Hsueh-Te Wang

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 11,955,423
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,017
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including EMI shielding structure and method...
- Patent number 10,978,406
- Issue date Apr 13, 2021
- Mediatek Inc.
- Hung-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor and manufacturing method thereof
- Patent number 10,056,463
- Issue date Aug 21, 2018
- United Microelectronics Corp.
- Su Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with coated bonding wires and fabrication met...
- Patent number 10,037,936
- Issue date Jul 31, 2018
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide semiconductor transistor and manufacturing method thereof
- Patent number 9,722,093
- Issue date Aug 1, 2017
- United Microelectronics Corp.
- Su Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 9,607,982
- Issue date Mar 28, 2017
- United Microelectronics Corp.
- Su Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test-key for checking interconnect
- Patent number 8,278,765
- Issue date Oct 2, 2012
- United Microelectronics Corp.
- Yeh-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test-key for checking interconnect and corresponding checking method
- Patent number 7,514,278
- Issue date Apr 7, 2009
- United Microelectronics Corp.
- Yeh-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a flip chip on a solder-resist leadframe
- Patent number 7,253,508
- Issue date Aug 7, 2007
- Advanced Semiconductor Engineering, Inc.
- Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat flip chip package and leadframe thereof
- Patent number 7,164,202
- Issue date Jan 16, 2007
- Advanced Semiconductor Engineering, Inc.
- Hsueh-Te Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip type quad flat package and leadframe
- Patent number 7,067,904
- Issue date Jun 27, 2006
- Advanced Semiconductor Engineering, Inc.
- Hsueh-Te Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type flip-chip package
- Patent number 7,034,388
- Issue date Apr 25, 2006
- Advanced Semiconductor Engineering, Inc.
- Chaur-Chin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat flip chip packaging process and leadframe therefor
- Patent number 7,022,551
- Issue date Apr 4, 2006
- Advanced Semiconductor Engineering, Inc.
- Hsueh-Te Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type flip-chip package
- Patent number 6,768,190
- Issue date Jul 27, 2004
- Advanced Semiconductor Engineering, Inc.
- Chaur-Chin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing polymer residues after tungsten etch back
- Patent number 6,534,415
- Issue date Mar 18, 2003
- United Microelectronics Corp.
- Hsueh-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a capacitor with high capacitance and low voltage...
- Patent number 6,489,196
- Issue date Dec 3, 2002
- United Electronics Corp.
- Ming-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing borderless contact leakage by OPC
- Patent number 6,451,680
- Issue date Sep 17, 2002
- United Microelectronics Corp.
- Hsueh-Wen Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of making stacked chip package
- Patent number 6,258,626
- Issue date Jul 10, 2001
- Advanced Semiconductor Engineering, Inc.
- Hsueh-Te Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor device with enhanced reliability and manufa...
- Patent number 6,153,939
- Issue date Nov 28, 2000
- Advanced Semiconductor Engineering, Inc.
- Wei-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method
- Publication number 20240250019
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230411318
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220223548
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220102269
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING EMI SHIELDING STRUCTURE AND METHOD...
- Publication number 20190019763
- Publication date Jan 17, 2019
- MEDIATEK INC.
- Hung-Jen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20180006129
- Publication date Jan 4, 2018
- UNITED MICROELECTRONICS CORP.
- Su Xing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20180006002
- Publication date Jan 4, 2018
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH COATED BONDING WIRES AND FABRICATION MET...
- Publication number 20170125327
- Publication date May 4, 2017
- MEDIATEK INC.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20120119342
- Publication date May 17, 2012
- MEDIATEK INC.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST-KEY FOR CHECKING INTERCONNECT AND CORRESPONDING CHECKING METHOD
- Publication number 20090065775
- Publication date Mar 12, 2009
- United Microelectronics Corp.
- Yeh-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST-KEY FOR CHECKING INTERCONNECT AND CORRESPONDING CHECKING METHOD
- Publication number 20070049049
- Publication date Mar 1, 2007
- Yeh-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip package substrate with a high-density layout
- Publication number 20050248037
- Publication date Nov 10, 2005
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT FLIP CHIP PACKAGE AND LEADFRAME THEREOF
- Publication number 20050156296
- Publication date Jul 21, 2005
- Hsueh-Te Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with a flip chip on a solder-resist leadframe
- Publication number 20050133896
- Publication date Jun 23, 2005
- Advanced Semiconductor Engineering, Inc.
- Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip type quad flat package and leadframe
- Publication number 20050104167
- Publication date May 19, 2005
- Hsueh-Te Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat flip chip packaging process and leadframe therefor
- Publication number 20050101053
- Publication date May 12, 2005
- Hsueh-Te Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack type flip-chip package
- Publication number 20040251531
- Publication date Dec 16, 2004
- Chaur-Chin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package
- Publication number 20040124541
- Publication date Jul 1, 2004
- Sung Mao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack type flip-chip package
- Publication number 20030141582
- Publication date Jul 31, 2003
- Chaur-Chin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip packaging device and method of manufacturing the...
- Publication number 20030071347
- Publication date Apr 17, 2003
- Hsueh-Te Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING BORDERLESS CONTACT LEAKAGE BY OPC
- Publication number 20020102750
- Publication date Aug 1, 2002
- Hsueh-Wen Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD OF REMOVING POLYMER RESIDUES AFTER TUNGSTEN ETCH BACK
- Publication number 20010053611
- Publication date Dec 20, 2001
- HSUEH-WEN WANG
- H01 - BASIC ELECTRIC ELEMENTS

Hsueh-Te Wang

Person

Patents Grantslast 30 patents

Semiconductor device and method

Semiconductor device and method

Semiconductor package including EMI shielding structure and method...

Semiconductor chip package with resilient conductive paste post and...

Transistor and manufacturing method thereof

Semiconductor package with coated bonding wires and fabrication met...

Oxide semiconductor transistor and manufacturing method thereof

Semiconductor device and method for fabricating the same

Test-key for checking interconnect

Test-key for checking interconnect and corresponding checking method

Semiconductor package with a flip chip on a solder-resist leadframe

Quad flat flip chip package and leadframe thereof

Flip-chip type quad flat package and leadframe

Stack type flip-chip package

Quad flat flip chip packaging process and leadframe therefor

Stack type flip-chip package

Method of removing polymer residues after tungsten etch back

Method of forming a capacitor with high capacitance and low voltage...

Method for reducing borderless contact leakage by OPC

Method of making stacked chip package

Flip-chip semiconductor device with enhanced reliability and manufa...

Patents Applicationslast 30 patents

Semiconductor Device and Method

Semiconductor Device and Method

Semiconductor Device and Method

Semiconductor Device and Method

SEMICONDUCTOR PACKAGE INCLUDING EMI SHIELDING STRUCTURE AND METHOD...

TRANSISTOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH COATED BONDING WIRES AND FABRICATION MET...

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

TEST-KEY FOR CHECKING INTERCONNECT AND CORRESPONDING CHECKING METHOD

TEST-KEY FOR CHECKING INTERCONNECT AND CORRESPONDING CHECKING METHOD

Flip-chip package substrate with a high-density layout

QUAD FLAT FLIP CHIP PACKAGE AND LEADFRAME THEREOF

Semiconductor package with a flip chip on a solder-resist leadframe

Flip-chip type quad flat package and leadframe

Quad flat flip chip packaging process and leadframe therefor

Stack type flip-chip package

Flip chip package

Stack type flip-chip package

Semiconductor chip packaging device and method of manufacturing the...

METHOD FOR REDUCING BORDERLESS CONTACT LEAKAGE BY OPC

METHOD OF REMOVING POLYMER RESIDUES AFTER TUNGSTEN ETCH BACK