-FENG KAO
Information Patent Application
INTEGRATED CIRCUIT FABRICATION EMPLOYING SELF-ALIGNED MASK
- Publication number 20250126812
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
Information Patent Application
MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE
- Publication number 20250105137
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20250105098
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250081864
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HAI-DANG TRINH
Information Patent Application
CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS
- Publication number 20250048658
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME
- Publication number 20250022912
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...
- Publication number 20250014987
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS
- Publication number 20250015124
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ferroelectric Memory Device and Method of Manufacturing the Same
- Publication number 20240381664
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Yang Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...
- Publication number 20240379711
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20240379528
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-ELECTRODE BARRIER LAYER FOR RRAM
- Publication number 20240373763
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
Information Patent Application
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
- Publication number 20240355784
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240355815
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE OR FRONTSIDE THROUGH SUBSTRATE VIA (TSV) LANDING ON METAL
- Publication number 20240355710
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Xun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CAPACITOR TECHNIQUES
- Publication number 20240347582
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC RANDOM ACCESS MEMORY DEVICE WITH SEED LAYER
- Publication number 20240334709
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bi-Shen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS BOTTOM ELECTRODE STRUCTURE FOR MIM CAPACITORS
- Publication number 20240304659
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR STRUCTURE
- Publication number 20240274632
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Nan TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF
- Publication number 20240266219
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS

Hsing-Chih LIN

Person

Patents Grantslast 30 patents

Resistive memory cell with switching layer comprising one or more d...

FeRAM with laminated ferroelectric film and method forming same

Capacitor structure and method of making the same

Metal-insulator-metal device with improved performance

Hybrid bonding technology for stacking integrated circuits

Backside contact for thermal displacement in a multi-wafer stacked...

RRAM device with improved performance

Semiconductor structure and manufacturing method thereof

Semiconductor device including image sensor and method of forming t...

Techniques to inhibit delamination from flowable gap-fill dielectric

Diffusion barrier layer in top electrode to increase break down vol...

Resistive memory cell having a low forming voltage

Shield structure for backside through substrate vias (TSVs)

Method for forming semiconductor structure

Backside contact to improve thermal dissipation away from semicondu...

Semiconductor image sensor and method of manufacturing the same

Oversized via as through-substrate-via (TSV) stop layer

MIM capacitor with a symmetrical capacitor insulator structure

Semiconductor device and method for manufacturing the same

Method for forming semiconductor structure

Ferroelectric memory device and method of manufacturing the same

Top-electrode barrier layer for RRAM

Ferroelectric random access memory device with seed layer

Switching layer scheme to enhance RRAM performance

Stacked semiconductor device and method

Backside capacitor techniques

Backside or frontside through substrate via (TSV) landing on metal

Amorphous bottom electrode structure for MIM capacitors

CMOS image sensor structure with microstructures on backside surfac...

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

MEMORY DEVICE WITH IMPROVED PERFORMANCE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...

METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING

DIFFUSION BARRIER LAYER IN TOP ELECTRODE TO INCREASE BREAK DOWN VOL...

RESISTIVE MEMORY CELL HAVING A LOW FORMING VOLTAGE

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT FABRICATION EMPLOYING SELF-ALIGNED MASK

MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS

HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME

INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...

METAL-INSULATOR-METAL CAPACITORS

Ferroelectric Memory Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...

METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE

TOP-ELECTRODE BARRIER LAYER FOR RRAM

HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS

STACKED SEMICONDUCTOR DEVICE AND METHOD

BACKSIDE OR FRONTSIDE THROUGH SUBSTRATE VIA (TSV) LANDING ON METAL

BACKSIDE CAPACITOR TECHNIQUES

FERROELECTRIC RANDOM ACCESS MEMORY DEVICE WITH SEED LAYER

AMORPHOUS BOTTOM ELECTRODE STRUCTURE FOR MIM CAPACITORS

CMOS IMAGE SENSOR STRUCTURE

THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF