Hsueh-Chung Chen

Person

Cohoes, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual color via patterning
- Patent number 12,113,013
- Issue date Oct 8, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line single damascene top via spacer defined by pillar...
- Patent number 12,094,774
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic fuse structure embedded in top via
- Patent number 12,062,609
- Issue date Aug 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around projection liner for AI device
- Patent number 12,010,930
- Issue date Jun 11, 2024
- International Business Machines Corporation
- Injo Ok
Information Patent Grant
Circuit design watermarking
- Patent number 11,977,614
- Issue date May 7, 2024
- International Business Machines Corporation
- Carl Radens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Via CD controllable top via structure
- Patent number 11,923,246
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating spacers for pitch structure
- Patent number 11,908,732
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal interconnects for semiconductor device structures
- Patent number 11,817,389
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line formation with cut-first tip definition
- Patent number 11,798,842
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal via structure
- Patent number 11,784,120
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically-stacked interdigitated metal-insulator-metal capacitor f...
- Patent number 11,715,594
- Issue date Aug 1, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive via etch for MIMCAP
- Patent number 11,670,580
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip-via proximity interconnect
- Patent number 11,600,519
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non volatile resistive memory logic device
- Patent number 11,600,325
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer backside engineering for wafer stress control
- Patent number 11,569,134
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Nikhil Jain
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Reversible resistive memory logic gate device
- Patent number 11,489,111
- Issue date Nov 1, 2022
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Multiple patterning with mandrel cuts defined by block masks
- Patent number 11,417,525
- Issue date Aug 16, 2022
- GLOBALFOUNDRIES U.S. INC.
- Martin O'Toole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal on metal multiple patterning
- Patent number 11,398,378
- Issue date Jul 26, 2022
- GLOBALFOUNDRIES Inc.
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a BEOL interconnect structure using a subtractive...
- Patent number 11,398,409
- Issue date Jul 26, 2022
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi metal subtractive etch for trench and via formation
- Patent number 11,328,954
- Issue date May 10, 2022
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cut integration for subtractive first metal line with bottom up sec...
- Patent number 11,302,571
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Somnath Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple patterning scheme integration with planarized cut patterning
- Patent number 11,171,001
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-free vertical interconnect structure
- Patent number 11,164,778
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal via structure
- Patent number 11,152,298
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 11,133,216
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double metal double patterning with vias extending into dielectric
- Patent number 11,107,727
- Issue date Aug 31, 2021
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet clean solutions to prevent pattern collapse
- Patent number 11,094,527
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double replacement metal line patterning
- Patent number 11,087,993
- Issue date Aug 10, 2021
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large via buffer
- Patent number 11,075,161
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double metal patterning
- Patent number 11,069,564
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY STRUCTURE WITH NON-ION BEAM ETCHED MTJ AND TOP ELECTRODE
- Publication number 20240188447
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Chanro Park
- G11 - INFORMATION STORAGE
Information Patent Application
METAL VIA MULTI-LEVELS
- Publication number 20240153865
- Publication date May 9, 2024
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LEVELS WITH SKIP VIA AND DIELECTRIC LAYER
- Publication number 20240153864
- Publication date May 9, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM TOP ELECTRODE STRUCTURE WITH LINER LAYER
- Publication number 20240099148
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Application
SKIP VIA WITH LOCALIZED SPACER
- Publication number 20240071904
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO FORM CONNECTOR TABS IN SUBTRACTIVE PATTERNING
- Publication number 20240038547
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETORESISTIVE RANDOM-ACCESS MEMORY STRUCTURE
- Publication number 20230345841
- Publication date Oct 26, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY-STACKED INTERDIGITATED METAL-INSULATOR-METAL CAPACITOR F...
- Publication number 20230274883
- Publication date Aug 31, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH A LOW DIELECTRIC CONSTANT
- Publication number 20230197603
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Hsueh-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-METAL ULTRA THICK METAL (UTM) STRUCTURE
- Publication number 20230187350
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ALIGNMENT IN SINGLE DAMASCENE STRUCTURE
- Publication number 20230187278
- Publication date Jun 15, 2023
- International Business Machines Corporation
- CHANRO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE LINE WITH DAMASCENE TOP VIA
- Publication number 20230178421
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-DAMASCENE INTERCONNECT HAVING CONTROL OVER CORROSION, DIELEC...
- Publication number 20230170294
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL TOP VIA WIRINGS WITH DUAL DAMASCENE VIA AND SUPER VIA REDUNDANCY
- Publication number 20230170293
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSE STRUCTURE EMBEDDED IN TOP VIA
- Publication number 20230144660
- Publication date May 11, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA CONTAINING RANDOM-ACCESS MEMORY CROSS-BAR ARRAY
- Publication number 20230139648
- Publication date May 4, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY-ALIGNED AND DIELECTRIC DAMAGE-LESS TOP VIA INTERCONNECT STRUC...
- Publication number 20230134820
- Publication date May 4, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO PATTERN PITCH LINES
- Publication number 20230138978
- Publication date May 4, 2023
- International Business Machines Corporation
- CHANRO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARD MASK REMOVAL WITHOUT DAMAGING TOP EPITAXIAL LAYER
- Publication number 20230095956
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL COLOR VIA PATTERNING
- Publication number 20230100368
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
X-RAY SHIELDING STRUCTURE FOR A CHIP
- Publication number 20230088602
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE FORMATION WITH CUT-FIRST TIP DEFINITION
- Publication number 20230090983
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DESIGN WATERMARKING
- Publication number 20230090521
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Carl Radens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELF ALIGNED QUADRUPLE PATTERNING INTERCONNECTS
- Publication number 20230086420
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING SPACERS FOR PITCH STRUCTURE
- Publication number 20230080746
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CD CONTROLLABLE TOP VIA STRUCTURE
- Publication number 20230078008
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE SINGLE DAMASCENE TOP VIA SPACER DEFINED BY PILLAR...
- Publication number 20230085494
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND PROJECTION LINER FOR AI DEVICE
- Publication number 20230070462
- Publication date Mar 9, 2023
- International Business Machines Corporation
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE VIA ETCH FOR MIMCAP
- Publication number 20230063908
- Publication date Mar 2, 2023
- International Business Machines Corporation
- YANN MIGNOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METAL ETCH WITH IMPROVED ISOLATION FOR BEOL INTERCONNEC...
- Publication number 20220406704
- Publication date Dec 22, 2022
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS

Hsueh-Chung Chen

Person

Patents Grantslast 30 patents

Dual color via patterning

Back-end-of-line single damascene top via spacer defined by pillar...

Electronic fuse structure embedded in top via

Wrap-around projection liner for AI device

Circuit design watermarking

Via CD controllable top via structure

Alternating spacers for pitch structure

Multi-metal interconnects for semiconductor device structures

Line formation with cut-first tip definition

Metal via structure

Vertically-stacked interdigitated metal-insulator-metal capacitor f...

Subtractive via etch for MIMCAP

Skip-via proximity interconnect

Non volatile resistive memory logic device

Wafer backside engineering for wafer stress control

Reversible resistive memory logic gate device

Multiple patterning with mandrel cuts defined by block masks

Metal on metal multiple patterning

Method of forming a BEOL interconnect structure using a subtractive...

Bi metal subtractive etch for trench and via formation

Cut integration for subtractive first metal line with bottom up sec...

Multiple patterning scheme integration with planarized cut patterning

Barrier-free vertical interconnect structure

Metal via structure

Interconnect structure

Double metal double patterning with vias extending into dielectric

Wet clean solutions to prevent pattern collapse

Double replacement metal line patterning

Large via buffer

Double metal patterning

Patents Applicationslast 30 patents

MEMORY STRUCTURE WITH NON-ION BEAM ETCHED MTJ AND TOP ELECTRODE

METAL VIA MULTI-LEVELS

METALLIZATION LEVELS WITH SKIP VIA AND DIELECTRIC LAYER

MRAM TOP ELECTRODE STRUCTURE WITH LINER LAYER

SKIP VIA WITH LOCALIZED SPACER

METHOD AND STRUCTURE TO FORM CONNECTOR TABS IN SUBTRACTIVE PATTERNING

MAGNETORESISTIVE RANDOM-ACCESS MEMORY STRUCTURE

VERTICALLY-STACKED INTERDIGITATED METAL-INSULATOR-METAL CAPACITOR F...

ELECTRONIC DEVICES WITH A LOW DIELECTRIC CONSTANT

DUAL-METAL ULTRA THICK METAL (UTM) STRUCTURE

VIA ALIGNMENT IN SINGLE DAMASCENE STRUCTURE

SUBTRACTIVE LINE WITH DAMASCENE TOP VIA

SINGLE-DAMASCENE INTERCONNECT HAVING CONTROL OVER CORROSION, DIELEC...

BEOL TOP VIA WIRINGS WITH DUAL DAMASCENE VIA AND SUPER VIA REDUNDANCY

ELECTRONIC FUSE STRUCTURE EMBEDDED IN TOP VIA

TOP VIA CONTAINING RANDOM-ACCESS MEMORY CROSS-BAR ARRAY

FULLY-ALIGNED AND DIELECTRIC DAMAGE-LESS TOP VIA INTERCONNECT STRUC...

STRUCTURE AND METHOD TO PATTERN PITCH LINES

HARD MASK REMOVAL WITHOUT DAMAGING TOP EPITAXIAL LAYER

DUAL COLOR VIA PATTERNING

X-RAY SHIELDING STRUCTURE FOR A CHIP

LINE FORMATION WITH CUT-FIRST TIP DEFINITION

CIRCUIT DESIGN WATERMARKING

SELF ALIGNED QUADRUPLE PATTERNING INTERCONNECTS

ALTERNATING SPACERS FOR PITCH STRUCTURE

VIA CD CONTROLLABLE TOP VIA STRUCTURE

BACK-END-OF-LINE SINGLE DAMASCENE TOP VIA SPACER DEFINED BY PILLAR...

WRAP-AROUND PROJECTION LINER FOR AI DEVICE

SUBTRACTIVE VIA ETCH FOR MIMCAP

SUBTRACTIVE METAL ETCH WITH IMPROVED ISOLATION FOR BEOL INTERCONNEC...