Hsing Tsun Liu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure
- Patent number 12,165,961
- Issue date Dec 10, 2024
- Mediatek Inc.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 12,095,142
- Issue date Sep 17, 2024
- Mediatek Inc.
- Wen-Chou Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method forming the same
- Patent number 11,973,021
- Issue date Apr 30, 2024
- Vanguard International Semiconductor Corporation
- Kai-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,908,767
- Issue date Feb 20, 2024
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via array design for multi-layer redistribution circuit structure
- Patent number 11,776,899
- Issue date Oct 3, 2023
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,742,389
- Issue date Aug 29, 2023
- Vanguard International Semiconductor Corporation
- Hung-Chih Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 11,721,882
- Issue date Aug 8, 2023
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,710,688
- Issue date Jul 25, 2023
- Mediatek Inc.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,705,413
- Issue date Jul 18, 2023
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 11,509,038
- Issue date Nov 22, 2022
- Mediatek Inc.
- Wen-Chou Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage semiconductor device
- Patent number 11,393,921
- Issue date Jul 19, 2022
- Vanguard International Semiconductor Corporation
- Hung-Chih Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,302,657
- Issue date Apr 12, 2022
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,244,913
- Issue date Feb 8, 2022
- Mediatek Inc.
- Ying-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,227,846
- Issue date Jan 18, 2022
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with reduced noise
- Patent number 10,910,323
- Issue date Feb 2, 2021
- Mediatek Inc.
- Sheng-Mou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 10,847,869
- Issue date Nov 24, 2020
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage semiconductor device and method for manufacturing the...
- Patent number 10,629,726
- Issue date Apr 21, 2020
- Vanguard International Semiconductor Corporation
- Chung-Ren Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structures and methods for fabricating the same
- Patent number 10,615,249
- Issue date Apr 7, 2020
- Vanguard International Semiconductor Corporation
- Hsing-Chao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,276,679
- Issue date Apr 30, 2019
- Vanguard International Semiconductor Corporation
- Chien-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 10,276,563
- Issue date Apr 30, 2019
- Vanguard International Semiconductor Corporation
- Ying-Kai Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package and fabrication method thereof
- Patent number 10,074,628
- Issue date Sep 11, 2018
- Mediatek Inc.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad arrangement design for multi-die semiconductor package...
- Patent number 9,991,227
- Issue date Jun 5, 2018
- Mediatek Inc.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having gate in trenches
- Patent number 9,978,861
- Issue date May 22, 2018
- Vanguard International Semiconductor Corporation
- Chung-Ren Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, through-substrate via structures and methods...
- Patent number 9,972,534
- Issue date May 15, 2018
- Vanguard International Semiconductor Corporation
- Li-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse elements and methods for forming the same
- Patent number 9,799,601
- Issue date Oct 24, 2017
- Vanguard International Semiconductor Corporation
- Ming-Sheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad arrangment design for multi-die semiconductor package s...
- Patent number 9,564,395
- Issue date Feb 7, 2017
- Mediatek Inc.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 9,525,020
- Issue date Dec 20, 2016
- Vanguard International Semiconductor Corporation
- Chung-Ren Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage semiconductor device and method for manufacturing the...
- Patent number 9,343,572
- Issue date May 17, 2016
- Vangaurd International Semiconductor Corporation
- Chung-Ren Lao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20250015483
- Publication date Jan 9, 2025
- MEDIATEK INC.
- Wen-Chou Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234587
- Publication date Jul 11, 2024
- Vanguard International Semiconductor Corporation
- Chung-Ren LAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136447
- Publication date Apr 25, 2024
- Vanguard International Semiconductor Corporation
- Chung-Ren LAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240047460
- Publication date Feb 8, 2024
- Vanguard International Semiconductor Corporation
- Chih-Cherng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230422525
- Publication date Dec 28, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230317580
- Publication date Oct 5, 2023
- MEDIATEK INC.
- Hsing-Chih LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE HAVING A THICK LOGIC DIE
- Publication number 20230307421
- Publication date Sep 28, 2023
- MEDIATEK INC.
- Ta-Jen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME
- Publication number 20230105036
- Publication date Apr 6, 2023
- Vanguard International Semiconductor Corporation
- Kai-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20230039444
- Publication date Feb 9, 2023
- MEDIATEK INC.
- Wen-Chou Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220376052
- Publication date Nov 24, 2022
- Vanguard International Semiconductor Corporation
- Hung-Chih TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220367430
- Publication date Nov 17, 2022
- MEDIATEK INC.
- Yi-Jyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20220285297
- Publication date Sep 8, 2022
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220223512
- Publication date Jul 14, 2022
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220223491
- Publication date Jul 14, 2022
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20220102297
- Publication date Mar 31, 2022
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE SEMICONDUCTOR DEVICE
- Publication number 20220069122
- Publication date Mar 3, 2022
- Vanguard International Semiconductor Corporation
- Hung-Chih Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220013441
- Publication date Jan 13, 2022
- MEDIATEK INC.
- Hsing-Chih LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ARRAY DESIGN FOR MULTI-LAYER REDISTRIBUTION CIRCUIT STRUCTURE
- Publication number 20210351124
- Publication date Nov 11, 2021
- MEDIATEK INC.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210193540
- Publication date Jun 24, 2021
- MEDIATEK INC.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20210036405
- Publication date Feb 4, 2021
- MEDIATEK INC.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200402931
- Publication date Dec 24, 2020
- MEDIATEK INC.
- Ying-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20200303806
- Publication date Sep 24, 2020
- MEDIATEK INC.
- Wen-Chou Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20200243462
- Publication date Jul 30, 2020
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20200243464
- Publication date Jul 30, 2020
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDUCED NOISE
- Publication number 20200058633
- Publication date Feb 20, 2020
- MEDIATEK INC.
- Sheng-Mou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURES AND METHODS FOR FABRICATING THE SAME
- Publication number 20200027946
- Publication date Jan 23, 2020
- Vanguard International Semiconductor Corporation
- Hsing-Chao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180350931
- Publication date Dec 6, 2018
- Vanguard International Semiconductor Corporation
- Chien-Wei CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING MICROELECTRONIC PACKAGE WITH SURFACE MOUNTED...
- Publication number 20180294255
- Publication date Oct 11, 2018
- MEDIATEK INC.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180102298
- Publication date Apr 12, 2018
- MEDIATEK INC.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20180076282
- Publication date Mar 15, 2018
- Vanguard International Semiconductor Corporation
- Ying-Kai CHOU
- H01 - BASIC ELECTRIC ELEMENTS

Hsing Tsun Liu

Person

Patents Grantslast 30 patents

Semiconductor package structure

Semiconductor package having discrete antenna device

Semiconductor device and method forming the same

Semiconductor package having improved thermal interface between sem...

Semiconductor device

Semiconductor package structure

Via array design for multi-layer redistribution circuit structure

Semiconductor structure and method for forming the same

Semiconductor package having discrete antenna device

Semiconductor package structure

Semiconductor package having improved thermal interface between sem...

Semiconductor package having discrete antenna device

High-voltage semiconductor device

Semiconductor package having improved thermal interface between sem...

Semiconductor package

Semiconductor package having improved thermal interface between sem...

Semiconductor package with reduced noise

Semiconductor package having discrete antenna device

High-voltage semiconductor device and method for manufacturing the...

Capacitor structures and methods for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor devices and methods for forming the same

System-in-package and fabrication method thereof

Bonding pad arrangement design for multi-die semiconductor package...

Semiconductor device having gate in trenches

Semiconductor devices, through-substrate via structures and methods...

Fuse elements and methods for forming the same

Bonding pad arrangment design for multi-die semiconductor package s...

Semiconductor device and method for forming the same

High-voltage semiconductor device and method for manufacturing the...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE-ON-PACKAGE HAVING A THICK LOGIC DIE

SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

HIGH-VOLTAGE SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

VIA ARRAY DESIGN FOR MULTI-LAYER REDISTRIBUTION CIRCUIT STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE WITH REDUCED NOISE

CAPACITOR STRUCTURES AND METHODS FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FABRICATING MICROELECTRONIC PACKAGE WITH SURFACE MOUNTED...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME