Hsing-Hua Tsai

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line devices
- Patent number 12,068,377
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,855,145
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsing-I Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line devices
- Patent number 11,799,001
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver nano-twinned thin film structure and method for forming the...
- Patent number 11,488,920
- Issue date Nov 1, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Hsing-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based alloy wire and methods for manufaturing the same
- Patent number 9,997,488
- Issue date Jun 12, 2018
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of assembly grasp for palladium-alloy tubes and method fo...
- Patent number 9,901,865
- Issue date Feb 27, 2018
- Chien-Hsun Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stud bump structure and method for manufacturing the same
- Patent number 9,490,147
- Issue date Nov 8, 2016
- Wire Technology Co., Ltd.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump and package structure thereof and method of manufacturing...
- Patent number 9,425,168
- Issue date Aug 23, 2016
- Wire Technology Co., Ltd.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloy wire and methods for manufacturing the same
- Patent number 8,940,403
- Issue date Jan 27, 2015
- Wire Technology Co., Ltd.
- Jun-Der Lee
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Back-End-Of-Line Devices
- Publication number 20240371948
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240088224
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSING-I TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back-End-Of-Line Devices
- Publication number 20230369425
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230067210
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSING-I TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING TH...
- Publication number 20230057312
- Publication date Feb 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20230027664
- Publication date Jan 26, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING BONDING STRUCTURES
- Publication number 20220388092
- Publication date Dec 8, 2022
- National Taiwan University
- Tung-Han CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME
- Publication number 20220336407
- Publication date Oct 20, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE DEVICES
- Publication number 20220293749
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING THE...
- Publication number 20210225793
- Publication date Jul 22, 2021
- AG MATERIALS TECHNOLOGY CO.,LTD.
- Hsing-Hua TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC RIBBON FOR POWER MODULE PACKAGING
- Publication number 20180076167
- Publication date Mar 15, 2018
- WIRE TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF ASSEMBLY GRASP FOR PALLADIUM-ALLOY TUBES AND METHOD FO...
- Publication number 20170266608
- Publication date Sep 21, 2017
- Chien-Hsun Chuang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GRAPHENE COATED SILVER ALLOY WIRE AND METHODS FOR MANUFACTURING THE...
- Publication number 20170103823
- Publication date Apr 13, 2017
- WIRE TECHNOLOGY CO., LTD.
- Chien-Hsun Chuang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...
- Publication number 20150194409
- Publication date Jul 9, 2015
- WIRE TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME
- Publication number 20140209215
- Publication date Jul 31, 2014
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140124920
- Publication date May 8, 2014
- WIRE TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL TH...
- Publication number 20130233594
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...
- Publication number 20130233593
- Publication date Sep 12, 2013
- WIRE TECHNOLOGY CO., LTD.
- Jun-Der LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY WIRE AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20130171470
- Publication date Jul 4, 2013
- Jun-Der LEE
- B32 - LAYERED PRODUCTS

Hsing-Hua Tsai

Person

Patents Grantslast 30 patents

Bonding structures and methods for forming the same

Back-end-of-line devices

Semiconductor structure

Bonding structures and methods for forming the same

Back-end-of-line devices

Silver nano-twinned thin film structure and method for forming the...

Copper-based alloy wire and methods for manufaturing the same

Structure of assembly grasp for palladium-alloy tubes and method fo...

Stud bump structure and method for manufacturing the same

Stud bump and package structure thereof and method of manufacturing...

Alloy wire and methods for manufacturing the same

Patents Applicationslast 30 patents

Back-End-Of-Line Devices

SEMICONDUCTOR STRUCTURE

Back-End-Of-Line Devices

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

SEMICONDUCTOR STRUCTURE

METALLIC NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING TH...

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

METHODS FOR FORMING BONDING STRUCTURES

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME

BACK-END-OF-LINE DEVICES

SILVER NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING THE...

METALLIC RIBBON FOR POWER MODULE PACKAGING

STRUCTURE OF ASSEMBLY GRASP FOR PALLADIUM-ALLOY TUBES AND METHOD FO...

GRAPHENE COATED SILVER ALLOY WIRE AND METHODS FOR MANUFACTURING THE...

STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...

COPPER-BASED ALLOY WIRE AND METHODS FOR MANUFATURING THE SAME

STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL TH...

COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN...

ALLOY WIRE AND METHODS FOR MANUFACTURING THE SAME