Hsiu-Wen Tu

Person

Hsin-Chu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-scale sensor package structure
- Patent number 10,964,615
- Issue date Mar 30, 2021
- KINGPAK TECHNOLOGY INC.
- Li-Chun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,825,851
- Issue date Nov 3, 2020
- KINGPAK TECHNOLOGY INC.
- Sheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,720,370
- Issue date Jul 21, 2020
- KINGPAK TECHNOLOGY INC.
- Jian-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor
- Patent number 10,700,111
- Issue date Jun 30, 2020
- KINGPAK TECHNOLOGY INC.
- Li-Chun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,692,917
- Issue date Jun 23, 2020
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,600,830
- Issue date Mar 24, 2020
- KINGPAK TECHNOLOGY INC.
- Jian-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type sensor package structure
- Patent number 10,340,250
- Issue date Jul 2, 2019
- KINGPAK TECHNOLOGY INC.
- Jian-Ru Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package structure
- Patent number 10,236,313
- Issue date Mar 19, 2019
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,186,538
- Issue date Jan 22, 2019
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package structure
- Patent number 10,170,508
- Issue date Jan 1, 2019
- KINGPAK TECHNOLOGY INC.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing tilt of optical unit during manufacture of imag...
- Patent number 9,184,331
- Issue date Nov 10, 2015
- Kingpak Technology Inc.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-stage packaging method of image sensors
- Patent number 8,969,120
- Issue date Mar 3, 2015
- Kingpak Technology Inc.
- Chun-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure with black encapsulant
- Patent number 8,928,104
- Issue date Jan 6, 2015
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure with casing including a vent without...
- Patent number 8,847,146
- Issue date Sep 30, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level image sensor packaging structure and manufacturing meth...
- Patent number 8,828,777
- Issue date Sep 9, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and manufacturing method for high resolution camera module
- Patent number 8,703,519
- Issue date Apr 22, 2014
- Kingpak Technology Inc.
- Chun-Lung Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level image sensor packaging structure and manufacturing meth...
- Patent number 8,563,350
- Issue date Oct 22, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of molded image sensor packaging structure wit...
- Patent number 8,481,343
- Issue date Jul 9, 2013
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and structure for wafer level image sensor mod...
- Patent number 8,440,488
- Issue date May 14, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure with predetermined focal length
- Patent number 8,441,086
- Issue date May 14, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure with large air cavity
- Patent number 8,390,087
- Issue date Mar 5, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and structure of a wafer level image sensor mo...
- Patent number 8,378,441
- Issue date Feb 19, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for molding image sensor package structure and...
- Patent number 8,093,674
- Issue date Jan 10, 2012
- Kingpak Technology, Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module with air escape hole and a method for manufactu...
- Patent number 7,554,599
- Issue date Jun 30, 2009
- Kingpak Technology, Inc.
- Hsiu wen Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module with a protection layer and a method for manufa...
- Patent number 7,423,334
- Issue date Sep 9, 2008
- Kingpak Technology Inc.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an image sensor
- Patent number 6,874,227
- Issue date Apr 5, 2005
- Kingpak Technology Inc.
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module
- Patent number 6,870,208
- Issue date Mar 22, 2005
- Kingpak Technology Inc.
- Irving You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of image sensor and method for packaging the same
- Patent number 6,737,720
- Issue date May 18, 2004
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized image sensor
- Patent number 6,696,738
- Issue date Feb 24, 2004
- Kingpak Technology Inc.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure of an image sensor and packaging
- Patent number 6,646,316
- Issue date Nov 11, 2003
- Kingpak Technology, Inc.
- Jichen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-SCALE SENSOR PACKAGE STRUCTURE
- Publication number 20200273766
- Publication date Aug 27, 2020
- Kingpak Technology Inc.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20200119070
- Publication date Apr 16, 2020
- Kingpak Technology Inc.
- SHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR
- Publication number 20200098809
- Publication date Mar 26, 2020
- Kingpak Technology Inc.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190355639
- Publication date Nov 21, 2019
- Kingpak Technology Inc.
- JIAN-RU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SENSOR PACKAGE STRUCTURE
- Publication number 20190057952
- Publication date Feb 21, 2019
- Kingpak Technology Inc.
- Jian-Ru Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190057992
- Publication date Feb 21, 2019
- Kingpak Technology Inc.
- JIAN-RU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190019834
- Publication date Jan 17, 2019
- Kingpak Technology Inc.
- HSIU-WEN TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20180012920
- Publication date Jan 11, 2018
- Kingpak Technology Inc.
- HSIU-WEN TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20180012919
- Publication date Jan 11, 2018
- Kingpak Technology Inc.
- HSIU-WEN TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE
- Publication number 20170365632
- Publication date Dec 21, 2017
- Kingpak Technology Inc.
- Hsiu Wen TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STAGE PACKAGING METHOD OF IMAGE SENSORS
- Publication number 20150011038
- Publication date Jan 8, 2015
- KINGPAK TECHNOLOGY INC.
- Chun-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND MANUFACTURING METHOD FOR HIGH RESOLUTION CAMERA MODULE
- Publication number 20140098287
- Publication date Apr 10, 2014
- KINGPAK TECHNOLOGY INC.
- Chun-Lung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...
- Publication number 20130149805
- Publication date Jun 13, 2013
- KINGPAK TECHNOLOGY INC.
- Chun-Hua CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WIT...
- Publication number 20120068288
- Publication date Mar 22, 2012
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...
- Publication number 20110291215
- Publication date Dec 1, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MOD...
- Publication number 20110279815
- Publication date Nov 17, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...
- Publication number 20110241147
- Publication date Oct 6, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MO...
- Publication number 20110241146
- Publication date Oct 6, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT
- Publication number 20110156188
- Publication date Jun 30, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH
- Publication number 20110156187
- Publication date Jun 30, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...
- Publication number 20110024861
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY
- Publication number 20110024862
- Publication date Feb 3, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE
- Publication number 20110024610
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20090045476
- Publication date Feb 19, 2009
- KINGPAK TECHNOLOGY INC.
- Chen Pin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure and method for manufacturing the same
- Publication number 20080067334
- Publication date Mar 20, 2008
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure and method for manufacturing the same
- Publication number 20070241272
- Publication date Oct 18, 2007
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module with air escape hole and a method for manufactu...
- Publication number 20070206109
- Publication date Sep 6, 2007
- Hsiu wen Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor with a compound structure
- Publication number 20070108544
- Publication date May 17, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module with a protection layer and a method for manufa...
- Publication number 20070108577
- Publication date May 17, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module structure and a method for manufacturing the same
- Publication number 20070096280
- Publication date May 3, 2007
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS

Hsiu-Wen Tu

Person

Patents Grantslast 30 patents

Chip-scale sensor package structure

Sensor package structure

Sensor package structure

Optical sensor

Sensor package structure

Sensor package structure

Stack type sensor package structure

Sensor package structure

Sensor package structure

Optical package structure

Method for reducing tilt of optical unit during manufacture of imag...

Two-stage packaging method of image sensors

Image sensor packaging structure with black encapsulant

Image sensor package structure with casing including a vent without...

Wafer level image sensor packaging structure and manufacturing meth...

Structure and manufacturing method for high resolution camera module

Wafer level image sensor packaging structure and manufacturing meth...

Manufacturing method of molded image sensor packaging structure wit...

Manufacturing method and structure for wafer level image sensor mod...

Image sensor packaging structure with predetermined focal length

Image sensor package structure with large air cavity

Manufacturing method and structure of a wafer level image sensor mo...

Manufacturing method for molding image sensor package structure and...

Image sensor module with air escape hole and a method for manufactu...

Image sensor module with a protection layer and a method for manufa...

Method for packaging an image sensor

Image sensor module

Packaging structure of image sensor and method for packaging the same

Miniaturized image sensor

Package structure of an image sensor and packaging

Patents Applicationslast 30 patents

CHIP-SCALE SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

OPTICAL SENSOR

SENSOR PACKAGE STRUCTURE

STACK TYPE SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

OPTICAL PACKAGE STRUCTURE

TWO-STAGE PACKAGING METHOD OF IMAGE SENSORS

STRUCTURE AND MANUFACTURING METHOD FOR HIGH RESOLUTION CAMERA MODULE

METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...

MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WIT...

WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...

MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MOD...

WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...

MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MO...

IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT

IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH

MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...

IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY

IMAGE SENSOR PACKAGE STRUCTURE

IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME

Image sensor package structure and method for manufacturing the same

Image sensor package structure and method for manufacturing the same

Image sensor module with air escape hole and a method for manufactu...

Image sensor with a compound structure

Image sensor module with a protection layer and a method for manufa...

Image sensor module structure and a method for manufacturing the same