Hsun-Wei CHAN

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Optical device including lid having first and second cavity with in...
- Patent number 12,094,995
- Issue date Sep 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device including lid having first and second cavity with in...
- Patent number 12,040,422
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and method of making the same
- Patent number 11,835,363
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- G01 - MEASURING TESTING
Information Patent Grant
Lid structure and semiconductor device package including the same
- Patent number 11,776,862
- Issue date Oct 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,588,081
- Issue date Feb 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device including lid having first and second cavity with in...
- Patent number 11,430,906
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and sensor package
- Patent number 11,296,025
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device and method of manufacturing the same
- Patent number 11,276,797
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsiang-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,276,806
- Issue date Mar 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and method of making the same
- Patent number 11,262,197
- Issue date Mar 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,910,532
- Issue date Feb 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device package and method of manufacturing the same
- Patent number 10,862,014
- Issue date Dec 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid structure and semiconductor device package including the same
- Patent number 10,804,173
- Issue date Oct 13, 2020
- Advanced Semiconductor Engineering, Inc.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,752,494
- Issue date Aug 25, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package including a wall and a grounding ring...
- Patent number 10,689,249
- Issue date Jun 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Ching-Han Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lid and an optical device package having the same
- Patent number 10,629,787
- Issue date Apr 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including cover including tilted inner...
- Patent number 10,526,200
- Issue date Jan 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Ching-Han Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical module and method of making the same
- Patent number 10,508,910
- Issue date Dec 17, 2019
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- G01 - MEASURING TESTING
Information Patent Grant
Lid array panel, package with lid and method of making the same
- Patent number 10,453,760
- Issue date Oct 22, 2019
- Advanced Semiconductor Engineering, Inc.
- Chang Chin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active optical component with passive optical component and encapsu...
- Patent number 10,436,635
- Issue date Oct 8, 2019
- Advanced Semiconductor Engineering, Inc.
- Yi Wen Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,424,566
- Issue date Sep 24, 2019
- Advanced Semiconductor Engineering, Inc.
- Chung-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module, manufacturing method thereof and electronic apparatus
- Patent number 10,396,783
- Issue date Aug 27, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei Chan
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package device
- Patent number 10,381,294
- Issue date Aug 13, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 10,347,570
- Issue date Jul 9, 2019
- ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG
- Hsun-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED packages and related methods
- Patent number 10,177,283
- Issue date Jan 8, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,069,051
- Issue date Sep 4, 2018
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, lid structure and package structure
- Patent number 9,881,845
- Issue date Jan 30, 2018
- Advanced Semiconductor Engineering, Inc.
- Yung-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package for reducing parasitic light and metho...
- Patent number 9,850,124
- Issue date Dec 26, 2017
- Advanced Semiconductor Engineering, Inc.
- Ching-Han Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
LED packages and related methods
- Patent number 9,653,656
- Issue date May 16, 2017
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor packages and related methods
- Patent number 8,637,887
- Issue date Jan 28, 2014
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20240237907
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh TANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
OPTICAL MODULE AND METHOD OF MAKING THE SAME
- Publication number 20240102799
- Publication date Mar 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL DEVICE
- Publication number 20220416111
- Publication date Dec 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang Chin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND METHOD OF MAKING THE SAME
- Publication number 20220187068
- Publication date Jun 16, 2022
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20210280755
- Publication date Sep 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210210662
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Yi Wen CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID STRUCTURE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING THE SAME
- Publication number 20210005522
- Publication date Jan 7, 2021
- Advanced Semiconductor Engineering, Inc.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200328322
- Publication date Oct 15, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsiang-Chen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200140262
- Publication date May 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Ching-Han HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL MODULE AND METHOD OF MAKING THE SAME
- Publication number 20200080841
- Publication date Mar 12, 2020
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL DEVICE
- Publication number 20200035851
- Publication date Jan 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Chang Chin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SENSOR PACKAGE
- Publication number 20200027834
- Publication date Jan 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20190202686
- Publication date Jul 4, 2019
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190181311
- Publication date Jun 13, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180315894
- Publication date Nov 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180190629
- Publication date Jul 5, 2018
- Advanced Semiconductor Engineering, Inc.
- Chung-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180072563
- Publication date Mar 15, 2018
- Advanced Semiconductor Engineering, Inc.
- Ching-Han HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170294560
- Publication date Oct 12, 2017
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170294564
- Publication date Oct 12, 2017
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ARRAY PANEL, PACKAGE WITH LID AND METHOD OF MAKING THE SAME
- Publication number 20170294361
- Publication date Oct 12, 2017
- Advanced Semiconductor Engineering, Inc.
- Chang Chin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGES AND RELATED METHODS
- Publication number 20170222093
- Publication date Aug 3, 2017
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20170221805
- Publication date Aug 3, 2017
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170138566
- Publication date May 18, 2017
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170113922
- Publication date Apr 27, 2017
- Advanced Semiconductor Engineering, Inc.
- Ching-Han HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LID STRUCTURE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING THE SAME
- Publication number 20170110426
- Publication date Apr 20, 2017
- Advanced Semiconductor Engineering, Inc.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE, ELECTRICAL DEVICE AND PASSIVE OPTICAL COMPONENT
- Publication number 20170082485
- Publication date Mar 23, 2017
- Advanced Semiconductor Engineering, Inc.
- Yi Wen CHIANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170073221
- Publication date Mar 16, 2017
- Advanced Semiconductor Engineering, Inc.
- Ching-Han Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL MODULE AND METHOD OF MAKING THE SAME
- Publication number 20160178366
- Publication date Jun 23, 2016
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS
- Publication number 20160146639
- Publication date May 26, 2016
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei CHAN
- G01 - MEASURING TESTING
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20130299960
- Publication date Nov 14, 2013
- Hsun-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS

Hsun-Wei CHAN

Person

Patents Grantslast 30 patents

Optical device including lid having first and second cavity with in...

Optical device including lid having first and second cavity with in...

Optical module and method of making the same

Lid structure and semiconductor device package including the same

Semiconductor device package

Optical device including lid having first and second cavity with in...

Interconnection structure and sensor package

Optical device and method of manufacturing the same

Semiconductor device package and method for manufacturing the same

Optical module and method of making the same

Semiconductor device package and method of manufacturing the same

Optical device package and method of manufacturing the same

Lid structure and semiconductor device package including the same

Semiconductor device package

Semiconductor device package including a wall and a grounding ring...

Lid and an optical device package having the same

Semiconductor device package including cover including tilted inner...

Optical module and method of making the same

Lid array panel, package with lid and method of making the same

Active optical component with passive optical component and encapsu...

Semiconductor package device and method of manufacturing the same

Optical module, manufacturing method thereof and electronic apparatus

Semiconductor package device

Semiconductor package device

LED packages and related methods

Semiconductor package device and method of manufacturing the same

Electronic device, lid structure and package structure

Semiconductor device package for reducing parasitic light and metho...

LED packages and related methods

Thermally enhanced semiconductor packages and related methods

Patents Applicationslast 30 patents

OPTICAL MODULE

OPTICAL MODULE AND METHOD OF MAKING THE SAME

OPTICAL DEVICE

OPTICAL MODULE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

LID STRUCTURE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING THE SAME

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

OPTICAL MODULE AND METHOD OF MAKING THE SAME

OPTICAL DEVICE

INTERCONNECTION STRUCTURE AND SENSOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

LID ARRAY PANEL, PACKAGE WITH LID AND METHOD OF MAKING THE SAME

LED PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGE DEVICE

OPTICAL DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

LID STRUCTURE AND SEMICONDUCTOR DEVICE PACKAGE INCLUDING THE SAME

OPTICAL DEVICE, ELECTRICAL DEVICE AND PASSIVE OPTICAL COMPONENT

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

OPTICAL MODULE AND METHOD OF MAKING THE SAME

OPTICAL MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS

THERMALLY ENHANCED SEMICONDUCTOR PACKAGES AND RELATED METHODS